Passively deployable thermal management devices, systems, and methods
Passively deployable thermal management devices, systems, and methods are provided in accordance with various embodiments. For example, some embodiments include a passively deployable radiator device that may include: one or more thermally conductive layers; and/or one or more strain energy components configured to deploy passively the one or more thermally conductive layers. The one or more thermally conductive layers may include one or more carbon layers. The one or more carbon layers may include at least one or more graphite layers or one or more graphene layers. At least the one or more graphite layers or the one or more graphene layers include at least one or more pyrolytic graphite sheets or one or more pyrolytic graphene sheets.
1. A passively deployable radiator device comprising:
a plurality of thermally conductive layers, wherein the plurality of thermally conductive layers include a plurality of stacked carbon layers configured such that:
a first portion of each of the stacked carbon layers from the plurality of stacked carbon layers are bonded with one another to form a radiator;
a second portion of each the stacked carbon layers from the plurality of stacked carbon layers remain unbonded from one another to form a hinge region; and
a third portion of each of the stacked carbon layers from the plurality of stacked carbon layers are bonded with one another to form a hub region positioned such that the hinge region separates the hub region from the radiator; and
one or more strain energy components configured to deploy passively the plurality of thermally conductive layers.
2. The device of claim 1 , wherein the plurality of stacked carbon layers include at least one or more graphite layers or one or more graphene layers.
3. The device of claim 2 , wherein at least the one or more graphite layers or the one or more graphene layers include at least one or more pyrolytic graphite sheets or one or more pyrolytic graphene sheets.
4. The device of claim 1 , wherein the one or more strain energy components include one or more composite components coupled with the one or more thermally conductive layers.
5. The device of claim 4 , wherein the one or more composite components are configured with one or more curved hinge regions when deployed.
6. The device of claim 4 , wherein the one or more composite components include one or more composite battens coupled with a side portion of the one or more thermally conductive layers.
7. The device of claim 4 , wherein the one or more composite components include an asymmetric composite laminate configured to change shape when a change in temperature.
8. The device of claim 1 , wherein the one or more strain energy components include one or more thermally conductive composite laminates with sufficient strain energy to deploy passively the plurality of thermally conductive layers.
9. The device of claim 8 , wherein the one or more thermally conductive composite laminates includes one or more laminate layers.
10. The device of claim 1 , wherein the one or more strain energy components include one or more tape springs configured to deploy passively the one or more thermally conductive layers.
11. The device of claim 10 , wherein the one or more tape springs include a beryllium-copper structure.
12. The device of claim 10 , wherein the one or more tape springs include a composite material.
13. The device of claim 1 , wherein the first portion of each of the stacked carbon layers from the plurality of stacked carbon layers are bonded with one another to form the radiator utilizing an adhesive and the third portion of each of the stacked carbon layers from the plurality of stacked carbon layers are bonded with one another to form the hub region utilizing adhesive.
14. The device of claim 1 , wherein the first portion of each of the stacked carbon layers from the plurality of stacked carbon layers are bonded with one another to form the radiator utilizing diffusion bonding and the third portion of each of the stacked carbon layers from the plurality of stacked carbon layers are bonded with one another to form the hub region utilizing diffusion bonding wherein one or more metal layers are positioned between the plurality of thermally conductive layers.
15. The device of claim 1 , wherein plurality of thermally conductive layers are encapsulated.
16. The device of claim 1 , wherein the plurality of thermally conductive layers are continuous across the hinge region defined with respect to the one or more strain energy components.
17. The device of claim 1 , further comprising one or more coatings applied to one or more surfaces of the plurality of thermally conductive layers or the one or more strain energy components.
18. The device of claim 1 , further comprising a base spool coupled with at least the plurality of thermally conductive layers or the one or more strain energy components.
19. The device of claim 18 , wherein the base spool is configured to couple thermally at least the plurality of thermally conductive layers with one or more heat sources.
20. The device of claim 19 , wherein the plurality of thermally conductive layers are coupled with the base spool such that the plurality of thermally conductive layers deploy passively through unfurling from around a central axis of the base spool from a stowed configuration to a deployed configuration.
21. The device of claim 1 , wherein the plurality of stacked carbon layers include one or more carbon fiber plies.
22. The device of claim 21 , wherein the one or more strain energy components include one or more laminates coupled with the one or more carbon fiber plies.
23. The device of claim 2 , wherein at least the one or more graphite layers or the one or more graphene layers include a plurality of layers that are stitched together utilizing a stitching material.
24. The device of claim 23 , wherein the stitching material includes at least CNT yarn or copper wire.