Optical subassembly, optical module, and optical transmission equipment
View Patent ↗An optical subassembly includes: a conductor plate having a pair of penetration holes, both penetrating the conductor plate from an outer surface to an inner surface; a pair of lead terminals fixed in the two respective penetration holes and passing through the pair of penetration holes; a wiring board with a pair of wiring patterns arranged on a surface; and a plurality of bonding wires electrically connecting the pair of lead terminals and the pair of wiring patterns. A cross section of the pair of lead terminals on the inner surface side is larger than a cross section on the outer surface side. End faces on the inner surface side are situated within a range from +180 μm to −100 μm to the inner side from the inner surface of the conductor plate in a direction perpendicular to the inner surface.
1. An optical subassembly comprising:
a conductor plate having a pair of penetration holes, both penetrating the conductor plate from an outer surface to an inner surface;
a pair of lead terminals fixed in the two respective penetration holes by a dielectric and passing through the pair of penetration holes from the outer surface to the inner surface;
a wiring board with a pair of wiring patterns arranged on a surface thereof;
a plurality of bonding wires electrically connecting the pair of lead terminals and the pair of wiring patterns; and
a pedestal section arranged protruding from the inner surface of the conductor plate,
wherein a cross section of the pair of lead terminals at an end part on an inner surface side is larger than a cross section at an end part on an outer surface side,
wherein end faces on the inner surface side of the pair of lead terminals are situated within a range of +180 μm to −100 μm from the inner surface of the conductor plate in a direction perpendicular to the inner surface,
wherein the wiring board is arranged on a top surface of the pedestal section,
wherein the plurality of bonding wires directly connect the end faces on the inner surface side of the pair of lead terminals and the pair of wiring patterns, and
wherein a plane defined by flat surfaces of the pair of wiring patterns on the wiring board intersects a plane defined by the end faces on the inner surface side of the pair of lead terminals.
2. The optical subassembly according to claim 1 , wherein
three or more of the bonding wires connect one of the pair of lead terminals and one of the pair of wiring patterns.
3. The optical subassembly according to claim 2 , wherein
the three or more bonding wires spread from a site connected to the end face on the inner surface side of the one of the pair of lead terminals and are connected to the one of the pair of wiring patterns.
4. The optical subassembly according to claim 1 , wherein
the plurality of bonding wires connecting one of the pair of lead terminals and one of the pair of wiring patterns are ribbon wires.
5. The optical subassembly according to claim 1 , further comprising:
an optical semiconductor device arranged on the wiring board,
wherein the pair of wiring patterns connects to each of a pair of electrodes of the optical semiconductor device and each spreads and extends from a connection site with the optical semiconductor device to a connection site with the plurality of bonding wires, as viewed in a plan view.
6. The optical subassembly according to claim 1 , wherein
the wiring board is configured of a relay board to which the plurality of bonding wires are connected and a second wiring board electrically connected to the relay board.
7. The optical subassembly according to claim 6 , further comprising:
an optical semiconductor device arranged on the second wiring board.
8. An optical module comprising the optical subassembly according to claim 1 .
9. An optical transmission equipment equipped with the optical module according to claim 8 .