IP Library Patent Application 15957002
Patent Application
App. No. 15/957,002

CORTICAL PROCESSING WITH THERMODYNAMIC RAM

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Patent No.
US None
App. No.
15/957,002
Abstract

A thermodynamic RAM apparatus includes a physical substrate of addressable adaptive synapses that are temporarily partitioned to emulate adaptive neurons of arbitrary sizes, wherein the physical substrate mates electronically with a digital computing platform for high-throughput and low-power neuromorphic adaptive learning applications. The physical substrate addressable adaptive synapses can be configured as a part of a memristor-based physical neural processing unit.

Claims (29)

1 . (canceled)

2 . (canceled)

3 . (canceled)

4 . (canceled)

5 . (canceled)

6 . (canceled)

7 . (canceled)

8 . A thermodynamic RAM apparatus, comprising:

a plurality of thermodynamic cores; and

a plurality of common read out electrodes, wherein each thermodynamic core among said plurality of thermodynamic cores comprises a physical substrate comprising at least one memristor that is selectively coupled to said at least one common read-out electrode among said plurality of common read-out electrodes, and wherein said physical substrate provides a synaptic integration and a learning resource for a digital computing platform.

9 . The apparatus of claim 8 wherein said at least one memristor comprises an addressable adaptive synapse.

10 . The apparatus of claim 8 wherein said digital computing platform comprises a CPU (Central Processing Unit) that communicates electronically with said plurality of thermodynamic cores.

11 . The apparatus of claim 8 wherein said digital computing platform includes at least one PCI bus that communicates electronically with said plurality of thermodynamic cores.

12 . The apparatus of claim 8 wherein said digital computing platform includes at least one LPC bus that communicates electronically with said plurality of thermodynamic cores.

13 . The apparatus of claim 8 wherein said digital computing platform includes at least one North Bridge that communicates electronically with said plurality of thermodynamic cores.

14 . The thermodynamic RAM apparatus of claim 8 wherein said each thermodynamic core is emulated with digital electronics.

15 . A thermodynamic RAM apparatus, comprising:

a plurality of thermodynamic cores; and

a plurality of common read out electrodes, wherein each thermodynamic core among said plurality of thermodynamic cores comprises a physical substrate comprising at least one transistor that is selectively coupled to said at least one common read-out electrode among said plurality of common read-out electrodes, and wherein said physical substrate provides a synaptic integration and a learning resource for a digital computing platform.

16 . The apparatus of claim 15 further comprising an addressable adaptive synapse that comprises said at least one transistor.

17 . The apparatus of claim 15 herein said digital computing platform comprises a CPU (Central Processing Unit) that communicates electronically with said, plurality of thermodynamic cores.

18 . The apparatus of claim 15 wherein said digital computing platform includes at least one PCI bus that communicates electronically with said plurality of thermodynamic cores.

19 . The apparatus of claim 15 wherein said digital computing platform includes at least one LPC bus that communicates electronically with said plurality of thermodynamic cores.

20 . The apparatus of claim 15 wherein said digital computing, platform includes at least one North Bridge that communicates electronically with said plurality of thermodynamic cores.

21 . The thermodynamic RAM apparatus of claim 15 wherein said each thermodynamic core is emulated with digital electronics.

22 . The thermodynamic RAM apparatus of claim 23 wherein said addressable adaptive synapse is configured as a part of a memristor-based physical neural processing unit.

23 . A thermodynamic RAM apparatus, comprising:

a plurality of thermodynamic cores; and

a plurality of common read out electrodes, wherein each thermodynamic core among said plurality of thermodynamic cores comprises a physical substrate comprising an addressable adaptive synapse comprising at least one memristor and/or at least one transistor that is selectively coupled to said at least one common read-out electrode among said plurality of common read-out electrodes, and wherein said physical substrate provides a synaptic integration and a learning resource for a digital computing platform.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2019
From: NUGENT, ALEX; MOLTER, TIM
To: KNOWMTECH, LLC
Reel/Frame 049770/0412 →