Methods and apparatus for phase selection in ring magnet sensing
Methods and apparatus for positioning a magnetic field sensor IC package having a first channel for a planar magnetic field sensing element and a second channel for vertical magnetic field sensing element in relation to an axis of a ring magnet to provide a desired phase relationship between the first and second channels. In embodiments, positioning the sensor includes an offset angle and a displacement with respect to a centerline of the ring magnet.
1. A method, comprising:
for a magnetic field sensor IC package having a first channel for a planar magnetic field sensing element and a second channel for a vertical magnetic field sensing element, receiving a desired phase relationship between the first and second channels; and
positioning the IC package in relation to an axis of a ring magnet to provide the desired phase relationship between the first and second channels.
2. The method according to claim 1 , further including positioning the IC package to a non-zero twist angle with respect to the axis and a non-zero displacement with respect to the axis.
3. The method according to claim 1 , wherein the axis corresponds to a centerline of the ring magnet.
4. The method according to claim 3 , wherein the centerline corresponds to one-half a width of the ring magnet.
5. The method according to claim 1 , wherein the desired phase relationship is approximately 120 degrees.
6. The method according 1 , wherein the desired phase relationship is approximately 60 degrees.
7. The method according to claim 1 , further including displacing the IC package position a distance from an axis of rotation of the ring magnet.
8. The method according to claim 1 , wherein the IC package has a longitudinal axis defined by being parallel to a sensing direction of the first sensing element, wherein the twist angle is defined by the longitudinal axis of the IC package and a centerline of the ring magnet.
9. The method according to claim 1 , further including determining an offset angle with relation to the axis based upon the desired phase relationship.
10. The method according to claim 9 , wherein positioning the IC package in relation to an axis of a ring magnet to provide the desired phase relationship between the first and second channels comprises positioning the IC package in relation to the axis according to the determined offset angle.
11. The method according to claim 1 , wherein a substantially planar face of the IC package defines an air gap with a surface of the ring magnet.
12. The method according to claim 1 , wherein the planar magnetic field sensing element and the vertical magnetic field sensing element are formed as part of a single die.
13. The method according to claim 1 , wherein the planar magnetic field sensing element and the vertical magnetic field sensing element are substantially collocated.
14. The method according to claim 1 , further including positioning the IC package to lessen sensitivity to mechanical tolerances.
15. The method according to claim 1 , wherein the first sensing element comprises a Hall element.
16. An apparatus, comprising:
a ring magnet; and
a magnetic field sensor IC package positioned in relation to a ring magnet to achieve a desired phase relationship between a first channel for a planar magnetic field sensing element and a second channel for a vertical magnetic field sensing element.
17. The apparatus according to claim 16 , wherein the IC package is positioned to a non-zero twist angle with respect to the axis and a non-zero displacement with respect to the axis.
18. The apparatus according to claim 16 , wherein the axis corresponds to a centerline of the ring magnet.
19. The apparatus according to claim 18 , wherein the centerline corresponds to one half a width of the ring magnet.
20. The apparatus according to claim 16 , wherein the desired phase relationship is about 120 degrees.
21. The apparatus according 16 , wherein the desired phase relationship is about 60 degrees.
22. The apparatus according to claim 16 , wherein the IC package is positioned a distance from an axis of rotation of the ring magnet.
23. The apparatus according to claim 16 , wherein the IC package has a longitudinal axis defined by being perpendicular to a sensing direction of the first sensing element, wherein the twist angle is defined by the longitudinal axis of the IC package and the centerline of the ring magnet.
24. The apparatus according to claim 16 , wherein a substantially planar face of the IC package defines an air gap with a surface of the ring magnet.
25. The apparatus according to claim 16 , wherein the planar magnetic field sensing element and the vertical magnetic field sensing element are formed as part of a single die.
26. The apparatus according to claim 16 , wherein the planar magnetic field sensing element and the vertical magnetic field sensing element are substantially collocated.
27. The apparatus according to claim 16 , wherein the IC package is positioned to lessen sensitivity to mechanical tolerances.