Lens driving system and circuit module thereof
A circuit module is provided and includes a metal substrate, an insulating layer, and a circuit element. The metal substrate includes a main body, a bent portion and an opening. The opening is formed between the main body and the bent portion, and the bent portion is bent relative to the main body. The insulating layer is disposed on the metal substrate. The circuit element is disposed on the insulating layer and is extended across the opening.
1. A circuit module, comprising:
a metal substrate, comprising a main body, a bent portion and an opening, wherein the opening is formed between the main body and the bent portion, and the bent portion is bent relative to the main body;
an insulating layer, disposed on the metal substrate; and
a circuit element, disposed on the insulating layer and extended across the opening.
2. The circuit module as claimed in claim 1 , wherein the circuit module further comprises a protecting layer which covers the circuit element.
3. The circuit module as claimed in claim 1 , wherein the circuit module further comprises a circuit board, the circuit board comprises a first coil, and the circuit board is disposed on the metal substrate using surface mount technology.
4. The circuit module as claimed in claim 3 , wherein the circuit board comprises a first contact, the metal substrate comprises a second contact, the first contact is electrically connected to the first coil, and the first contact and the second contact are electrically connected to each other via solder.
5. The circuit module as claimed in claim 4 , wherein the circuit board comprises a first metal pad, the metal substrate comprises a second metal pad, and the first metal pad and the second metal pad are connected to each other via solder.
6. The circuit module as claimed in claim 5 , wherein the first metal pad or the second metal pad has a circular structure.
7. The circuit module as claimed in claim 4 , wherein the first contact or the second contact has a circular structure.
8. The circuit module as claimed in claim 1 , wherein the area of the insulating layer is larger than the area of the circuit element.
9. The circuit module as claimed in claim 1 , wherein the circuit module further comprises a circuit board, and the area of the insulating layer is larger than the area of the circuit board.
10. A lens driving system, for driving a lens unit, and the lens driving system comprising:
a circuit module as claimed in claim 1 ;
a frame, movably containing the lens unit; and
a lens driving assembly, comprising a second coil and a magnetic element corresponding to the second coil, configured to drive the lens unit to move along an optical axis of the lens unit relative to the frame;
wherein the second coil is electrically connected to the metal substrate, and the first coil and the second coil are disposed on the same side of the metal substrate.
11. The lens driving system as claimed in claim 10 , wherein the lens driving system further comprises a damping element, which connects the frame with the circuit module.
12. The lens driving system as claimed in claim 10 , wherein the lens driving system further comprises a resilient element, and a through hole and an electrical connecting portion are formed on the metal substrate, wherein the electrical connecting portion is disposed inside the through hole, and the resilient element is extended through the through hole and is electrically connected to a wire on the insulating layer via the electrical connecting portion.
13. The lens driving system as claimed in claim 10 , wherein the lens driving system further comprises a metal cover, and the metal cover and the metal substrate are welded to each other.
14. The lens driving system as claimed in claim 10 , wherein the circuit module further comprises a protecting layer which covers the circuit element.
15. The lens driving system as claimed in claim 10 , wherein the circuit module further comprises a circuit board, the circuit board comprises a first coil, and the circuit board is disposed on the metal substrate using surface mount technology.
16. The lens driving system as claimed in claim 15 , wherein the circuit board comprises a first contact, the metal substrate comprises a second contact, the first contact is electrically connected to the first coil, and the first contact and the second contact are electrically connected to each other via solder.
17. The lens driving system as claimed in claim 16 , wherein the circuit board comprises a first metal pad, the metal substrate comprises a second metal pad, and the first metal pad and the second metal pad are connected to each other via solder.
18. The lens driving system as claimed in claim 17 , wherein the first metal pad or the second metal pad has a circular structure.
19. The lens driving system as claimed in claim 16 , wherein the first contact or the second contact has a circular structure.
20. The lens driving system as claimed in claim 10 , wherein the area of the insulating layer is larger than the area of the circuit element.