Method for expanding spacings in light-emitting element array

1. A method for expanding spacings in a light-emitting element array, comprising:

providing a light-emitting element array unit including a stretchable supporting film, and a plurality of light-emitting elements disposed on the stretchable supporting film and arranged into a two-dimensional array, wherein the stretchable supporting film is formed with a plurality of through holes only located between adjacent two light-emitting elements;

stretching the stretchable supporting film along a first direction and a second direction so as to expand spacings between the light-emitting elements, wherein the first direction and the second direction respectively correspond to a row direction and a column direction of the two-dimensional array;

attaching a surface of each of the light-emitting elements onto a package substrate; and

removing the stretchable supporting film therefrom, wherein the surface of each of the light-emitting elements is away from the stretchable supporting film.

2. The method of claim 1 , wherein the step of stretching the stretchable supporting film is conducted by stretching the stretchable supporting film along the first direction followed by stretching the stretchable supporting film along the second direction.

3. The method of claim 1 , wherein the step of stretching the stretchable supporting film is conducted by simultaneously stretching the stretchable supporting film along the first and second directions.

4. The method of claim 1 , wherein the stretchable supporting film is formed with a plurality of through holes corresponding in position to the light-emitting elements.

5. The method of claim 4 , wherein each of the light-emitting elements is configured into a geometric shape and has at least three corners, the through holes corresponding in position to the corners of the light-emitting elements.

6. The method of claim 4 , wherein each of the light-emitting elements is configured into a geometric shape and has at least three sides each having a midpoint, the through holes corresponding in position to the midpoints of the sides of the light-emitting elements.

7. The method of claim 4 , wherein the stretchable supporting film has a plurality of first imaginary lines each located equidistantly between two adjacent rows of the light-emitting elements, and a plurality of second imaginary lines each located equidistantly between two adjacent columns of the light-emitting elements, the through holes being formed on the first and second imaginary lines of the stretchable supporting film.

8. The method of claim 7 , wherein the through holes of the stretchable supporting film are formed at intersections of the first and the second imaginary lines.

9. The method of claim 1 , wherein the removal of the stretchable supporting film from the light-emitting elements is conducted by irradiating the stretchable supporting film with a light having a predetermined wavelength, so as to reduce adhesion strength between the stretchable supporting film and the light-emitting elements.

10. The method of claim 1 , wherein the removal of the stretchable supporting film from the light-emitting elements is conducted by heating the stretchable supporting film so as to reduce adhesion strength between the stretchable supporting film and the light-emitting elements.

11. The method of claim 1 , wherein the package substrate is one of a printed circuit board, a TFT substrate, and a CMOS substrate.

12. The method of claim 1 , wherein the through holes are distributed in the spacings.

13. The method of claim 1 , wherein the through holes are equidistant from adjacent two of the light-emitting elements when stretching the stretchable supporting film.