IP Library Granted Patent US 10,739,831
Granted Patent B2
US 10,739,831 · App. 15/961,287 · Granted Aug 11, 2020

Card-based extension cooling

Inventors: Hasnain Shabbir (Round Rock, TX); Dominick A. Lovicott (Jarrell, TX)
Assignee: Dell Products L.P.
G06F1/20F04D19/002G06F1/186H05K7/20145H05K7/20154H05K7/20172G06F2200/201
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Quick Facts
Patent No.
US 10,739,831
App. No.
15/961,287
Granted
Aug 11, 2020
Kind
B2
Abstract

An information handling system may include a circuit board that includes a plurality of expansion slots. The information handling system may further include a cooling card coupled to at least one of the plurality of expansion slots, and a processor coupled to the circuit board (but where the cooling card does not contain the processor). Further, the processor may include a heat exchanger coupled thereto. The cooling card may include a heatsink, and a fluid channel thermally coupled to the heatsink, the fluid channel being fluidically coupled to the heat exchanger.

Claims (32)

1. An information handling system comprising:

a power supply unit;

a circuit board that includes a plurality of expansion slots;

a cooling card coupled to at least one of the plurality of expansion slots; and

a processor coupled to the circuit board, wherein the processor includes a heat exchanger coupled thereto, and wherein the cooling card does not comprise the processor;

wherein the cooling card includes:

a fan on a heatsink configured to transfer heat away from the information handling system;

a fluid channel thermally coupled to the heatsink, the fluid channel being fluidically coupled to the heat exchanger via a pump;

a power connector configured to couple to the power supply unit; and

an edge connector configured to mechanically couple to the at least one of the plurality of expansion slots, wherein the edge connector does not include electrical contacts thereon;

wherein the fan and the pump are configured to receive power via the power connector.

2. The information handling system of claim 1 , wherein the cooling card is a Peripheral Component Interconnect Express (PCIe) card.

3. The information handling system of claim 2 , wherein the cooling card is a double-width PCIe card.

4. The information handling system of claim 1 , wherein the cooling card does not include any processors.

5. The information handling system of claim 1 , wherein the circuit board is a motherboard.

6. The information handling system of claim 1 , wherein the processor is a circuit selected from the group consisting of central processing units (CPUs) and graphics processing units (GPUs).

7. The information handling system of claim 1 , wherein the information handling system includes another information handling resource having another heat exchanger, and wherein the fluid channel is fluidically coupled to the another heat exchanger.

8. A method comprising:

coupling a cooling card that includes a fan on a heatsink configured to transfer heat away from an information handling system to an expansion slot of a circuit board of the information handling system, wherein the cooling card includes an edge connector that mechanically couples to the expansion slot, and wherein the edge connector does not include electrical contacts thereon, wherein the circuit board includes a processor, wherein the cooling card does not comprise the processor, and wherein the processor includes a heat exchanger;

fluidically coupling a fluid channel of the heatsink to the heat exchanger via a pump; and

providing power to the fan and the pump from a power supply unit of the information handling system via a power connector of the cooling card.

9. The method of claim 8 , wherein the fluidically coupling includes coupling via at least one quick-connect fluid fitting.

10. An apparatus comprising:

a cooling card configured to be accepted by an expansion slot of an information handling system, wherein the information handling system includes a power supply unit and a motherboard having a processor thereon, wherein the cooling card does not comprise the processor;

wherein the cooling card includes:

an edge connector configured to mechanically couple to the expansion slot, wherein the edge connector does not include electrical contacts thereon;

a fan on a heatsink configured to transfer heat away from the information handling system;

a fluid channel thermally coupled to the heatsink, the fluid channel being fluidically coupled, via a pump, to a heat exchanger that is configured to couple to the processor; and

a power connector configured to couple to the power supply unit;

wherein the fan and the pump are configured to receive power via the power connector.

11. The apparatus of claim 10 , wherein the cooling card does not include any integrated circuits.

12. The apparatus of claim 10 , wherein the cooling card does not include a second processor.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (046366/0014) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060450/0306 →
RELEASE OF SECURITY INTEREST AT REEL 046286 FRAME 0653 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0093 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 046286/0653 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 046366/0014 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2018
From: SHABBIR, HASNAIN; LOVICOTT, DOMINICK A.
To: DELL PRODUCTS L.P.
Reel/Frame 045624/0337 →
Continuity (1)
Related Publication 20190324506A1 · Oct 24, 2019
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