IP Library Granted Patent US 10,264,672
Granted Patent B2
US 10,264,672 · App. 15/962,076 · Granted Apr 16, 2019

Glass substrate and glass substrate for high frequency device

Inventors: Shigetoshi Mori (Chiyoda-ku, JP); Motoshi Ono (Chiyoda-ku, JP); Mamoru Isobe (Chiyoda-ku, JP); Kohei Horiuchi (Chiyoda-ku, JP)
Assignee: AGC Inc.
H05K1/0306H05K1/115
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Quick Facts
Patent No.
US 10,264,672
App. No.
15/962,076
Granted
Apr 16, 2019
Kind
B2
Abstract

A glass substrate includes a plurality of through holes that penetrate from a first surface to a second surface of the glass substrate. Each through hole has an upper aperture with a first diameter on the first surface and a lower aperture with a second diameter on the second surface. For each of ten through holes selected from the plurality of through holes, a side wall length is obtained from the first and second diameters and the thickness of the glass substrate, and an R value is obtained by dividing the side wall length by the thickness of the glass substrate. The R values fall within a range of 1 to 1.1. A B value, obtained from dividing a difference between the greatest R value and the smallest R value by an average of the R values followed by multiplication with 100, is 5% or less.

Claims (137)

1. A glass substrate comprising:

a first surface;

a second surface; and

a plurality of through holes that penetrate from the first surface to the second surface,

wherein each of the through holes has an upper aperture with a diameter ϕ 1 on the first surface, and a lower aperture with a diameter ϕ 2 on the second surface,

wherein selected through holes are ten through holes randomly selected from the plurality of through holes,

wherein a straight type through hole is a selected through hole, in which a constricted part with a diameter being less than a smaller diameter from among the diameter ϕ 1 and the diameter ϕ 2 is absent, and

an X-type through hole is a selected through hole, in which a constricted part with a diameter ϕ 3 being less than a smaller diameter from among the diameter ϕ 1 and the diameter ϕ 2 is present,

wherein, for each of the selected through holes, in a cross section of the selected through hole cut along an axis of expansion of the selected through hole, an approximated length L of a side wall is

[

Math

1

]

L

=

t

2

+

(

ϕ

1

-

ϕ

2

2

)

2

formula

(

1

)

when the selected through hole is a straight type through hole, and

[

Math

2

]

L

=

(

t

2

)

2

+

(

ϕ

1

-

ϕ

3

2

)

2

+

(

t

2

)

2

+

(

ϕ

2

-

ϕ

3

2

)

2

formula

(

2

)

when the selected through hole is an X-type through hole, where t is a thickness of the glass substrate,

wherein R values each expressed by a ratio of the approximate length of the side wall to the thickness of the glass substrate, L/t, fall within a range of 1 to 1.1, and

wherein a B value obtained by

[

Math

3

]

B

=

R

max

-

R

min

R

ave

×

100

formula

(

3

)

where R ave is an average of the R values of the selected through holes, R max is a maximum of the R values of the selected through holes, and R min is a minimum of the R values of the selected through holes, is 5% or less.

2. The glass substrate according to claim 1 ,

wherein the B value is 2% or less.

3. The glass substrate according to claim 1 ,

wherein the R values fall within a range of 1 to 1.05.

4. The glass substrate according to claim 1 ,

wherein the thickness of the glass substrate falls within a range of 0.05 mm to 0.8 mm.

5. The glass substrate according to claim 1 ,

wherein the diameter ϕ 1 falls within a range of 10 μm to 200 μm, and

wherein the diameter ϕ 2 falls within a range of 5 μm to 150 μm.

6. The glass substrate according to claim 2 ,

wherein the R values fall within a range of 1 to 1.05.

7. The glass substrate according to claim 2 ,

wherein the thickness of the glass substrate falls within a range of 0.05 mm to 0.8 mm.

8. The glass substrate according to claim 2 ,

wherein the diameter ϕ 1 falls within a range of 10 μm to 200 μm, and

wherein the diameter ϕ 2 falls within a range of 5 μm to 150 μm.

9. The glass substrate according to claim 3 ,

wherein the thickness of the glass substrate falls within a range of 0.05 to 0.8 mm.

10. The glass substrate according to claim 3 ,

wherein the diameter ϕ 1 falls within a range of 10 μm to 200 μm, and

wherein the diameter ϕ 2 falls within a range of 5 μm to 150 μm.

11. The glass substrate according to claim 4 ,

wherein the diameter ϕ 1 falls within a range of 10 μm to 200 μm, and

wherein the diameter ϕ 1 falls within a range of 5 μm to 150 μm.

12. A glass substrate for a high frequency device, comprising:

the glass substrate according to claim 1 .

Assignments (2)
CHANGE OF NAME Recorded Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2018
From: MORI, SHIGETOSHI; ONO, MOTOSHI; ISOBE, MAMORU; HORIUCHI, KOHEI
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 045630/0910 →
Priority Claims (1)
JP 2017-090675 · Apr 28, 2017 · national
Continuity (1)
Related Publication 20180317319A1 · Nov 1, 2018