IP Library Patent Application 15970283
Patent Application
App. No. 15/970,283

REMOVABLE BUILD MODULES FOR ADDITIVE FABRICATION

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Quick Facts
Patent No.
US None
App. No.
15/970,283
Abstract

Techniques for producing removable build modules for additive fabrication devices are described. According to some aspects, a removable build module may comprise an enclosure having an open top, a fabrication platform arranged in an interior of the enclosure, and at least one actuator incorporated into the enclosure and configured to move the fabrication platform towards and away from the open top of the enclosure.

Claims (16)

1 . A removable build module for an additive fabrication device configured to fabricate objects by forming layers of solid material from a source material, the removable build module comprising:

an enclosure having an open top;

a fabrication platform arranged in an interior of the enclosure; and

at least one actuator incorporated into the enclosure and configured to move the fabrication platform towards and away from the open top of the enclosure.

2 . The removable build module of claim 1 , further comprising a leadscrew and wherein the at least one actuator includes a source of rotational motion coupled to the leadscrew.

3 . The removable build module of claim 1 , further comprising at least one heater.

4 . The removable build module of claim 1 , further comprising at least one temperature sensor.

5 . The removable build module of claim 4 , further comprising:

at least one heater; and

at least one controller configured to adjust an amount of heat produced by the at least one heater based at least in part on an indication of temperature produced by the at least one temperature sensor.

6 . The removable build module of claim 1 , further comprising one or more sensors configured to generate an indication of the fabrication platform's position.

7 . The removable build module of claim 1 , further comprising one or more rails attached to an exterior of the enclosure.

8 . The removable build module of claim 1 , further comprising one or more connection points that include an opening through the enclosure.

9 . The removable build module of claim 8 , wherein at least a first connection point of the one or more connection points includes an electrical connector coupled to at least one electrical component of the removable build module.

10 . The removable build module of claim 1 , wherein the fabrication platform includes a planar upper surface extending across the interior of the enclosure.

11 . The removable build module of claim 1 , further comprising one or more guide rails arranged to guide the fabrication platform as the fabrication platform moves towards and away from the open top of the enclosure.

Assignments (2)
SECURITY INTEREST Recorded Jan 29, 2020
From: FORMLABS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 051734/0886 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2019
From: TORREALBA, EDUARDO; PLUMMER, LUKE; CHAN, BRIAN; LOBOVSKY, MAXIM; WIGHTON, SHANE; FERGUSON, IAN
To: FORMLABS, INC.
Reel/Frame 048996/0937 →