IP Library Granted Patent US 10,272,471
Granted Patent B2
US 10,272,471 · App. 15/970,987 · Granted Apr 30, 2019

Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods

Inventors: Susan A. Alie (Stoneham, MA); Jaime Scott Zahorian (Guilford, CT); Kailiang Chen (Guilford, CT)
Assignee: Butterfly Network, Inc.
B06B1/02B06B1/0292
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Quick Facts
Patent No.
US 10,272,471
App. No.
15/970,987
Granted
Apr 30, 2019
Kind
B2
Abstract

Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.

Claims (20)

1. An ultrasound device, comprising:

a substrate having a first transducer region and a second transducer region, the first transducer region having a first plurality of ultrasound transducers and the second transducer region having a second plurality of ultrasound transducers;

a controller configured to bias the first plurality of ultrasound transducers and the second plurality of ultrasound transducers through a respective first common electrode and a second common electrode; and

a biasing source configured to communicate a voltage bias to one or more of the ultrasound transducers,

wherein each ultrasound transducer of the first plurality of ultrasound transducers and the second plurality of ultrasound transducers comprises a membrane in communication with a biasing source; and

wherein the controller is configured to bias the first plurality of ultrasound transducers independently of the second plurality of ultrasound transducers.

2. The ultrasound device of claim 1 , wherein the first plurality of ultrasound transducers and the second plurality of ultrasound transducers are capacitive micromachined ultrasonic transducers.

3. The ultrasound device of claim 2 , wherein the substrate is a semiconductor die and wherein the capacitive micromachined ultrasonic transducers are monolithically integrated with the semiconductor die.

4. The ultrasound device of claim 2 , wherein the substrate has a device surface with a width between approximately 20 mm and approximately 40 mm and a height between approximately 2 mm and approximately 10 mm.

5. The ultrasound device of claim 1 , further comprising a plurality of individually electrically controllable bias electrodes to communicate with the biasing source configured to communicate the voltage bias to the one or more of the ultrasound transducers.

6. The ultrasound device of claim 5 , wherein each of the plurality of individually electrically controllable bias electrodes corresponds to a respective group of ultrasound transducers of the first and second pluralities of ultrasound transducers.

7. The ultrasound device of claim 1 , further comprising a detection circuit integrated with the substrate to detect an electrical response of the first plurality of ultrasound transducers.

8. A method to operate an ultrasound device having a substrate and a plurality of ultrasonic transducers, the method comprising:

electrically biasing, at a first bias voltage, a first bias electrode comprising a first common membrane corresponding to a first group of ultrasonic transducers of the plurality of ultrasonic transducers; and

electrically biasing, at a second bias voltage, a second bias electrode.

9. The method of claim 8 , wherein the second bias electrode further comprises a second common membrane corresponding to a second group of ultrasonic transducers.

10. The method of claim 8 , wherein the second bias voltage is different than the first bias voltage.

11. The method of claim 8 , wherein electrically biasing the second bias electrode is performed substantially simultaneously with electrically biasing the first bias electrode.

12. The method of claim 8 , wherein the first group of ultrasonic transducers are capacitive micromachined ultrasonic transducers and wherein electrically biasing the first bias electrode involves electrically biasing a common membrane of the capacitive micromachined ultrasonic transducers.

13. The method of claim 8 , further comprising, in response to electrically biasing the first bias electrode, detecting an electrical response of the first group of ultrasonic transducers.

Assignments (2)
CHANGE OF NAME Recorded Mar 16, 2022
From: BUTTERFLY NETWORK, INC.
To: BFLY OPERATIONS, INC.
Reel/Frame 059369/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2019
From: ALIE, SUSAN A.; ZAHORIAN, JAIME SCOTT; CHEN, KAILIANG
To: BUTTERFLY NETWORK, INC.
Reel/Frame 047879/0733 →
Continuity (2)
Continuation 14957098 · Dec 2, 2015
Related Publication 20180353995A1 · Dec 13, 2018