IP Library Granted Patent US 10,698,677
Granted Patent B2
US 10,698,677 · App. 15/971,343 · Granted Jun 30, 2020

Method and system for lifecycle management optimization

Inventors: Donald Mace (Hopkinton, MA); Xiaoye Jiang (Shrewsbury, MA)
Assignee: EMC IP Holding Company LLC
G06F8/65G06F8/61G06F8/71G06F9/45558H04L67/34
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Quick Facts
Patent No.
US 10,698,677
App. No.
15/971,343
Granted
Jun 30, 2020
Kind
B2
Abstract

A method and system for lifecycle management optimization. Specifically, the method and system disclosed herein eliminate the performance of exhaustive pre-checks, which pertain to determining compatibility between downloaded upgrade packages for installed components in a computing system and a current state of the computing system. Traditional approaches to performing lifecycle management operations entail downloading upgrade packages first, followed by the performance of the exhaustive pre-checks thereafter. In contrast, the method and system disclosed herein perform the pre-checks first, through a processing of fingerprints and, subsequently, based on the outcome of the pre-checks, allowing the upgrade packages to be downloaded or providing feedback to mitigate any issues that may arise.

Claims (82)

1. A method for processing package requests, comprising:

receiving, from a hyper-converged infrastructure (HCI) node, a first package request comprising a first lifecycle package identifier (ID), a first component ID, and a first current component fingerprint (CCF);

performing a first lookup on a lifecycle package repository (LPR) using the first lifecycle package ID, to identify a first LPR entry;

obtaining, from the first LPR entry, a first target component fingerprint (TCF) specified therein, wherein the first TCF is associated with the first component ID;

making a first determination that the first CCF matches the first TCF;

based on the first determination:

obtaining, from the first LPR entry, a first relevant component ID and a first lifecycle package image (LPI);

generating, directed to the first package request, a first request response comprising the first lifecycle package ID, the first relevant component ID, and the first LPI; and

transmitting the first request response to the HCI node,

wherein the first CCF is associated with the first component ID,

wherein the first CCF is based on at least one selected from a group consisting of a parent component ID associated with a parent component of the first component ID and a dependent component ID associated with a dependent component of the first component ID.

2. The method of claim 1 , wherein the first TCF is a digital signature representative of a target state of a component installed on the HCI node.

3. The method of claim 2 , wherein the target state of the component installed on the HCI node pertains to a prerequisite state in which the component must be for compatibility with the first LPI.

4. The method of claim 1 , further comprising:

receiving, from the HCI node, a second package request comprising a second lifecycle package ID, a second component ID, and a second CCF;

performing a second lookup on the LPR using the second lifecycle package ID, to identify a second LPR entry;

obtaining, from the second LPR entry, a second TCF specified therein, wherein the second TCF is associated with the second component ID;

making a second determination that the second CCF mismatches the second TCF;

based on the second determination:

performing a third lookup on a state diagram repository (SDR) using the second component ID, to identify a SDR entry;

obtaining, from the SDR entry, a first component state ID associated with a first component fingerprint, wherein the first component fingerprint matches the second CCF;

obtaining, from the SDR entry, a second component state ID associated with a second component fingerprint, wherein the second component fingerprint matches the second TCF;

obtaining, from the SDR entry, a component state diagram (CSD) specified therein; and

traversing the CSD from a first node depicted therein, associated with the first component state ID, to a second node depicted therein, associated with the second component state ID, to obtain a mitigation action path (MAP) comprising a mitigation action (MA) ID associated with a MA.

5. The method of claim 4 , wherein the CSD is a state transition graph that depicts a lifecycle management (LCM) history for a component installed on the HCI node and associated with the second component ID.

6. The method of claim 4 , further comprising:

performing a fourth lookup on a mitigation action repository (MAR) using the MA ID, to identify a MAR entry;

obtaining, from the MAR entry, the MA;

generating a prerequisite component ID-MA mapping using the second component ID and the MA;

generating, directed to the second package request, a second request response comprising the second lifecycle package ID and the prerequisite component ID-MA mapping; and

transmitting the second request response to the HCI node.

7. The method of claim 6 , wherein the MA comprises instructions directed to contacting helpdesk support.

8. The method of claim 6 , wherein the MA comprises a third lifecycle package ID.

9. A system, comprising:

a lifecycle manager agent (LMA);

a lifecycle package repository (LPR) stored in a storage medium and directed to consolidating lifecycle packages; and

a hyper-converged infrastructure (HCI) nodes agent (HNA) comprising a processor and storage and operatively connected to the LPR and the LMA, and programmed to:

receive, from the LMA, a first package request comprising a first lifecycle package identifier (ID), a first component ID, and a first current component fingerprint (CCF);

perform a first lookup on the LPR using the first lifecycle package ID, to identify a first LPR entry;

obtain, from the first LPR entry, a first target component fingerprint (TCF) specified therein, wherein the first TCF is associated with the first component ID;

make a first determination that the first CCF matches the first TCF;

based on the first determination:

obtain, from the first LPR entry, a first relevant component ID and a first lifecycle package image (LPI);

generate, directed to the first package request, a first request response comprising the first lifecycle package ID, the first relevant component ID, and the first LPI; and

transmit the first request response to the LMA,

wherein the first CCF is associated with the first component ID,

wherein the first CCF is based on at least one selected from a group consisting of a parent component ID associated with a parent component of the first component ID and a dependent component ID associated with a dependent component of the first component ID.

10. The system of claim 9 , wherein a lifecycle package of the lifecycle packages is associated with the first lifecycle package ID, wherein the lifecycle package is one selected from a group consisting of an upgrade and a patch, for a component associated with the first component ID.

11. The system of claim 9 , further comprising:

a state diagram repository (SDR) directed to consolidating component state diagrams (CSDs),

wherein the HNA is further operatively connected to the SDR.

12. The system of claim 11 , further comprising:

a mitigation action repository (MAR) directed to consolidating mitigation actions (MAs),

wherein the HNA is further operatively connected to the MAR.

13. The system of claim 12 , further comprising:

a node component repository (NCR) directed to consolidating node-component mappings,

wherein the HNA is further operatively connected to the NCR.

14. The system of claim 13 , further comprising:

an environment lifecycle manager (ELM) comprising the HNA, the LPR, the SDR, the MAR, and the NCR.

15. The system of claim 14 , further comprising:

a hyper-converged infrastructure (HCI) cluster comprising a plurality of HCI nodes,

wherein the ELM is operatively connected to the HCI cluster,

wherein the HNA interacts with the HCI cluster, and

wherein the LMA resides on each HCI node of the plurality of HCI nodes.

16. The system of claim 15 , further comprising:

an environment administrator client (EAC) operatively connected the HCI cluster.

17. The system of claim 15 , further comprising:

a HCI environment comprising the ELM and the HCI cluster.

18. The system of claim 14 , further comprising:

a package aggregator and distributor (PAD) operatively connected to the ELM,

wherein the ELM further comprises an aggregator and distributor agent (ADA) programmed to interact with the PAD.

19. A non-transitory computer readable medium (CRM) comprising computer readable program code, which when executed by a computer processor, enables the computer processor to:

receive, from a hyper-converged infrastructure (HCI) node, a first package request comprising a first lifecycle package identifier (ID), a first component ID, and a first current component fingerprint (CCF);

perform a first lookup on a lifecycle package repository (LPR) using the first lifecycle package ID, to identify a first LPR entry;

obtain, from the first LPR entry, a first target component fingerprint (TCF) specified therein, wherein the first TCF is associated with the first component ID;

make a first determination that the first CCF matches the first TCF;

based on the first determination:

obtain, from the first LPR entry, a first relevant component ID and a first lifecycle package image (LPI);

generate, directed to the first package request, a first request response comprising the first lifecycle package ID, the first relevant component ID, and the first LPI; and

transmit the first request response to the HCI node,

wherein the first CCF is associated with the first component ID,

wherein the first CCF is based on at least one selected from a group consisting of a parent component ID associated with a parent component of the first component ID and a dependent component ID associated with a dependent component of the first component ID.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (046366/0014) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060450/0306 →
RELEASE OF SECURITY INTEREST AT REEL 046286 FRAME 0653 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0093 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 046286/0653 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 046366/0014 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2018
From: MACE, DONALD; JIANG, XIAOYE
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 045899/0287 →
Continuity (1)
Related Publication 20190340005A1 · Nov 7, 2019