IP Library Patent Application 15971392
Patent Application
App. No. 15/971,392

TEMPERATURE ACCORDANCE AIRFLOW BALANCING BAFFLE SYSTEM

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Quick Facts
Patent No.
US None
App. No.
15/971,392
Abstract

An information handling system may include a processor, a memory communicatively coupled to the processor, first and second information handling resources, an air mover configured to provide airflow to the first and second information handling resources, a baffle configured to apportion the airflow between the first and second information handling resources, and a first structural element coupled to the baffle. The first structural element may be proximate to the first information handling resource and may include a shape-memory alloy (SMA). In response to an increase in temperature associated with the first information handling resource, the SMA may be operable to change a physical dimension of the first structural element such that the baffle is moved from a first orientation to a second orientation, the second orientation corresponding to a higher airflow to the first information handling resource.

Claims (33)

1 . An information handling system comprising:

a processor;

a memory communicatively coupled to the processor;

first and second information handling resources;

an air mover configured to provide airflow to the first and second information handling resources;

a baffle configured to apportion the airflow between the first and second information handling resources; and

a first structural element coupled to the baffle, the first structural element being proximate to the first information handling resource and comprising a shape-memory alloy (SMA);

wherein, in response to an increase in temperature associated with the first information handling resource, the SMA is operable to change a physical dimension of the first structural element such that the baffle is moved from a first orientation to a second orientation, the second orientation corresponding to a higher airflow to the first information handling resource.

2 . The information handling system of claim 1 , further comprising a second structural element coupled to the baffle, the second structural element comprising the SMA.

3 . The information handling system of claim 2 , wherein in response to an increase in temperature associated with the second information handling resource, the SMA is operable to change a physical dimension of the second structural element such that the baffle is moved from the second orientation to the first orientation, the first orientation corresponding to a higher airflow to the second information handling resource.

4 . The information handling system of claim 1 , further comprising a biasing spring coupled to the baffle.

5 . The information handling system of claim 4 , further comprising a plurality of biasing springs coupled to the baffle.

6 . The information handling system of claim 1 , wherein the information handling system does not include circuitry that is configured to alter the orientation of the baffle.

7 . The information handling system of claim 1 , wherein the baffle does not include an electrical input.

8 . The information handling system of claim 1 , wherein the second orientation further corresponds to a lower airflow to the second information handling resource.

9 . A method comprising:

forming a baffle from a baffle material, wherein, when installed in an information handling system, the baffle is configured to apportion an airflow between first and second information handling resources of the information handling system; and

coupling a first structural element comprising a shape-memory alloy (SMA) to the baffle such that, when installed in the information handling system, the first structural element is configured to be proximate to the first information handling resource;

wherein, in response to an increase in temperature associated with the first information handling resource, the SMA is operable to change a physical dimension of the first structural element such that the baffle is moved from a first orientation to a second orientation, the second orientation corresponding to a higher airflow to the first information handling resource.

10 . The method of claim 9 , wherein the baffle material is a plastic material.

11 . The method of claim 9 , further comprising a second structural element comprising the SMA to the baffle such that, when installed in the information handling system, the second structural element is configured to be proximate to the second information handling resource.

12 . The method of claim 11 , wherein in response to an increase in temperature associated with the second information handling resource, the SMA is operable to change a physical dimension of the second structural element such that the baffle is moved from the second orientation to the first orientation, the first orientation corresponding to a higher airflow to the second information handling resource.

13 . The method of claim 9 , wherein the second orientation further corresponds to a lower airflow to the second information handling resource.

14 . An apparatus comprising:

a baffle configured to apportion airflow between first and second information handling resources of an information handling system; and

a first structural element coupled to the baffle, the first structural element being proximate to the first information handling resource and comprising a shape-memory alloy (SMA);

wherein, in response to an increase in temperature associated with the first information handling resource, the SMA is operable to change a physical dimension of the first structural element such that the baffle is moved from a first orientation to a second orientation, the second orientation corresponding to a higher airflow to the first information handling resource.

15 . The apparatus of claim 14 , wherein the movement from the first orientation to the second orientation includes a rotation of the baffle.

16 . The apparatus of claim 14 , wherein the movement from the first orientation to the second orientation includes a translation of the baffle.

17 . The apparatus of claim 14 , further comprising a second structural element coupled to the baffle, the second structural element comprising the SMA

18 . The apparatus of claim 14 , further comprising a biasing spring coupled to the baffle.

19 . The apparatus of claim 14 , further comprising a plurality of springs coupled to the baffle.

20 . The apparatus of claim 14 , wherein the apparatus does not include circuitry operable to change the orientation of the baffle.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (046366/0014) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060450/0306 →
RELEASE OF SECURITY INTEREST AT REEL 046286 FRAME 0653 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0093 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 046286/0653 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 046366/0014 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2018
From: TSENG, RYAN; CHOU, HENG-LI; LIN, SCOTT JY
To: DELL PRODUCTS L.P.
Reel/Frame 045816/0907 →