Power adapter packaging
A power adapter package comprises a power conversion module, an input board assembly comprising terminals for receiving power from an input source and delivering power to the input of the power conversion module, an output board assembly for receiving power from the output of the power conversion module and delivering power to a load via output terminations, a signal isolator comprising a bridge board spanning a distance between the input board and the output board, a case comprising top and bottom covers, and end cap assemblies for supporting and insulating input and output terminations. The bridge board may comprise a multilayer substrate comprising galvanically isolated and magnetically coupled transformer windings. The input and output boards may be soldered to contacts formed along a peripheral edge of the power conversion module.
1. An apparatus for converting power received from an input source for delivery to a load, comprising:
a first printed circuit board (“PCB”) having one or more electrical terminations adapted for connection to the input source and one or more electrical terminations for connection to the load;
a power conversion module (“PCM”) having a module input and a module output, each being electrically connected to the first PCB, and power conversion circuitry adapted to convert power between the module input and the module output;
wherein at least one of the electrical connections from the module input or module output and the first PCB comprises a solder connection formed between a conductive area located on a vertical edge of the PCB and a conductive area located on a first vertical edge of the power conversion module,
wherein the vertical edges are approximately parallel to each other and the connection is located at an elevation below a top surface and above a bottom surface of the power conversion module.
2. The apparatus of claim 1 in which the power conversion module has a second conductive area located on a second vertical edge, and a solder connection is formed between the second conductive area and a metallic case.
3. The apparatus of claim 2 in which the solder connection between the second conductive area and the metallic case is located at an elevation below a top surface and above a bottom surface of the power conversion module.
4. The apparatus of claim 1 in which the module input and the module output of the power conversion module are positioned on one side of the power conversion module.
5. The apparatus of claim 1 in which the power conversion module further comprises an internal printed circuit board having a first vertical edge including one or more surface contacts and a second vertical edge having one or more surface contacts, the first and second vertical edges forming a portion of first and second vertical edges of the power conversion module.
6. The apparatus of claim 1 , further comprising an end cap assembly having a non-conductive body and a plurality of electrically conductive terminals connected to the first printed circuit board.
7. The apparatus of claim 1 in which the solder connection directly contacts the conductive area located on the vertical edge of the PCB and the conductive area located on the first vertical edge of the power conversion module.
8. The apparatus of claim 1 in which the vertical edge of the PCB comprises a perimeter edge of the PCB.