Light emitting device package
A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.
1. A light emitting diode package, comprising:
at least two light emitting diode chips;
a housing on which the at least two light emitting diode chips are disposed, the housing having a first surface with at least two openings through which light from the at least two light emitting diode chips is discharged, respectively; and
a plurality of pads disposed on a second surface of the housing different from the first surface of the housing, the plurality of pads being electrically connected to the at least two light emitting diode chips;
wherein the housing has a plurality of grooves formed on a third surface adjacent to the second surface,
wherein the housing protrudes between the at least two light emitting diode chips,
wherein a first of the at least two light emitting diode chips comprises a light emitting structure configured to emit the light, and first and second electrodes electrically connected to the light emitting structure, the first and second electrodes being electrically connected to the plurality of pads, respectively, and
wherein the at least two light emitting diode chips further comprise:
a third electrode of a second of the at least two light emitting diode chips is electrically connected to one of the plurality of pads,
a fourth electrode of the second of the at least two light emitting diode chips is electrically connected to a different pad of the plurality of pads, and
the third electrode being electrically connected to the second electrode of the first of the at least two light emitting diode chips.
2. The light emitting diode package according to claim 1 , wherein the pads are formed at locations corresponding to the grooves, respectively.
3. The light emitting diode package according to claim 2 , wherein a number of the at least two openings of the first surface of the housing is equal to a number of the at least two light emitting diode chips.
4. The light emitting diode package according to claim 1 , wherein the housing comprises via-holes filled with a conductive material and the first and second electrodes are electrically connected to the plurality of pads through the conductive material, respectively.
5. The light emitting diode package according to claim 1 , wherein the plurality of pads includes at least three pads, each pad of the plurality of pads being electrically insulated from each other.
6. The light emitting diode package according to claim 1 , wherein the plurality grooves are formed along an edge, the edge being located where the second surface and the third surface connect.
7. The light emitting diode package according to claim 1 , wherein the grooves are formed over the second surface of the housing on which the plurality of pads is disposed and the third surface adjacent to the second surface thereof.
8. The light emitting diode package according to claim 1 , wherein the housing is coupled to an exterior substrate such that the third surface of the housing adjoins the exterior substrate.
9. The light emitting diode package according to claim 8 , wherein the housing is coupled to the exterior substrate such that each of the pads is electrically connected to the exterior substrate via a solder.
10. The light emitting diode package according to claim 9 , further comprising:
a protective layer disposed between the pads to expose the grooves.
11. The light emitting diode package according to claim 10 , wherein the protective layer covers at least part of the pads.
12. The light emitting diode package according to claim 10 , wherein the solder is deposited on the pads exposed through the protective layer.
13. The light emitting diode package according to claim 1 , further comprising:
a wavelength converter disposed above the at least two light emitting diode chips.
14. A light emitting diode package comprising:
at least two light emitting diode chips;
a housing on which the at least two light emitting diode chips are disposed, the housing having a first surface with at least two openings through which light from the at least two light emitting diode chips is discharged, respectively; and
a plurality of pads disposed on a second surface of the housing different from the first surface of the housing, the plurality of pads being electrically connected to the at least two light emitting diode chips;
wherein the housing has a plurality of grooves formed on a third surface adjacent to the second surface,
wherein the housing protrudes between the at least two light emitting diode chips,
wherein the housing is coupled to an exterior substrate such that the third surface of the housing adjoins the exterior substrate, and
wherein each of the pads is electrically connected to the exterior substrate via a solder such that the solder fills at least part of each of the grooves.
15. The light emitting diode package according to claim 14 , wherein the pads are formed at locations corresponding to the grooves, respectively.
16. The light emitting diode package according to claim 15 , wherein a number of the at least two openings of the first surface of the housing is equal to a number of the at least two light emitting diode chips.
17. The light emitting diode package according to claim 14 , wherein a first of the at least two light emitting diode chips comprises a light emitting structure configured to emit the light, and first and second electrodes electrically connected to the light emitting structure, the first and second electrodes being electrically connected to the plurality of pads, respectively.
18. The light emitting diode package according to claim 17 , wherein the at least two light emitting diode chips further comprise:
a third electrode of a second of the at least two light emitting diode chips is electrically connected to one of the plurality of pads,
a fourth electrode of the second of the at least two light emitting diode chips is electrically connected to a different pad of the plurality of pads, and
the third electrode being electrically connected to the second electrode of the first of the at least two light emitting diode chips.
19. The light emitting diode package according to claim 17 , wherein the housing comprises via-holes filled with a conductive material and the first and second electrodes are electrically connected to the plurality of pads through the conductive material, respectively.
20. The light emitting diode package according to claim 14 , wherein the plurality of pads includes at least three pads, each pad of the plurality of pads being electrically insulated from each other.
21. The light emitting diode package according to claim 14 , wherein the plurality grooves are formed along an edge, the edge being located where the second surface and the third surface connect.
22. The light emitting diode package according to claim 14 , wherein the grooves are formed over the second surface of the housing on which the plurality of pads is disposed and the third surface adjacent to the second surface thereof.
23. The light emitting diode package according to claim 14 , further comprising:
a protective layer disposed between the pads to expose the grooves.
24. The light emitting diode package according to claim 23 , wherein the protective layer covers at least part of the pads.
25. The light emitting diode package according to claim 23 , wherein the solder is deposited on the pads exposed through the protective layer.
26. The light emitting diode package according to claim 14 , further comprising:
a wavelength converter disposed above the at least two light emitting diode chips.