IP Library Granted Patent US 10,831,248
Granted Patent B2
US 10,831,248 · App. 15/975,342 · Granted Nov 10, 2020

Mobile device temperature-regulating case

Inventors: Christopher Dillow (Carmel, IN); Cody Breeding (Terre Haute, IN)
Assignee: ADESA, Inc.
G06F1/203A45C11/00G06F1/1628H04M1/0202A45C2011/002
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Quick Facts
Patent No.
US 10,831,248
App. No.
15/975,342
Granted
Nov 10, 2020
Kind
B2
Abstract

A mobile device temperature-regulating case is disclosed. Mobile devices, such as tablet computers and smartphones, may be exposed to extreme temperatures, such as extreme cold and extreme heat. Under these extreme temperatures, the mobile devices may not function properly or at all. In that regard, the mobile device temperature-regulating case is configured to at least partially encase a side of the mobile device and conductively cool and/or heat the side of the mobile device. For example, a solid-state heat pump may conductively cool the side of the mobile device, with a fan convectively cooling the solid-state heat pump. In this way, temperature of the mobile device may be kept less than or greater than a predetermined temperature so that the mobile device may function properly.

Claims (27)

1. A mobile device case configured to removably connect to a mobile device, the mobile device case comprising:

a housing;

a solid-state heat pump positioned at least partly within the housing, the solid-state heat pump comprising a first side and a second side, the first side configured to conductively cool at least a part of an exterior surface of the mobile device;

a fan configured to convectively cool the second side of the solid-state heat pump;

control electronics in communication with the solid-state heat pump and the fan in order to control the cooling of the exterior surface of the mobile device and the cooling of the second side of the solid-state heat pump; and

a temperature sensor in communication with the control electronics, the temperature sensor configured to generate a sensed temperature on at least a part of the exterior surface of the mobile device;

wherein the first side of the solid-state heat pump is at least partly covered by a metal;

wherein, when the mobile device case is connected to the mobile device, the metal directly contacts, via an opening in the housing, the exterior surface of the mobile device such that there is no air gap between the metal and the exterior surface of the mobile device;

wherein a plurality of fins are attached to the second side opposite to the first side;

wherein the fan is configured to convectively cool the second side of the solid-state heat pump by blowing air across the fins attached to the second side of the solid-state heat pump; and

wherein the control electronics are configured to control at least one of the solid-state heat pump or the fan based on the sensed temperature from the temperature sensor without dependence on communication with the mobile device.

2. The mobile device of claim 1 , wherein the second side of the solid-state heat pump is coaxial with the fan.

3. The mobile device of claim 1 , wherein the solid-state heat pump comprises a Peltier cooling device.

4. The mobile device case of claim 1 ,

wherein the first side of the solid-state heat pump at least partly covered by the metal is flush with a perimeter of the opening of the housing.

5. The mobile device case of claim 4 ,

wherein the fan comprises a first side and a second side, the first side of the fan facing the fins; and

further comprising a grille, the second side facing the grille.

6. The mobile device case of claim 5 , wherein there is a gap between the first side of the fan and the fins; and

wherein the housing includes holes on two opposing sides that define a duct through the gap between the first side of the fan and the fins.

7. The mobile device case of claim 1 ,

wherein the control electronics are configured to control the fan based the sensed temperature from the temperature sensor.

8. The mobile device case of claim 1 , wherein at least one temperature sensor is configured to sense temperature of the second side of the solid-state heat pump in order to generate the sensed temperature; and

wherein the control electronics are configured to control the fan based the sensed temperature from the at least one temperature sensor by:

determining whether the sensed temperature, indicative of the temperature of the second side of the solid-state heat pump, is greater than a predetermined temperature; and

responsive to determining that the sensed temperature is greater than the predetermined temperature, turning on the fan.

9. The mobile device case of claim 1 , wherein the control electronics is configured to turn on the fan responsive to activating the solid-state heat pump.

Assignments (4)
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY RECORDED AT R/F 056201/0281 Recorded Jun 26, 2023
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: ADESA, INC.
Reel/Frame 064109/0230 →
SECURITY INTEREST Recorded Jun 26, 2023
From: ADESA, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 064110/0590 →
SECURITY INTEREST Recorded May 11, 2021
From: ADESA, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 056201/0281 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2018
From: DILLOW, CHRISTOPHER; BREEDING, CODY
To: ADESA, INC
Reel/Frame 045867/0366 →
Continuity (1)
Related Publication 20190346893A1 · Nov 14, 2019