In-situ cross-linking of emulsified quantum dot-containing domains within a carrier resin
The present invention provides quantum dot compositions and methods of producing quantum dot compositions. The quantum dot compositions comprise a population of quantum dots, an aminosilicone polymer, an epoxy-functional silicone, and an organic resin. The present invention also provides quantum dot films comprising a quantum dot layer and methods of making quantum dot films.
1. A quantum dot composition, comprising:
(a) at least one population of quantum dots;
(b) at least one aminosilicone polymer;
(c) at least one epoxy-functional silicone; and
(d) at least one organic resin;
wherein the quantum dot composition comprises cross-linked domains of aminosilicone polymer and epoxy-functional silicone;
wherein the cross-linked domains comprise gelled domains within the resin; and
wherein the resin is not gelled.
2. The quantum dot composition of claim 1 , comprising between one and five populations of quantum dots.
3. The quantum dot composition of claim 1 , wherein the at least one population of quantum dots contains a core selected from the group consisting of InP, InZnP, InGaP, CdSe, CdS, CdSSe, CdZnSe, CdZnS, ZnSe, ZnSSe, InAs, InGaAs, and InAsP.
4. The quantum dot composition of claim 1 , comprising between one and five aminosilicone polymers.
5. The quantum dot composition of claim 1 , comprising between one and five epoxy-functional silicones.
6. The quantum dot composition of claim 1 , wherein the at least one epoxy-functional silicone has the structure of formula IV:
wherein t is an integer between 0 and 700 and u is an integer between 1 and 100.
7. The quantum dot composition of claim 1 , comprising between one and five organic resins.
8. The quantum dot composition of claim 1 , wherein the at least one organic resin is a mercapto-functional compound.
9. The quantum dot composition of claim 1 , wherein the at least one organic resin is an isocyanate, an epoxy, or an unsaturated compound.
10. The quantum dot composition of claim 1 , further comprising a thermal initiator or a photoinitiator.
11. The quantum dot composition of claim 1 , wherein the cross-linked domains have an average size of between about 0.5 and about 10 microns.
12. The quantum dot composition of claim 1 , wherein the quantum dot composition comprises 2 populations of quantum dots, 2 aminosilicone polymers, 1 epoxy-functional silicone, and 2 organic resins.
13. A method of preparing the quantum dot composition of claim 1 , the method comprising:
(a) (i) providing a composition comprising at least one population of quantum dots and at least one aminosilicone;
(ii) admixing at least one epoxy-functional silicone with the composition of (a)(i); and
(iii) admixing at least one organic resin with the composition of (a)(ii); or
(b) (i) providing a composition comprising at least one population of quantum dots, at least one aminosilicone, and at least one organic resin; and
(ii) admixing at least one epoxy-functional silicone with the composition of (b)(i).
14. The method of claim 13 , wherein the at least one population of quantum dots contains a core selected from the group consisting of InP, InZnP, InGaP, CdSe, CdS, CdSSe, CdZnSe, CdZnS, ZnSe, ZnSSe, InAs, InGaAs, and InAsP.
15. The method of claim 13 , comprising between one and five aminosilicone polymers.
16. The method of claim 13 , comprising between one and five epoxy-functional silicones.
17. The method of claim 13 , wherein the at least one epoxy-functional silicone has the structure of formula IV:
wherein t is an integer between 0 and 700 and u is an integer between 1 and 100.
18. The method of claim 13 , wherein the composition of (a)(i) or (b)(i) is stored for between 1 minute and 3 years before the admixing in (a)(ii) or (b)(ii).
19. The method of claim 13 , comprising two organic resins.
20. The method of claim 13 , wherein the at least one organic resin is a mercapto-functional compound.
21. The method of claim 13 , wherein the at least one organic resin is an isocyanate, an epoxy, or an unsaturated compound.
22. The method of claim 13 , further comprising admixing at least one thermal initiator or photoinitiator with the composition of (a)(iii) or (b)(ii).
23. The method of claim 13 , further comprising curing the composition of (a)(iii) or (b)(ii) using thermal curing or UV curing.
24. The composition of claim 1 , wherein the cross-linked domains have an average size of between about 0.5 and about 10 microns.
25. The composition of claim 1 , wherein the resin is not chemically reacted with the cross-linked domains.