Multiple resin over-mold for printed circuit board electronics and light guide

1. A laminated light guide and component carrier, comprising:

a body having a first face;

a light emitting diode positioned on the first face;

first electrical traces printed on the first face with the light emitting diode connected to the first electrical traces;

a connector positioned on the first face also connected to the first electrical traces, wherein the connector includes capacitive touch film contacts provided within a space envelope of the connector;

a light guide of a light transmissive polymeric material affixed onto the first face proximate to and covering the light emitting diode and omitted from a space envelope containing the connector; and

an opaque polymeric material coating layer overmolded onto the first face outside of the light guide.

2. The laminated light guide and component carrier of claim 1 , wherein the light guide is overmolded using a high pressure molding process.

3. The laminated light guide and component carrier of claim 2 , wherein the light guide defines a poly-methyl methacrylate material.

4. The laminated light guide and component carrier of claim 2 , wherein the opaque polymeric material coating layer is overmolded using a low pressure molding process.

5. The laminated light guide and component carrier of claim 1 , wherein the opaque polymeric material coating layer has a coefficient of thermal expansion compatible with printed circuit board FR4 material.

6. The laminated light guide and component carrier of claim 1 , wherein the light guide and the opaque polymeric material coating layer are each overmolded using a low pressure molding process.

7. The laminated light guide and component carrier of claim 6 , wherein the light guide and the opaque polymeric material coating layer individually define a thermoplastic material heated to create a hot-melt prior to molding using the low pressure molding process.

8. The laminated light guide and component carrier of claim 1 , further including second electrical traces printed on a second face of the body oppositely directed with respect to the first face.

9. The laminated light guide and component carrier of claim 8 , further including capacitive touch circuits printed on the second face of the body.

10. The laminated light guide and component carrier of claim 9 , further including capacitive touch second electrical traces connected to the capacitive touch circuits, wherein the second electrical traces are further connected by vias extending through the body to the connector positioned on the first face.

11. A laminated light guide and component carrier, comprising:

a polymeric material body having a first face;

a light emitting diode positioned on the first face;

a connector positioned on the first face;

a through aperture created in the body positioned proximate to the light emitting diode;

a light guide of a light transmissive polymeric material affixed onto the first face proximate to and covering the light emitting diode and filling the through aperture, and omitted from a space envelope containing the connector; and

an opaque polymeric material coating layer overmolded onto the first face outside of the light guide.

12. The laminated light guide and component carrier of claim 11 , further including first electrical traces printed on the first face with the light emitting diodes each connected to the first electrical traces.

13. The laminated light guide and component carrier of claim 12 , further including capacitive touch circuits printed on a second face of the body wherein the connector is also connected to the first electrical traces and the capacitive touch circuits.

14. The laminated light guide and component carrier of claim 11 , wherein the light guide is applied using a high pressure molding process.

15. The laminated light guide and component carrier of claim 11 , wherein the light guide is applied using a low pressure molding process.

16. The laminated light guide and component carrier of claim 11 , wherein the light guide and the opaque polymeric material coating layer are each overmolded using a low pressure molding process, and each define a thermoplastic material heated to create a hot-melt prior to molding using the low pressure molding process.

17. The laminated light guide and component carrier of claim 16 , wherein:

the light guide and the opaque polymeric material coating layer directly contact each other at a commonly facing edge of each of light guide and the opaque polymeric material coating layer; and

the light guide and the opaque polymeric material coating layer have substantially a same thickness.

18. The laminated light guide and component carrier of claim 11 , further including multiple electronic components mounted on the first face, wherein the light guide is omitted from covering the electronic components.

19. The laminated light guide and component carrier of claim 18 , wherein the light guide includes a non-linear sawtooth-shaped face directed toward the electronic components.

20. The laminated light guide and component carrier of claim 18 , wherein the light guide includes a pin frictionally received in an aperture created in the body to mechanically couple the light guide to the body.

21. A laminated light guide and component carrier, comprising:

a polymeric material body having a first face and an oppositely directed second face;

multiple light emitting diodes positioned on the first face;

a connector positioned on the first face;

multiple individual through apertures created in the body each positioned proximate to one of the light emitting diodes;

a light guide of a light transmissive polymeric material affixed onto at least all of the light emitting diodes and filling each of the multiple individual through apertures, the light transmissive polymeric material omitted from a space envelope containing the connector;

an opaque polymeric material coating layer overmolded onto the first face outside of the light guide; and

a polymeric substantially opaque film applied to the second face, wherein light generated by any of the light emitting diodes is blocked from passing through the opaque film except at individual locations of indicia defining light transmissive portions of the opaque film each individually aligned with one of the through apertures.

22. The laminated light guide and component carrier of claim 21 , wherein:

the light transmissive polymeric material of the light guide defines a poly-methyl methacrylate material overmolded using a high pressure molding process; and

the opaque polymeric material coating layer defines a thermoplastic material overmolded using a low pressure molding process.

23. The laminated light guide and component carrier of claim 21 , wherein the light guide and the opaque polymeric material coating layer are each overmolded using a low pressure molding process, and each define a thermoplastic material heated to create a hot-melt prior to molding using the low pressure molding process.

24. The laminated light guide and component carrier of claim 21 , further including multiple electronic components positioned on the first face and electrically connected to a plurality of first electrical traces printed onto the first face, the multiple electronic components and the first electrical traces covered by the opaque polymeric material coating layer.

25. The laminated light guide and component carrier of claim 21 , wherein the light guide and the opaque polymeric material coating layer directly contact each other at a commonly facing first edge of light guide and a second edge of the opaque polymeric material coating layer, the first edge and the second edge oriented substantially perpendicular with respect to the body.

26. The laminated light guide and component carrier of claim 25 , wherein the first edge is aligned with an electrical trace positioned on the first face of the body.

27. The laminated light guide and component carrier of claim 21 , wherein the light guide and the opaque polymeric material coating layer have substantially a same thickness.