Integrated delay modules
An analog time delay filter circuit including a first delay circuit block arranged in a modular layout, having a first time delay filter, a first input, a first output, and first and second pass-throughs; and a second delay circuit block arranged in the same modular layout, having a second time delay filter, a second input, a second output, and third and fourth pass-throughs.
1. An analog time delay filter circuit comprising:
a first delay circuit block, comprising:
a first time delay filter having at least one LC resonator;
a first input, electrically coupled to the first time delay filter;
a first output, electrically coupled to the first time delay filter;
a first circuit pass-through; and
a second circuit pass-through;
wherein the first output, the first input, the first circuit pass-through, and the second circuit pass-through intersect a first surface of the first delay circuit block according to a first modular layout; wherein the first delay circuit block further comprises a second surface;
a second delay circuit block, comprising:
a second time delay filter having at least one LC resonator;
a second input, electrically coupled to the second time delay filter;
a second output, electrically coupled to the second time delay filter;
a third circuit pass-through; and
a fourth circuit pass-through;
wherein the second output, the second input, the third circuit pass-through, and the fourth circuit pass-through intersect a third surface of the second delay circuit block according to a second modular layout; wherein the second delay circuit block further comprises a fourth surface; wherein the first and second modular layouts are identical; and
a first substrate containing the first and second circuit delay blocks;
wherein the first, second, third, and fourth circuit pass-throughs are coupled to a primary coupled circuit at a first active side of the first substrate and provide electrical connectivity to the primary coupled circuit at a first other side of the first substrate.
2. The analog time delay filter circuit of claim 1 , wherein the first, second, third, and fourth surfaces are planar and parallel; wherein the first surface is intersected by the first input, the first output, and the first and second pass-throughs; wherein the second surface is also intersected by the first and second pass-throughs; wherein the third surface is intersected by the second input, the second output, and the third and fourth pass-throughs; wherein the fourth surface is also intersected by the third and fourth pass-throughs.
3. The analog time delay filter circuit of claim 1 , wherein the first delay circuit block and second delay circuit block are, with other delay circuit blocks, rectangularly arrayed on the first active side of the first substrate.
4. The analog time delay filter circuit of claim 3 , wherein the analog time delay filter circuit is fabricated by an integrated passive device (IPD) process.
5. The analog time delay filter circuit of claim 4 , wherein the analog time delay filter circuit is packaged in wire bondable packaging.
6. The analog time delay filter circuit of claim 4 , wherein the analog time delay filter circuit is packaged in flip-chip mountable packaging.
7. The analog time delay filter circuit of claim 6 , wherein electrical connections of the analog time delay filter circuit are configured by selectively placing solder balls or other electrical connectors during the flip-chip mounting process.
8. The analog time delay filter circuit of claim 7 , wherein the first delay circuit block contains a bridgeable contact; wherein the bridgeable contact may be bridged by selectively placing solder balls or other electrical connectors during the flip-chip mounting process; wherein bridging the bridgeable contact during the flip-chip mounting process modifies a time delay produced by the first delay circuit block.
9. The analog time delay filter circuit of claim 8 , wherein the first delay circuit block has a first LC resonator and a second LC resonator; wherein the first delay circuit block further comprises a tap connection coupled between the first LC resonator and the second LC resonator; wherein the first delay circuit block is configured by selectively coupling the tap connection to the primary coupled circuit using solder balls or other electrical connectors during the flip-chip mounting process.
10. The analog time delay filter circuit of claim 9 , wherein the analog time delay filter circuit is additionally coupled to a secondary coupled circuit at the first other side of the first substrate; wherein the secondary coupled circuit is electrically coupled to the primary coupled circuit via at least one of the first, second, third, and fourth circuit pass-throughs.
11. The analog time delay filter circuit of claim 6 , further comprising:
a third delay circuit block, comprising:
a third time delay filter having at least one LC resonator;
a third input, electrically coupled to the third time delay filter;
a third output, electrically coupled to the third time delay filter;
a fifth circuit pass-through; and
a sixth circuit pass-through;
wherein the third output, the third input, fifth first circuit pass-through, and the sixth circuit pass-through intersect a fifth surface of the third delay circuit block according to a third modular layout;
a fourth delay circuit block, comprising:
a fourth time delay filter having at least one LC resonator;
a fourth input, electrically coupled to the fourth time delay filter;
a fourth output, electrically coupled to the fourth time delay filter;
a seventh circuit pass-through; and
an eighth circuit pass-through;
wherein the fourth output, the fourth input, the seventh circuit pass-through, and the eighth circuit pass-through intersect a seventh surface of the fourth delay circuit block according to a fourth modular layout; wherein the third and fourth modular layouts are identical; and
a second substrate containing the third and fourth circuit delay blocks;
wherein the fifth, sixth, seventh, and eighth circuit pass-throughs are coupled to the first other side of the first substrate at a second active side of the second substrate and provide electrical connectivity to the first substrate at a second other side of the second substrate.
12. The analog time delay filter circuit of claim 11 , wherein the first and second modular layouts are distinct from the third and fourth modular layouts.
13. The analog time delay filter circuit of claim 11 , wherein the first, second, third, and fourth modular layouts are identical.
14. The analog time delay filter circuit of claim 13 , wherein the first and fifth circuit pass-throughs are electrically coupled and provide electrical connectivity to the primary coupled circuit at the second other side of the second substrate.
15. The analog time delay filter circuit of claim 14 , wherein electrical connections of the analog time delay filter circuit are configured by selectively placing solder balls or other electrical connectors during the flip-chip mounting process.
16. The analog time delay filter circuit of claim 15 , wherein the second circuit pass-through is selectively couplable to the sixth circuit pass-through by placing solder balls or other electrical connectors during the flip-chip mounting process.
17. The analog time delay filter circuit of claim 16 , wherein the analog time delay filter circuit is additionally coupled to a secondary coupled circuit at the second other side of the second substrate; wherein the secondary coupled circuit is electrically coupled to the primary coupled circuit via at least two of the first, second, third, and fourth, fifth, sixth, seventh, and eighth circuit pass-throughs.
18. The analog time delay filter circuit of claim 17 , wherein the first delay circuit block contains a bridgeable contact; wherein the bridgeable contact may be bridged by selectively placing solder balls or other electrical connectors during the flip-chip mounting process; wherein bridging the bridgeable contact during the flip-chip mounting process modifies a time delay produced by the first delay circuit block.