IP Library Granted Patent US 11,011,827
Granted Patent B2
US 11,011,827 · App. 15/977,612 · Granted May 18, 2021

Antenna boards and communication devices

Inventors: Trang Thai (Hillsboro, OR); Sidharth Dalmia (Portland, OR); Raanan Sover (Haifa, IL); Josef Hagn (Bavaria, DE); Omer Asaf (Oranit, IL); Simon Svendsen (Aalborg, DK)
Assignee: Intel IP Corporation
H01Q1/243H01L23/645H01L23/66
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Quick Facts
Patent No.
US 11,011,827
App. No.
15/977,612
Granted
May 18, 2021
Kind
B2
Abstract

Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

Claims (73)

1. An antenna module, comprising:

an antenna board and a die coupled to the antenna board, wherein the antenna board includes:

a ground plane,

an antenna feed structure including a first portion perpendicular to the ground plane and a second portion parallel to the ground plane,

a first antenna patch, wherein the first antenna patch has a thickness between 5 microns and 30 microns, and the first antenna patch has a rectangular footprint,

a second antenna patch spaced apart from the first antenna patch, wherein the first antenna patch is between the second antenna patch and the antenna feed structure, the second antenna patch has a thickness between 5 microns and 30 microns, and the second antenna patch has a rectangular footprint,

a first metal ring around the second antenna patch, wherein the first metal ring has a rectangular inner perimeter, and

a second metal ring between the first metal ring and the ground plane, wherein the second metal ring has a rectangular inner perimeter;

wherein the antenna board has a thickness between 500 microns and 2 millimeters.

2. The antenna module of claim 1 , wherein the antenna feed structure is not coupled to the first antenna patch by a conductive material pathway.

3. An antenna module, comprising:

an antenna board and a die coupled to the antenna board, wherein the antenna board includes:

a ground plane,

an antenna feed structure including a first portion perpendicular to the ground plane and a second portion parallel to the ground plane,

a first antenna patch, wherein the first antenna patch has a rectangular footprint,

a second antenna patch spaced apart from the first antenna patch, wherein the first antenna patch is between the second antenna patch and the antenna feed structure, and the second antenna patch has a rectangular footprint,

a first metal ring around the second antenna patch, wherein the first metal ring has a rectangular inner perimeter, and

a second metal ring between the first metal ring and the ground plane, wherein the second metal ring has a rectangular inner perimeter.

4. The antenna module of claim 3 , wherein the antenna feed structure is not coupled to the first antenna patch by a conductive material pathway.

5. The antenna module of claim 3 , wherein the first antenna patch has a thickness between 5 microns and 30 microns.

6. The antenna module of claim 3 , wherein the second antenna patch has a thickness between 5 microns and 30 microns.

7. The antenna module of claim 3 , wherein the antenna board has a thickness between 500 microns and 2 millimeters.

8. A handheld communication device, comprising:

an antenna module, including:

an antenna board and a die coupled to the antenna board, wherein the antenna board includes:

a ground plane,

an antenna feed structure including a first portion perpendicular to the ground plane and a second portion parallel to the ground plane,

a first antenna patch, wherein the first antenna patch has a thickness between 5 microns and 30 microns, and the first antenna patch has a rectangular footprint,

a second antenna patch spaced apart from the first antenna patch, wherein the first antenna patch is between the second antenna patch and the antenna feed structure, the second antenna patch has a thickness between 5 microns and 30 microns, and the second antenna patch has a rectangular footprint,

a first metal ring around the second antenna patch, wherein the first metal ring has a rectangular inner perimeter, and

a second metal ring between the first metal ring and the ground plane, wherein the second metal ring has a rectangular inner perimeter;

wherein the antenna board has a thickness between 500 microns and 2 millimeters; and

a circuit board electrically coupled to the antenna module.

9. The handheld communication device of claim 8 , wherein the antenna feed structure is not coupled to the first antenna patch by a conductive material pathway.

10. The handheld communication device of claim 8 , further comprising:

a back, wherein the back includes plastic; and

an air gap between the antenna patch and the back.

11. The handheld communication device of claim 8 , further comprising:

a touchscreen display; and

a back;

wherein the antenna module is at least partially between the touchscreen display and the back.

12. The handheld communication device of claim 11 , wherein the antenna module is entirely between the touchscreen display and the back.

13. The handheld communication device of claim 8 , further comprising:

a speaker.

14. The handheld communication device of claim 8 , further comprising:

a back, wherein the back includes plastic.

15. A handheld communication device, comprising:

an antenna module, including:

an antenna board and a die coupled to the antenna board, wherein the antenna board includes:

a ground plane,

an antenna feed structure including a first portion perpendicular to the ground plane and a second portion parallel to the ground plane,

a first antenna patch, wherein the first antenna patch has a rectangular footprint,

a second antenna patch spaced apart from the first antenna patch, wherein the first antenna patch is between the second antenna patch and the antenna feed structure, and the second antenna patch has a rectangular footprint,

a first metal ring around the second antenna patch, wherein the first metal ring has a rectangular inner perimeter, and

a second metal ring between the first metal ring and the ground plane, wherein the second metal ring has a rectangular inner perimeter; and

a circuit board electrically coupled to the antenna module.

16. The handheld communication device of claim 15 , wherein the antenna feed structure is not coupled to the first antenna patch by a conductive material pathway.

17. The handheld communication device of claim 15 , wherein the first antenna patch has a thickness between 5 microns and 30 microns.

18. The handheld communication device of claim 15 , wherein the second antenna patch has a thickness between 5 microns and 30 microns.

19. The handheld communication device of claim 15 , wherein the antenna board has a thickness between 500 microns and 2 millimeters.

20. The handheld communication device of claim 15 , further comprising:

a back, wherein the back includes plastic; and

an air gap between the antenna patch and the back.

21. The handheld communication device of claim 15 , further comprising:

a touchscreen display; and

a back;

wherein the antenna module is at least partially between the touchscreen display and the back.

22. The handheld communication device of claim 21 , wherein the antenna module is entirely between the touchscreen display and the back.

23. The handheld communication device of claim 15 , further comprising:

a speaker.

24. The handheld communication device of claim 15 , further comprising:

a back, wherein the back includes plastic.

25. The handheld communication device of claim 15 , wherein the handheld communication device is a smartphone.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 056676/0600 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2019
From: INTEL CORPORATION
To: INTEL IP CORPORATION
Reel/Frame 048584/0473 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2018
From: THAI, TRANG; DALMIA, SIDHARTH; SOVER, RAANAN; HAGN, JOSEF; ASAF, OMER; SVENDSEN, SIMON
To: INTEL CORPORATION
Reel/Frame 045825/0928 →
Cited By (3)
US 12,218,408 US 12,548,906 US 12,609,448