Method and apparatus for direct transfer of multiple semiconductor devices
An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. Two or more needles are disposed adjacent a second side of the wafer tape opposite the first side. A length of the two or more needles extends in a direction toward the wafer tape. A needle actuator actuates the two or more needles into a die transfer position at which at least one needle of the two or more needles presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.
1. An apparatus for executing a direct transfer of one or more semiconductor device die from a wafer tape to a substrate, the apparatus comprising:
a first frame configured to hold the wafer tape;
a second frame configured to secure the substrate, the second frame configured to hold the substrate such that a transfer surface is disposed facing the one or more semiconductor device die on a first side of the wafer tape held by the first frame, the first frame being located adjacent to the second frame;
two or more needles disposed adjacent a second side of the wafer tape opposite the first side, a length of the two or more needles extending in a direction toward the wafer tape;
a needle actuator configured to actuate the two or more needles into a die transfer position at which at least one needle of the two or more needles presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate; and
a guide to position the two or more needles at specific locations in a matrix configuration, the guide maintaining the matrix configuration of the two or more needles throughout a transfer operation.
2. The apparatus according to claim 1 , wherein each needle of the two or more needles is independently actuatable.
3. The apparatus according to claim 1 , wherein the needle actuator is configured to actuate the two or more needles synchronously.
4. The apparatus according to claim 1 , wherein the needle actuator is configured to actuate the two or more needles sequentially.
5. The apparatus according to claim 1 , wherein the needle actuator includes an electromechanical actuator.
6. The apparatus according to claim 1 , wherein the needle actuator includes one or more return springs.