Hybrid semiconductor transistor structure and manufacturing method for the same
Present disclosure provides a hybrid semiconductor transistor structure, including a substrate, a first transistor on the substrate, a channel of the first transistor including a fin and having a first channel height, a second transistor adjacent to the first transistor, a channel of the second transistor including a nanowire, and a separation laterally spacing the fin from the nanowire. The first channel height is greater than the separation. Present disclosure also provides a method for manufacturing the hybrid semiconductor transistor structure.
1. A method for forming a hybrid semiconductor transistor structure, comprising:
providing a substrate;
epitaxially forming alternating stacked films over the substrate;
forming a trench in the alternating stacked films over a first transistor region; and
filling the trench over the first transistor region with a material different from that of the substrate, wherein the material is in direct contact with the alternating stacked films;
after filling the trench over the first transistor region with the material partially removing the alternating stacked films over a second transistor region and the material obtaining an alternating stacked fin and a fin, wherein the alternating stacked fin is formed from the alternating stacked films, the fin is formed from the material, and the alternating stacked fin and the material are spaced apart from each other after partially removing the alternating stacked films over the second transistor region and the material.
2. The method of claim 1 , further comprising:
forming a dummy gate orthogonally over the fin.
3. The method of claim 2 , wherein the partially removing of the alternating stacked films over the second transistor region and the partially removing of the material are performed concurrently.
4. The method of claim 2 , further comprising:
covering the fin over the first transistor region with a hard mask;
releasing a nanowire from the alternating stacked fin; and
removing the hard mask covering the fin.
5. The method of claim 1 , wherein the forming of the trench comprises forming a vertical sidewall trench or a tapered trench tapering toward the substrate.
6. The method of claim 2 , further comprising:
depositing a first dummy oxide layer over the fin after obtaining the fin; and
annealing the fin so as to transform the first dummy oxide layer to a second dummy oxide layer before forming the dummy gate orthogonally over the fin.
7. The method of claim 2 , further comprising:
depositing a first dummy oxide layer over the fin after obtaining the fin;
removing the dummy gate over the fin to expose the first dummy oxide layer;
annealing the fin so as to transform the first dummy oxide layer to a second dummy oxide layer; and
removing the second dummy oxide layer.
8. A method for forming a hybrid semiconductor transistor structure, comprising:
providing a substrate;
epitaxially forming alternating stacked films over the substrate and in a p-type transistor region and an n-type transistor region;
forming a trench in the alternating stacked films in the p-type transistor region;
filling the trench in the p-type transistor region with silicon germanium; and
after filling the trench in the p-type transistor region with silicon germanium partially removing the alternating stacked films over the n-type transistor region and the silicon germanium obtaining an alternating stacked fin and a silicon germanium fin, wherein the alternating stacked fin is formed from the alternating stacked films, and the silicon germanium fin is formed from the silicon germanium.
9. The method of claim 8 , further comprising:
forming a dummy gate orthogonally over a channel region of the silicon germanium fin and the alternating stacked fin;
removing the dummy gate over the channel region of the silicon germanium fin and the alternating stacked fin; and
releasing a silicon nanowire from the alternating stacked fin in the channel region.
10. The method of claim 9 , further comprising:
depositing a first dummy oxide layer over the silicon germanium fin after obtaining the silicon germanium fin; and
annealing the silicon germanium fin so as to transform the first dummy oxide layer to a second dummy oxide layer before forming the dummy gate orthogonally over the silicon germanium fin.
11. The method of claim 9 , further comprising:
depositing a first dummy oxide layer over the channel region of the silicon germanium fin after obtaining the silicon germanium fin;
removing the dummy gate over the silicon germanium fin to expose the first dummy oxide layer;
annealing the silicon germanium fin so as to transform the first dummy oxide layer to a second dummy oxide layer; and
removing the second dummy oxide layer.
12. The method of claim 8 , wherein forming the trench comprises forming a vertical sidewall trench or a tapered trench tapering toward the substrate.
13. A method for forming a hybrid semiconductor transistor structure, comprising:
providing a substrate;
epitaxially forming alternating stacked films over the substrate;
forming a trench in the alternating stacked films over a first transistor region;
filling the trench with a material different from that of the substrate, wherein the material comprises germanium;
forming a first transistor on the substrate, comprising:
patterning the material obtaining a fin over the first transistor region, wherein the fin is formed from the material, and the first transistor has a first channel height; and
forming a second transistor on the substrate, comprising:
patterning the alternating stacked films over a second transistor region obtaining an alternating stacked fin, wherein the first channel height is greater than a separation between the alternating stacked fin and the fin.
14. The method of claim 13 , wherein the second transistor comprises a second channel height, and the second channel height is substantially identical to the first channel height.
15. The method of claim 13 , wherein the first channel height is greater than 2 times of the separation.
16. The method of claim 13 , wherein the forming of the second transistor on the substrate comprises releasing a nanowire from the alternating stacked fin.
17. The method of claim 13 , wherein the fin of the first transistor comprises Si x Ge 1-x , X being less than 0.6.
18. The method of claim 13 , wherein the forming of the trench in the alternating stacked films over the first transistor region comprises removing the alternating stacked films and obtaining the trench with a tapered sidewall.
19. The method of claim 13 , wherein there is a gap between the fin and the alternating stacked fin, and the method further comprises:
forming an isolation in a lower portion of the gap.
20. The method of claim 13 , wherein the material comprises silicon germanium.