IP Library Granted Patent US 11,208,568
Granted Patent B2
US 11,208,568 · App. 15/981,354 · Granted Dec 28, 2021

Thermal signature control structures

Inventors: Gleb M. Akselrod (Bellevue, WA); Erik Edward Josberger (Seattle, WA); Mark C. Weidman (Bellevue, WA)
Assignee: Elwha LLC
C09D5/32C09D5/006F41H3/00G02B1/002G02B1/116G02B1/118G02B5/204
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,208,568
App. No.
15/981,354
Granted
Dec 28, 2021
Kind
B2
Abstract

Subwavelength conducting particles can be arranged on conducting surfaces to provide arbitrary thermal emissivity spectra. For example, a thermal emissivity spectrum can be tailored to suppress a thermal signature of an object without sacrificing radiative cooling efficiency.

Claims (45)

1. An apparatus, comprising:

a conducting surface;

a plurality of conducting particles arranged on the conducting surface, each particle having a flat surface and forming a planar gap region between the conducting surface and the conducting particle;

wherein the plurality of conducting particles is arranged according to a specific arrangement selected to provide a predetermined thermal emissivity spectrum for the apparatus with respect to a specific radiative cooling efficiency for the apparatus and either or both a size and a shape of each of the plurality of conducting particles are selected to provide the predetermined thermal emissivity spectrum for the apparatus.

2. The apparatus of claim 1 , wherein the predetermined thermal emissivity spectrum is a thermal emissivity spectrum that reduces a thermal signature of the apparatus by a first factor and reduces a radiative cooling efficiency of the apparatus by a second factor that is substantially smaller than the first factor.

3. The apparatus of claim 2 , wherein the thermal signature corresponds to thermal radiance integrated over a selected spectral range of infrared wavelengths.

4. The apparatus of claim 2 , wherein the radiative cooling efficiency corresponds to thermal radiance integrated over all infrared wavelengths.

5. The apparatus of claim 1 , wherein the predetermined thermal emissivity spectrum provides:

an apparent temperature of the apparatus that is substantially less than an actual temperature of the apparatus; and

an actual radiative cooling rate that is substantially greater than an apparent radiative cooling rate.

6. The apparatus of claim 5 , wherein the apparent temperature corresponds to a temperature of a blackbody having a blackbody thermal radiance in a selected spectral range equivalent to an actual thermal radiance of the apparatus in the selected spectral range.

7. The apparatus of claim 1 , wherein each of the conducting particles has a resonant wavelength selected from a set of resonant wavelengths, the set of resonant wavelengths corresponding to a set of sizes of the conducting particles.

8. The apparatus of claim 7 , wherein the set of sizes of the conducting particles is a set of lengths of planar gap regions between the plurality of conducting particles and the conducting surface.

9. The apparatus of claim 7 , wherein the selected thermal emissivity spectrum includes:

one or more spectral ranges of enhanced thermal emissivity that include the set of resonant wavelengths;

one or more spectral ranges of suppressed thermal emissivity that exclude the set of resonant wavelengths.

10. The apparatus of claim 9 , wherein the one or more spectral ranges of suppressed thermal emissivity include a selected spectral range, and the set of resonant wavelengths includes one or more resonant wavelengths below a lower wavelength limit of the selected spectral range or above an upper wavelength limit of the selected spectral range.

11. The apparatus of claim 1 , wherein the plurality of conducting particles is a colloidal assembly of conducting particles on the conducting surface.

12. The apparatus of claim 1 , wherein the plurality of conducting particles is a lithographically-defined arrangement of conducting particles on the conducting surface.

13. The apparatus of claim 3 , wherein the selected spectral range is a range of atmospheric transmission of thermal infrared radiation.

14. The apparatus of claim 3 , wherein the selected spectral range is a range of detector response for a thermal infrared detector.

15. The apparatus of claim 1 , further comprising:

a layer of infrared-transparent material covering the conducting surface and the conducting particles.

16. The apparatus of claim 15 , wherein the layer of infrared-transparent material includes ZnO or FeO particles.

17. A method of fabricating an apparatus, comprising:

arranging a plurality of conducting particles on a conducting surface according to a specific arrangement, each particle having a flat surface and forming a planar gap region between the conducting surface and the conducting particle, wherein the specific arrangement and either or both a size and a shape of each of the plurality of conducting particles are selected to provide a predetermined thermal emissivity spectrum for the apparatus with respect to a specific radiative cooling efficiency for the apparatus.

18. The method of claim 17 , further comprising:

placing a flexible layer on a substrate; and

depositing the conducting surface as a metal layer on the flexible layer.

19. The method of claim 18 , further comprising:

after arranging the plurality of conducting particles, peeling the flexible layer off of the substrate.

20. The method of claim 18 , further comprising:

depositing a spacer layer on the conducting surface.

21. The method of claim 17 , wherein the arranging of the plurality of conducting particles includes:

colloidally assembling the conducting particles on the conducting surface.

22. The method of claim 17 , wherein the arranging of the plurality of conducting particles includes:

photolithographically arranging the plurality of conducting particles on the conducting surface.

23. The method of claim 22 , wherein the photolithographic arranging is a photolithographic arranging by a lift-off process.

24. The method of claim 17 , further comprising:

covering the arranged plurality of conducting particles with an infrared-transparent material.

25. The apparatus of claim 6 , wherein the selected spectral range is a range of atmospheric transmission of thermal infrared radiation.

26. The apparatus of claim 6 , wherein the selected spectral range is a range of detector response for a thermal infrared detector.

27. The apparatus of claim 10 , wherein the selected spectral range is a range of atmospheric transmission of thermal infrared radiation.

28. The apparatus of claim 10 , wherein the selected spectral range is a range of detector response for a thermal infrared detector.

29. The apparatus of claim 1 , wherein the specific radiative cooling efficiency is about 50% of a radiative cooling efficiency of the apparatus absent the plurality of conducting particles arranged on the conducting surface.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2024
From: ELWHA LLC
To: INVENTION SCIENCE FUND II, LLC
Reel/Frame 068723/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2024
From: INVENTION SCIENCE FUND II, LLC
To: METAVC PATENT HOLDING COMPANY
Reel/Frame 068723/0735 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2018
From: AKSELROD, GLEB M.; JOSBERGER, ERIK EDWARD; WEIDMAN, MARK C.
To: ELWHA LLC
Reel/Frame 046251/0861 →
Continuity (2)
Provisional Application 62507496 · May 17, 2017
Related Publication 20180334579A1 · Nov 22, 2018