Photonic interface for electronic circuit
A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.
1. A photonic interface assembly for providing communication between an optical fiber and an electronic circuit on a substrate including: a first port, and a first electrical connection electrically connected to the first port for electrically connecting to the electronic circuit; the photonic interface assembly comprising:
a photonic integrated circuit for mounting on the substrate comprising:
an optical port for optically coupling to the optical fiber for outputting a first optical signal;
a second electrical connection electrically connected to the first port for receiving a first electrical signal from the electronic circuit; and
at least one of a laser and an optical modulator for modulating an optical carrier wave with the first electrical signal to provide the first optical signal; and
a fiber support for optically aligning the optical fiber with the optical port.
2. The photonic interface assembly of claim 1 , wherein the photonic integrated circuit comprises a silicon photonic chip.
3. The photonic interface assembly of claim 1 , wherein the fiber support includes at least one groove of holding the optical fiber in a pre-defined location.
4. The photonic interface assembly of claim 3 , wherein at least one of the fiber support and the photonic integrated circuit comprises a first registration feature for alignment of the fiber support relative to the photonic integrated circuit.
5. The photonic interface assembly of claim 4 , wherein at least one of the fiber support and the photonic integrated circuit comprises a second registration feature comprising a dielectric or semiconductor hard stop extending between the fiber support and the photonic integrated circuit for alignment of the fiber support relative to the photonic integrated circuit in a z-direction.
6. The photonic interface assembly of claim 1 , further comprising a modulator driver chip mounted on the photonic integrated circuit electrically connected to the optical modulator and the electronic circuit for driving the optical modulator.
7. The photonic interface assembly of claim 6 , wherein the laser comprises an SOA chip mounted on the photonic integrated circuit, and optically coupled to a partially reflective optical element on the photonic integrated circuit for providing or amplifying the optical carrier wave.
8. The photonic interface assembly of claim 6 , further comprising an electronic interposer chip, including the modulator driver, mounted in between the photonic integrated circuit and the substrate.
9. The photonic interface assembly of claim 1 , wherein the laser comprises an SOA chip mounted on the photonic integrated circuit, and optically coupled to a partially reflective optical element on the photonic integrated circuit for providing or amplifying the optical carrier wave.
10. The photonic interface assembly of claim 9 , wherein at least one of the SOA chip and the photonic integrated circuit comprises a registration feature comprising a dielectric or semiconductor hard stop extending between the SOA chip and the photonic integrated circuit for alignment of the SOA chip relative to the photonic integrated circuit.
11. The photonic interface assembly of claim 9 , wherein the SOA chip is sunk into the photonic integrated circuit.
12. The photonic interface assembly of claim 1 , further comprising an optical gain chip mounted between the photonic integrated circuit and the substrate, and evanescently optically coupled to the optical modulator for providing the optical carrier wave.
13. The photonic interface assembly of claim 1 , wherein the substrate includes a second port, and a third electrical connection electrically connected to the second port for electrically connecting to the electronic circuit;
wherein the optical port is also for for receiving a second optical signal;
wherein the photonic integrated circuit further comprises:
a photodetector for providing a second electrical signal in response to the second optical signal;
a fourth electrical connection electrically connected to the second port for coupling a second electrical signal to the electronic circuit.
14. The photonic interface assembly of claim 13 , further comprising an electrical preamplifier chip mounted on the photonic integrated circuit, electrically connected to the photodetector and the electronic circuit for amplifying the second electrical signal provided by the photodetector.
15. A photonic interface assembly for providing communication between an optical fiber and an electronic circuit on a substrate including: a first port, and a first electrical connection electrically connected to the first port for electrically connecting to the electronic circuit; the photonic interface assembly comprising:
a photonic integrated circuit for mounting on the substrate comprising:
an optical port for optically coupling to the optical fiber for receiving a first optical signal;
a photodetector for providing a first electrical signal in response to the first optical signal; and
a second electrical connection electrically connected to the first port for coupling the first electrical signal to the electronic circuit; and
a fiber support for optically aligning the optical fiber with the optical port.
16. The photonic interface assembly of claim 15 , wherein the photonic integrated circuit comprises a silicon photonic chip.
17. The photonic interface assembly of claim 15 , wherein the fiber support includes at least one groove of holding the optical fiber in a pre-defined location.
18. The photonic interface assembly of claim 15 , wherein at least one of the fiber support and the photonic integrated circuit comprises a first registration feature for alignment of the fiber support relative to the photonic integrated circuit.
19. The photonic interface assembly of claim 18 , wherein at least one of the fiber support and the photonic integrated circuit comprises a second registration feature comprising a dielectric or semiconductor hard stop extending between the fiber support and the photonic integrated circuit for alignment of the fiber support relative to the photonic integrated circuit in a z-direction.
20. The photonic interface assembly of claim 15 , further comprising an electrical preamplifier chip mounted on the photonic integrated circuit, electrically connected to the photodetector and the electronic circuit for amplifying the first electrical signal provided by the photodetector.