IP Library Granted Patent US 10,231,365
Granted Patent B2
US 10,231,365 · App. 15/982,534 · Granted Mar 12, 2019

Thermal control process for a multijunction electronic power device and corresponding electronic power device

Inventors: Domenico Massimo Porto (Catania, IT); Giovanni Luca Torrisi (Catania, IT); Manuel Gaertner (Feldkirchen, DE); Sergio Lecce (Pavia, IT)
Assignees: STMICROELECTRONICS S.R.L.; STMICROELECTRONICS APPLICATION GMBH
H05K7/20945H01L23/34H01L2924/0002H03K2017/0806Y10T307/773
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Quick Facts
Patent No.
US 10,231,365
App. No.
15/982,534
Granted
Mar 12, 2019
Kind
B2
Abstract

A thermal control process for an electronic power device including a multi junction integrated circuit may include defining a first and at least one second groups of junctions, with each group including one first and at least one second junctions, and associating a thermal detector with each group. A first group control may be executed which detects group electric signals representative of the temperature detected by the thermal detectors, processes the group electric signals with reference to a group critical thermal event, identifies a critical group when the corresponding group electric signal detects the critical group thermal event, and generates group deactivating signals suitable for selectively deactivating the first and the at least one second junctions of the identified critical group with respect to the remaining junctions of the integrated circuit.

Claims (45)

1. A method for identifying a source of heat generation in an electronic device comprising an integrated circuit having a plurality of junction groups, with each junction group comprising a plurality of junctions, and each junction group having a respective thermal detector associated therewith to detect a respective group temperature associated with the respective junction group, the method comprising:

comparing the respective group temperatures with a critical thermal group threshold;

identifying a critical thermal group from among the plurality of junction groups, wherein the junction group having a group temperature exceeding the critical thermal group threshold is identified as the critical thermal group;

deactivating all junctions of the critical thermal group while maintaining the remaining junction groups active; and

subsequent to deactivating all junctions of the critical thermal group, sequentially activating at least one given junction from among the plurality of junctions of the critical thermal group for a predetermined time interval to identify a source of heat generation in the critical thermal group.

2. The method of claim 1 , wherein sequentially activating the at least one junction from among the plurality of junctions of the critical thermal group for the predetermined time interval to identify the source of heat generation in the critical thermal group comprises:

activating the at least one given junction from among the plurality of junctions of the critical thermal group as an at least one active junction while keeping deactivated other junctions from among the plurality of junctions of the critical thermal group;

comparing the group temperature of the critical thermal group having the at least one active junction and the other deactivated junctions to a junction thermal critical threshold; and

identifying the at least one active junction as the source of heat generation in the critical thermal group in response to the group temperature exceeding the junction thermal critical threshold.

3. The method of claim 2 , further comprising deactivating the at least one active junction in response to the group temperature exceeding the junction thermal critical threshold.

4. The method of claim 3 , further comprising activating the other deactivated junctions of the critical thermal group.

5. The method of claim 2 , further comprising:

deactivating the at least one active junction in response to the group temperature being below the junction thermal critical threshold;

activating at least one junction from among the other deactivated junctions as a new at least one active junction while keeping deactivated other junctions from among the plurality of junctions of the critical thermal group;

comparing a new group temperature of the critical thermal group having the at least one new active junction and the other deactivated junctions to the junction thermal critical threshold; and

identifying the at least one new active junction as the source of heat generation in the critical group in response to the new group temperature exceeding the junction thermal critical threshold.

6. The method of claim 2 , wherein the junction thermal critical threshold is less than the critical thermal group threshold.

7. The method of claim 1 , wherein the plurality of junctions of each junction group is arranged according to their spatial arrangement within the integrated circuit.

8. The method of claim 1 , wherein the plurality of junctions of each junction group is arranged according to their operation.

9. The method of claim 1 , wherein each thermal detector generates a respective group electric signal representing a respective detected group temperature, and wherein the method further comprises digitizing the respective group electric signals for comparison with the critical thermal group threshold.

10. The method of claim 1 , wherein comparing the respective group temperatures with the critical thermal group threshold comprises sequentially comparing the respective group temperatures for each junction group with the critical thermal group threshold.

11. An electronic device, comprising:

integrated circuitry having a plurality of junction groups, wherein each junction group comprises a plurality of junctions;

a plurality of thermal detectors, each thermal detector associated with a respective junction group; and

a controller configured to:

compare respective group temperatures with a critical thermal group threshold;

identify a critical thermal group from among the plurality of junction groups, wherein the junction group having a group temperature exceeding the critical thermal group threshold is identified as the critical thermal group;

deactivate all junctions of the critical thermal group while maintaining the remaining junction groups active; and

subsequent to deactivating all junctions of the critical thermal group, sequentially activate at least one given junction from among the plurality of junctions of the critical thermal group for a predetermined time interval to identify a source of heat generation in the critical thermal group.

12. The electronic device of claim 11 , wherein the controller is configured to sequentially activate the at least one junction from among the plurality of junctions of the critical thermal group for the predetermined time interval to identify the source of heat generation in the critical thermal group by:

activating the at least one given junction from among the plurality of junctions of the critical thermal group as an at least one active junction while keeping deactivated other junctions from among the plurality of junctions of the critical thermal group;

comparing the group temperature of the critical thermal group having the at least one active junction and the other deactivated junctions to a junction thermal critical threshold; and

identifying the at least one active junction as the source of heat generation in the critical thermal group in response to the group temperature exceeding the junction thermal critical threshold.

13. The electronic device of claim 12 , wherein the controller is further configured to deactivate the at least one active junction in response to the group temperature exceeding the junction thermal critical threshold.

14. The electronic device of claim 13 , wherein the controller is further configured to activate the other deactivated junctions of the critical thermal group.

15. The electronic device of claim 12 , wherein the junction thermal critical threshold is less than the critical thermal group threshold.

16. The electronic device of claim 12 , wherein the controller is further configured to:

deactivate the at least one active junction in response to the group temperature being below the junction thermal critical threshold;

activate at least one junction from among the other deactivated junctions as a new at least one active junction while keeping deactivated other junctions from among the plurality of junctions of the critical thermal group;

compare a new group temperature of the critical thermal group having the at least one new active junction and the other deactivated junctions to the junction thermal critical threshold; and

identify the at least one new active junction as the source of heat generation in the critical group in response to the new group temperature exceeding the junction thermal critical threshold.

17. The electronic device of claim 11 , further comprising an analog-to-digital (A/D) converter coupled between the plurality of thermal detectors and the controller, wherein the A/D converter is configured to digitize the respective group temperatures.

18. The electronic device of claim 17 , wherein the A/D converter comprises a 10-bit A/D converter.

19. The electronic device of claim 11 , wherein the plurality of junctions of each junction group is arranged according to their spatial arrangement within the integrated circuit.

20. The electronic device of claim 11 , the plurality of junctions of each junction group is arranged according to their operation.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2022
From: STMICROELECTRONICS APPLICATION GMBH
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061796/0841 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061828/0243 →
Priority Claims (1)
IT MI2014A0068 · Jan 21, 2014 · national
Continuity (2)
Continuation 14595391 · Jan 13, 2015
Related Publication 20180270996A1 · Sep 20, 2018