Molded surface mount device LED display module
A light emitting diode (LED) display module includes an array of surface-mount devices (SMDs) arranged in rows and columns on a substrate. Each SMD has red, green, and blue LED chips connected to the substrate and a first transparent resin portion molded around the LED chips; a black resin portion molded around each SMD in a manner to fill spaces between SMDs so as to block light emitted from a sidewall of each SMD; and a second transparent resin portion molded on the first transparent resin portion and the black resin portion.
1. A light emitting diode (LED) display module, comprising:
an array of surface-mount devices (SMDs) arranged in rows and columns on a substrate, each SMD comprising red, green, and blue LED chips connected to the substrate, and a first transparent resin portion molded around the LED chips;
a black resin portion molded around each SMD in a manner to fill spaces between adjacent SMDs in the array of SMDs so that the black resin is in contact with a sidewall of each SMD and is exposed to and blocks light emitted from each SMD when the display module is lit; and
a second transparent resin portion molded on the first transparent resin portion and the black resin portion.
2. The LED display module of claim 1 , wherein the substrate comprises a printed circuit board (PCB).
3. The LED display module of claim 2 , wherein each SMD is electrically connected to pads on the PCB to respond to electrical signals from a controller.
4. The LED display module of claim 1 , wherein the first transparent resin portion is made from an epoxy or a silicone.
5. The LED display module of claim 1 , wherein the second transparent resin portion is made of the same material as that of the first transparent resin portion.
6. The LED display module of claim 1 , wherein the black resin portion is made of a mixture of black pigment and a resin, an epoxy, or a silicone.
7. The LED display module of claim 1 , wherein the first transparent resin portion has flat top and side surfaces.
8. The LED display module of claim 1 , wherein the red, green and blue LED chips are arranged in a linear shape.
9. The LED display module of claim 1 , wherein the second transparent resin portion has a thickness ranging from 100 μm to 700 μm.
10. The LED display module of claim 1 , wherein the second transparent resin portion has a surface having on or more portions that is flat, in a concave shape, or in a convex shape.
11. A light emitting diode (LED) display module, comprising:
an array of surface-mount devices (SMDs) arranged in a matrix on a substrate, each SMD comprising red, green, and blue LED chips, a black sidewall defining a cavity, and a first transparent resin portion molded in the cavity, wherein the black sidewall is exposed to and blocks lights emitted from the LED chips when the display module is lit; and
a second transparent resin portion molded on the first transparent resin portion and molded around each SMD in a manner to fill spaces between adjacent SMDs in the array of SMDs.
12. The LED display module of claim 11 , wherein the second transparent resin portion has flat top and side surfaces.
13. The LED display module of claim 11 , wherein the substrate comprises a printed circuit board (PCB).
14. The LED display module of claim 11 , wherein each SMD has a circular optical window so as to reduce color shift.
15. The LED display module of claim 11 , wherein the second transparent resin portion is made of the same material as that of the first transparent resin portion.
16. The LED display module of claim 11 , wherein the black sidewall is made of a mixture of black pigment and a resin, an epoxy, or a silicone.
17. The LED display module of claim 11 , wherein the second transparent resin portion has a surface having on or more portions that is flat, in a concave shape, or in a convex shape.
18. A method for fabricating a light emitting diode (LED) display module, the method comprising:
providing an array of surface-mount devices (SMDs) arranged in a matrix on a substrate, each SMD comprising red, green and blue LED chips connected to the substrate and a first transparent resin portion molded around the LED chips;
forming a black resin portion molded around each SMD in a manner to fill spaces between adjacent SMDs in the array of SMDs so that the black resin is in contact with a sidewall of each SMD and is exposed to and blocks light emitted from each SMD when the display module is lit; and
forming a second transparent resin portion on the first transparent resin portion and the black resin portion.