Wireless device
The present invention discloses a wireless device, which includes a substrate and an antenna. The antenna includes a printed antenna element and a 3-dimensional antenna element. The printed antenna element is printed on the substrate, while the 3-dimensional antenna element is disposed on the substrate and coupled to the printed antenna element. The printed antenna element and the 3-dimensional antenna element jointly have a physical length of a desired frequency.
1. A wireless device, comprising:
a substrate, comprising a first side and a second side opposite to the first side;
a first chip, disposed on the first side of the substrate;
a second chip, disposed on the second side of the substrate; and
a housing, encapsulating the substrate, the first chip and the second chip, thermally coupled to the first chip, for dissipating heat of the first chip;
wherein the first chip is in direct contact with the housing and the housing is made by a metal, and wherein the housing further has an opening, and the opening facilitates to dissipate heat of the first chip and heat of the second chip to the outside of the wireless device by heat convection.
2. The wireless device of claim 1 , wherein the first chip is a heating element of the wireless device.
3. The wireless device of claim 1 , wherein the second chip is a heating element of the wireless device.
4. The wireless device of claim 1 , wherein the wireless device is a HDMI dongle.
5. The wireless device of claim 1 , wherein the second chip is in direct contact with the housing.
6. A wireless device, comprising:
a substrate, comprising a first side and a second side opposite to the first side;
a first chip, disposed on the first side of the substrate; and
a housing, accommodating the substrate and the first chip, and thermally coupled to the first chip, for dissipating heat of the first chip, wherein portions of the housing are on the first side and the second side of the substrate;
wherein the first chip is in direct contact with the housing and the housing is made by a metal, and wherein the housing further has an opening, and the opening facilitates to dissipate heat of the first chip to the outside of the wireless device by heat convection.
7. The wireless device of claim 6 , further comprising:
a second chip, disposed on the second side of the substrate, having a surface thermally coupled to the housing.
8. The wireless device of claim 6 , wherein the second chip is in direct contact with the housing.
9. The wireless device of claim 6 , wherein the wireless device is a HDMI dongle.