Prepolymerized resin, preparation method thereof, resin composition comprising the same, and article made therefrom
A prepolymerized resin and a preparation method thereof are provided, the method comprising a step of pre-reacting bis(vinylphenyl)ethane and polybutadiene. Bis(vinylphenyl)ethane may include 1,2-bis(4-vinylphenyl)ethane, 1,2-(3-vinylphenyl-4-vinylphenyl)ethane, 1,2-bis(3-vinylphenyl) ethane or a combination thereof. Polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.
1. A method of preparing a prepolymerized resin, comprising subjecting a composition to a pre-reaction in the presence of a polymerization inhibitor, wherein the composition at least comprises bis(vinylphenyl)ethane and polybutadiene, wherein the polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000, wherein the pre-reaction has a conversion rate of between 30% and 90%, and wherein, during the pre-reaction, components in the composition are partially crosslinked to leave residual vinyl groups.
2. The method of claim 1 , wherein the composition further comprises vinyl-containing polyphenylene ether.
3. The method of claim 2 , wherein the vinyl-containing polyphenylene ether comprises vinylbenzyl-terminated polyphenylene ether resin, vinylbenzyl-modified bisphenol A polyphenylene ether resin, methacrylate-terminated polyphenylene ether resin, vinyl-containing chain-extended polyphenylene ether resin or a combination thereof.
4. The method of claim 1 , wherein the polymerization inhibitor comprises hydroquinone, p-benzoquinone, phenothiazine, β-phenylnaphthylamine, 4-t-butylcatechol, methylene blue, 4,4′-butylidenebis(6-t-butyl-3-methylphenol), 2,2′-methylenebis(4-ethyl-6-t-butylphenol) or a combination thereof.
5. The method of claim 1 , wherein peroxide is not used during the pre-reaction.
6. The method of claim 1 , wherein the polybutadiene has a number average molecular weight of between 900 and 1,500.
7. A resin composition comprising a prepolymerized resin and an additive,
wherein the prepolymerized resin is prepared by subjecting a composition to a pre-reaction in the presence of a polymerization inhibitor, the composition at least comprising bis(vinylphenyl)ethane and polybutadiene, wherein the polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000, wherein the pre-reaction has a conversion rate of between 30% and 90%, and wherein, during the pre-reaction, components in the composition are partially crosslinked to leave residual vinyl groups; and
wherein the additive comprises polyphenylene ether, cyanate ester, maleimide resin, polyolefin, acrylate, styrene, divinylbenzene, bis(vinylbenzyl)ether, bis(vinylphenyl)ethane, triallyl isocyanurate, triallyl cyanurate, 1,2,4-trivinyl cyclohexane or a combination thereof.
8. The resin composition of claim 7 , comprising 1 to 200 parts by weight of the additive relative to 100 parts by weight of the prepolymerized resin.
9. The resin composition of claim 7 , further comprising epoxy resin, phenolic resin, benzoxazine resin, styrene maleic anhydride, acrylic acid, polyester, amine curing agent, diallyl bisphenol A, polyamide, polyimide or a combination thereof.
10. The resin composition of claim 7 , further comprising flame retardant, inorganic filler, curing accelerator, solvent, toughening agent, silane coupling agent or a combination thereof.
11. An article made from the resin composition of claim 7 , comprising a resin film, a prepreg, a laminate or a printed circuit board.
12. The article of claim 11 , which has a surface not containing branch-like pattern under visual inspection.
13. The article of claim 12 , having a glass transition temperature as measured by reference to IPC-TM-650 2.4.24.4 of greater than 190° C. and a dissipation factor as measured by reference to JIS C2565 of less than 0.0055.