INTEGRATED SYSTEM FOR SIGNAL AND POWER TRANSMISSION WITH GALVANIC ISOLATION
An integrated system for signal and power transmission with galvanic isolation is disclosed. The integrated system comprises an insulative layer having a primary side and a secondary side; a planar signal transformer and a planar power transformer for signal and power transmission between the primary and the secondary sides of the insulative layer respectively. The planar signal transformer comprises two signal coupling elements which are disposed on the primary and the secondary sides of the insulative layer respectively. The planar power transformer includes two power coupling elements which are disposed on the primary and the secondary sides of the insulative layer respectively. Each of the two signal coupling elements and the two power coupling elements is embedded in at least one layer of a multi-layer printed circuit board. The integrated system of the present disclosure has a compact structure and is suitable for automatic assembly and manufacturing.
1 . An integrated system for signal and power transmission with galvanic isolation, comprising:
an insulative layer having a primary side and a secondary side;
a planar signal transformer for signal transmission between the primary and the secondary sides of the insulative layer, comprising two signal coupling elements which are disposed on the primary and the secondary sides of the insulative layer respectively; and
a planar power transformer for power transmission between the primary and the secondary sides of the insulative layer, comprising two power coupling elements which are disposed on the primary and the secondary sides of the insulative layer respectively,
wherein each of the two signal coupling elements and the two power coupling elements is embedded in at least one layer of a multi-layer printed circuit board.
2 . The integrated system of claim 1 , wherein the two signal coupling elements comprise a first primary winding and a first secondary winding which are disposed on the primary and the secondary sides of the insulative layer respectively.
3 . The integrated system of claim 1 , wherein the two signal coupling elements comprise a primary plate capacitor and a secondary plate capacitor which are disposed on the primary and the secondary sides of the insulative layer respectively.
4 . The integrated system of claim 1 , wherein the two power coupling elements comprise a second primary winding and a second secondary winding which are disposed on the primary and the secondary sides of the insulative layer respectively.
5 . The integrated system of claim 1 , wherein the planar power transformer further comprises two magnetic cores which are disposed on the primary and the secondary sides of the insulative layer respectively to cover the two power coupling elements.
6 . The integrated system of claim 5 , wherein the two magnetic cores comprise two planar magnetic cores which are embedded in two different layers of the multi-layer printed circuit board.
7 . The integrated system of claim 1 , further comprising two electromagnetic shielding plates which are disposed on the primary and the secondary sides of the insulative layer respectively, to cover the planar signal transformer.
8 . The integrated system of claim 1 , further comprising two electromagnetic shielding plates which are disposed on the primary and the secondary sides of the insulative layer respectively, to cover the planar signal transformer and the planar power transformer.
9 . The integrated system of claim 7 , wherein the two electromagnetic shielding plates are embedded in two different layers of the multi-layer printed circuit board.