Infrared temperature measurement and stabilization thereof
Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. One or more embodiments passively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. An overmolded sensor assembly may include an IR sensor, which may include a sensing element or IR element and a circuit or signal processor. The IR element may be thermally bonded with a frame or conductive top hat.
1. An infrared (IR) temperature monitoring system, comprising:
a sensor assembly encased by an overmolding material, the sensor assembly comprising:
an IR temperature sensor having a sensor housing which encases an IR element, wherein the overmolding material encases the IR temperature sensor and the sensor housing;
a metallic frame, wherein the metallic frame encompasses a transmissive window in the closed end of the sensor assembly, wherein the metallic frame provides a stable temperature around the transmissive window; and
a resistive temperature detector operative to provide heat to the metallic frame to stabilize temperature around the transmissive window.
2. The system of claim 1 , wherein the IR element is positioned on a signal processor.
3. The system of claim 1 , wherein the metallic frame is a conductive top hat.
4. The system of claim 1 , wherein the overmolding material is plastic.
5. The system of claim 1 , wherein the metallic frame is formed of copper, aluminum, or other thermally conductive material.
6. The system of claim 1 , wherein the sensor housing is formed of plastic that acts as a lens arranged at one end of the IR element and a baseplate mounted to the other end of the IR element.
7. The system of claim 1 , comprising one or more glass fillers that hermetically seal one or more leads traversing through a baseplate of the IR element.
8. A method for infrared (IR) temperature monitoring, comprising:
encasing an IR element of an IR temperature sensor with a sensor housing;
encasing the IR temperature sensor and the sensor housing with an overmolding material to form an overmolded sensor assembly; and
positioning a metallic frame upon an inner portion of the closed end of the sensor assembly, wherein the metallic frame encompasses a transmissive window in the closed end of the sensor assembly, wherein the metallic frame provides a stable temperature around the transmissive window.
9. The method of claim 8 , wherein the overmolded sensor assembly comprises an integral lens formed of the same material as the overmolding material.
10. The method of claim 8 , wherein the IR element is positioned on a signal processor.
11. The method of claim 10 , wherein the signal processor is implemented as a circuit.
12. The method of claim 8 , wherein the metallic frame is a conductive top hat.
13. The method of claim 8 , wherein the overmolded sensor assembly is cylindrical in shape.
14. The method of claim 8 , wherein the overmolding material is plastic.
15. The method of claim 8 , wherein the metallic frame is formed of copper, aluminum, or other thermally conductive material.
16. A method for infrared (IR) temperature monitoring, comprising:
encasing an IR element of an IR temperature sensor with a sensor housing;
encasing the IR temperature sensor and the sensor housing with an overmolding material to form an overmolded sensor assembly; and
positioning a metallic frame upon an inner portion of the closed end of the sensor assembly, wherein the metallic frame encompasses a transmissive window in the closed end of the sensor assembly, wherein the metallic frame provides a stable temperature around the transmissive window;
an inset molded IR transparent or semi-transparent lens such that a seamless overmolded seal is achieved between the lens and the sensor assembly and the lens is in close thermal contact to metallic frame and sensor element,
wherein the overmolding material and the inset molded IR transparent or semi-transparent lens comprise an infrared-transmitting material.