IP Library Granted Patent US 10,747,110
Granted Patent B2
US 10,747,110 · App. 15/991,063 · Granted Aug 18, 2020

Colored photosensitive resin composition and light shielding spacer prepared therefrom

Inventors: Ji Ung Kim (Hwaseong, KR); Hyung-Tak Jeon (Hwaseong, KR); Kyung-Jae Park (Hwaseong, KR); Jong-Ho Na (Hwaseong, KR); Hyung Gu Kim (Seo-gu, KR)
Assignee: Rohm and Haas Electronic Materials Korea Ltd
G03F7/032G02F1/13394G03F7/0007G03F7/031G03F7/033G03F7/038G03F7/105G03F7/40G02F2001/13398
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Quick Facts
Patent No.
US 10,747,110
App. No.
15/991,063
Granted
Aug 18, 2020
Kind
B2
Abstract

The present invention relates to a colored photosensitive resin composition that prevents the generation of uneven wrinkles when a cured film is formed, to thereby prevent spots that may be generated on the edges of a display upon the formation thereof, and has a short development time. Accordingly, the colored photosensitive resin composition can be advantageously used as a material for forming a protective film, an interlayer insulating film, a light shielding spacer such as a black column spacer, and the like to be employed in various electronic parts inclusive of a liquid crystal display (LCD) panel and an organic light emitting diode (OLED) display panel.

Claims (24)

1. A colored photosensitive resin composition, which comprises:

(A) a copolymer comprising an epoxy group;

(B) a photopolymerizable compound comprising a double bond;

(C) a photopolymerization initiator; and

(D) a colorant comprising a black inorganic colorant,

wherein the colorant comprises 50 to 100% by weight of the black inorganic colorant based on the total weight of the solid content of the colorant, and

the molar ratio of the double bonds in the photopolymerizable compound (B) to the epoxy groups in the copolymer (A) satisfies the following relationship:

4≤number of moles of double bonds/number of moles of epoxy groups≤35.

2. The colored photosensitive resin composition of claim 1 , wherein the black inorganic colorant comprises at least one selected from the group consisting of carbon black, titanium black, a Cu—Fe—Mn-based oxide, and a metal oxide.

3. The colored photosensitive resin composition of claim 1 , wherein the colorant comprises a black organic colorant.

4. The colored photosensitive resin composition of claim 1 , wherein the colorant comprises a dispersion resin, and the dispersion resin has an amine value of 3 mg KOH/g or less and comprises 50% by mole or less of a maleimide monomer based on the total number of moles of the constituent units.

5. The colored photosensitive resin composition of claim 1 , wherein a cured film formed from the colored photosensitive resin composition has an optical density of 1.0/μm to 3.0/μm.

6. The colored photosensitive resin composition of claim 1 , which further comprises (E) a compound derived from an epoxy resin and having a double bond.

7. The colored photosensitive resin composition of claim 6 , wherein the molar ratio of the double bonds in the photopolymerizable compound (B) and in the compound derived from an epoxy resin (E) to the epoxy groups in the copolymer (A) satisfies the following relationship:

4≤number of moles of double bonds/number of moles of epoxy groups≤35.

8. The colored photosensitive resin composition of claim 6 , which further comprises (F) an epoxy compound.

9. The colored photosensitive resin composition of claim 8 , wherein the molar ratio of the double bonds in the photopolymerizable compound (B) and in the compound derived from an epoxy resin (E) to the epoxy groups in the copolymer (A) and in the epoxy compound (F) satisfies the following relationship:

4≤number of moles of double bonds/number of moles of epoxy groups≤35.

10. The colored photosensitive resin composition of claim 1 , which further comprises (F) an epoxy compound.

11. The colored photosensitive resin composition of claim 10 , wherein the molar ratio of the double bonds in the photopolymerizable compound (B) to the epoxy groups in the copolymer (A) and in the epoxy compound (F) satisfies the following relationship:

4≤number of moles of double bonds/number of moles of epoxy groups≤35.

12. The colored photosensitive resin composition of claim 1 , wherein a cured film formed from the colored photosensitive resin composition has an elastic recovery rate of 80% or more.

13. The colored photosensitive resin composition of claim 1 , wherein when a cured film formed from the colored photosensitive resin composition in a size of 3 cm×3 cm×3 μm (width×length×thickness) is immersed in an organic solvent and treated at 100° C. for 1 hour, the organic solvent has an absorbance at 437 nm of 0.5 or less.

14. A light shielding spacer produced from the colored photosensitive resin composition of claim 1 .

Assignments (2)
CHANGE OF NAME Recorded Oct 17, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD
To: DUPONT SPECIALTY MATERIALS KOREA LTD
Reel/Frame 069185/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2020
From: KIM, JI UNG; NA, JONG-HO; JEON, HYUNG-TAK; PARK, KYUNG-JAE; KIM, HYUNG GU
To: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
Reel/Frame 053174/0153 →
Priority Claims (2)
KR 10-2017-0073434 · Jun 12, 2017 · national
KR 10-2018-0053702 · May 10, 2018 · national
Continuity (1)
Related Publication 20180356728A1 · Dec 13, 2018