Switching device having a push button
A cable connection method is provided. In a cable connection structure, a connection agent in which fine solder particle are densely scattered in a thermosetting resin-based adhesive is interposed between a connection portion of a flexible printed cable (FPC) cable in which a shield layer is formed on one surface side of a signal layer and a connection portion on a substrate side. Then, the connection portion of the FPC cable and the connection portion on the substrate side are solder connected by heating. A shield layer corresponding to the connection portion of the FPC cable and/or a region portion up to a position separated from the base end side of the connection portion of the FPC cable by a predetermined length is configured with a conductive mesh structure body. The other region of the shield layer contains a conductive flat plate structure.
1. A cable connection structure comprising:
a substrate; and
an flexible printed circuit (FPC) cable connected to said substrate, wherein said FPC cable includes a shield layer formed on at least one surface side of a signal layer in which a signal line group is arranged, wherein
a cable side connection portion of said FPC cable and a substrate side connection portion to which said FPC cable is connected is solder connected by heating a thermosetting resin-based adhesive in which fine solder particles are densely scattered, and
said cable side connection portion or a region portion up to a position separated from a base end side of said cable side connection portion by a predetermined length in said shield layer is a mesh structure.
2. The cable connection structure of claim 1 , wherein a shield guard is provided in an edge portion of said cable side connection portion of said signal layer, and said shield guard and an edge portion of said shield layer of said cable side connection portion are via bonded to each other.
3. The cable connection structure of claim 2 , wherein said shield layer of said cable side connection portion is via bonded to a ground line in said signal layer.
4. The cable connection structure of claim 3 , wherein an interval of said via bonding is shorter than a wavelength of a signal transmitting in said signal line group.
5. The cable connection structure of claim 1 , wherein said shield layer of said cable side connection portion has an extension region which is exposed to a tip side of said FPC cable and extends an exposed region in which a ground is exposed is formed in an edge portion of said substrate side connection portion corresponding to said extension region.
6. The cable connection structure of claim 5 , wherein said extension region and said exposed region are solder connected to each other.
7. The cable connection structure of claim 5 , wherein said shield layer of said cable side connection portion is via bonded to a ground line in said signal layer.
8. A method comprising:
interposing a connection agent in which fine solder particle are densely scattered in a thermosetting resin-based adhesive between a cable side connection portion of a flexible printed cable (FPC) cable in which a shield layer is formed on at least one surface side of a signal layer in which a signal line group is arranged and a substrate side connection portion to which said FPC cable is connected and arranging said shield layer corresponding to said cable side connection portion or a region portion up to a position separated from a base end side of said cable side connection portion by a predetermined length with a mesh structure;
pressing a hot bar from said shield layer side of said cable side connection portion; and
connecting said cable side connection portion to said substrate side connection portion by soldering.
9. The method of claim 8 , wherein said method further includes
providing a shield guard in an edge portion of said cable side connection portion of said signal layer; and
via bonding said shield guard and an edge portion of said shield layer of said cable side connection portion to each other.
10. The method of claim 9 , wherein said method further includes via bonding said shield layer of said cable side connection portion to a ground line in said signal layer.
11. The method of claim 10 , wherein an interval of said via bonding is shorter than a wavelength of a signal transmitting in said signal line group.
12. The method of claim 8 , wherein said shield layer of said cable side connection portion has an extension region that is exposed to a tip side of said FPC cable and extends a substrate having said substrate side connection portion has an exposed region in which a ground of said substrate is exposed in an edge portion of said substrate side connection portion corresponding to said extension region.
13. The method of claim 12 , wherein said extension region and said exposed region are solder connected to each other.
14. The method of claim 12 , wherein said method further includes via bonding the shield layer of the cable side connection portion to a ground line in the signal layer.