IP Library Granted Patent US 10,892,730
Granted Patent B2
US 10,892,730 · App. 15/993,155 · Granted Jan 12, 2021

Acoustic filter with packaging-defined boundary conditions and method for producing the same

Inventors: You Qian (Singapore, SG); Humberto Campanella-Pineda (Singapore, SG); Rakesh Kumar (Singapore, SG)
Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
H03H9/02086H01L41/0477H01L41/0533H01L41/23H03H3/02H03H9/02031H03H9/13H03H9/205H03H9/562H03H9/564H01L41/187H01L41/1873H01L41/193H03H2003/027
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Quick Facts
Patent No.
US 10,892,730
App. No.
15/993,155
Granted
Jan 12, 2021
Kind
B2
Abstract

A BAW resonator/filter with a monolithic TFE package that defines an acoustic BC and suppresses resonances from the low-Q piezoelectric area of the resonator and resulting devices are provided. Embodiments include a BAW resonator over a dielectric layer, the BAW resonator including a first metal layer, a thin-film piezoelectric layer, and a second metal layer; a first cavity in the dielectric layer under the first metal layer and a second cavity over the first cavity on the second metal layer; and a pair of TFE anchors on the second metal layer, each TFE anchor adjacent to and on an opposite side of the second cavity and extending beyond the first metal layer.

Claims (26)

1. A device comprising:

a first cavity in a dielectric layer;

a bulk acoustic wave (BAW) resonator over the first cavity and the dielectric layer, the BAW resonator comprising a first metal layer, a thin-film piezoelectric layer, and a second metal layer;

a second cavity over the first cavity on the second metal layer;

a pair of thin-film encapsulation (TFE) anchors on the second metal layer, each TFE anchor adjacent to and on an opposite side of the second cavity and extending beyond the first metal layer;

a TFE cap layer on the second metal layer and over the second cavity; and

a TFE seal layer over the TFE cap layer, wherein the pair of TFE anchors comprises the TFE cap layer on the second metal layer.

2. The device according to claim 1 , wherein the first metal layer and the second metal layer comprise molybdenum (Mo), tungsten (W), aluminum (Al), platinum (Pt), or gold (Au).

3. The device according to claim 1 , wherein the thin-film piezoelectric layer comprises aluminum nitride (AlN), scandium aluminum nitride (SLAIN), zinc oxide (ZnO), lithium niobate (LiNbO 3 ), lithium tantalite (LiTaO 3 ), lead zirconate titanate (PZT), or polyvinylidene fluoride (PVDF).

4. The device according to claim 1 , wherein the TFE cap layer comprises AlN, Al 2 O 3 , Al, or a polymer.

5. The device to claim 1 , further comprising:

the TFE cap layer over pair of third cavities, each third cavity adjacent to a TFE anchor and remote from the second cavity; and

the TFE seal layer over the TFE cap layer and on the second metal layer between and adjacent to the second cavity and the third cavities,

wherein the pair of TFE anchors comprises the TFE seal layer on the second metal layer.

6. The device according to claim 5 , wherein the TFE seal layer comprises silicon dioxide (SiO 2 ), silicon nitride (SiN), Al, or a polymer.

7. The device to claim 1 , wherein the pair of TFE anchors define an acoustic boundary condition.

8. The device according to claim 1 , further comprising a plurality of the BAW resonators,

wherein the first metal layer or the second metal layer operatively couples one or more BAW resonators of the plurality of the BAW resonators to form a BAW filter.

9. A device comprising:

a first cavity in a dielectric layer;

a bulk acoustic wave (BAW) resonator over the first cavity and the dielectric layer, the BAW resonator comprising a first molybdenum (Mo), tungsten (W), aluminum (Al), platinum (Pt), or gold (Au) layer, a thin-film piezoelectric layer of the BAW resonator of aluminum nitride (AlN), scandium aluminum nitride (SLAIN), zinc oxide (ZnO), lithium niobate (LiNbO 3 ), lithium tantalite (LiTaO 3 ), lead zirconate titanate (PZT), or polyvinylidene fluoride (PVDF), and a second Mo, W, Al, Pt, or Au layer;

a second cavity over the first cavity on the second metal layer;

a thin-film encapsulation (TFE) cap layer of AlN, Al 2 O 3 , Al, or a polymer on the second metal layer and over the second cavity; and

a TFE seal layer of silicon dioxide (SiO 2 ), silicon nitride (SiN), Al, or a polymer over the TFE cap layer,

wherein the TFE cap layer on the second metal layer is an acoustic boundary condition.

10. The device according to claim 9 , further comprising a plurality of the BAW resonators, wherein the first Mo, W, Al, Pt, or Au layer or the second Mo, W, Al, Pt, or Au layer operatively couples one or more BAW resonators of the plurality of the BAW resonators to form a BAW filter.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2020
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
Reel/Frame 051828/0252 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2018
From: QIAN, YOU; CAMPANELLA-PINEDA, HUMBERTO; KUMAR, RAKESH
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 045948/0703 →