Systems and methods for improved detector assembly sizing
A detector assembly is provided that includes a semiconductor detector, a collimator, and a processing unit. The semiconductor detector has a first surface and a second surface opposed to each other. The first surface includes pixelated anodes, and the second surface includes a cathode electrode. The collimator includes openings defined by septa. The collimator defines a pitch D between adjacent septa, with the septa defining a septa length L. A ratio of L/D is less than 14. The processing unit is configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector. Each pixel comprises a plurality of corresponding virtual sub-pixels, and absorbed photons are counted as events in a corresponding virtual sub-pixel.
1. A detector assembly including:
a semiconductor detector having a first surface and a second surface opposed to each other, the first surface comprising pixelated anodes, and the second surface comprising a cathode electrode;
a collimator including openings defined by septa, the collimator defining a pitch D between adjacent septa, the septa defining a septa length L, wherein a ratio of L/D is less than 14; and
a processing unit configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector, wherein each pixel comprises a plurality of corresponding virtual sub-pixels, wherein absorbed photons are counted as events in a corresponding virtual sub-pixel.
2. The detector assembly of claim 1 , wherein the ratio of L/D is 12 or less.
3. The detector assembly of claim 1 , wherein the ratio of L/D is between 8 or more and 12 or less.
4. The detector assembly of claim 3 , wherein the virtual sub-pixels define a sub-pixel pitch d, wherein a ratio of L/d is 25 or more.
5. The detector assembly of claim 4 , wherein the ratio of L/d is between 25 or more and 80 or less.
6. The detector assembly of claim 1 , wherein the septa length L is 16 millimeters or less.
7. The detector assembly of claim 1 , wherein the pitch D is 1.5 millimeters or less.
8. The detector assembly of claim 1 , wherein the sub-pixel pitch d is 0.5 millimeters or less.
9. The detector assembly of claim 1 , wherein the septa of the collimator are shifted relative to the pixelated anodes, wherein the septa are not aligned with boundaries between the pixelated anodes.
10. A detector assembly including:
a semiconductor detector having a first surface and a second surface opposed to each other, the first surface comprising pixelated anodes, and the second surface comprising a cathode electrode;
a collimator including openings defined by septa, the collimator defining a pitch D between adjacent septa, the septa defining a septa length L; and
a processing unit configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector, wherein each pixel comprises a plurality of corresponding virtual sub-pixels, wherein absorbed photons are counted as events in a corresponding virtual sub-pixel, wherein the virtual sub-pixels define a sub-pixel pitch d, wherein a ratio of L/d is 25 or more.
11. The detector assembly of claim 10 , wherein the ratio of L/D is 12 or less.
12. The detector assembly of claim 10 , wherein the ratio of L/d is between 25 or more and 80 or less.
13. The detector assembly of claim 10 , wherein the septa length L is 16 millimeters or less.
14. The detector assembly of claim 10 , wherein the sub-pixel pitch d is 0.5 millimeters or less.
15. The detector assembly of claim 10 , wherein the sub-pixel pitch d varies along at least one of the length or width of the semiconductor detector.
16. A method including:
providing a semiconductor detector having a first surface and a second surface opposed to each other, the first surface comprising pixelated anodes, and the second surface comprising a cathode electrode;
disposing a collimator proximate the semiconductor detector, the collimator including openings defined by septa, the collimator defining a pitch D between adjacent septa, the septa defining a septa length L, wherein a ratio of L/D is less than 14; and
coupling a processing unit to the semiconductor detector, the processing unit configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector, wherein each pixel comprises a plurality of corresponding virtual sub-pixels, wherein absorbed photons are counted as events in a corresponding virtual sub-pixel.
17. The method of claim 16 , wherein the ratio of L/D is 12 or less.
18. The method of claim 16 , wherein the ratio of L/D is between 8 or more and 12 or less.
19. The method of claim 18 , wherein the virtual sub-pixels define a sub-pixel pitch d, wherein a ratio of L/d is 25 or more.
20. The method of claim 16 , wherein the processing unit is configured to reconstruct a 3-dimensional image based on a virtual sub-pixel location for each detected event and on a location of a corresponding collimator bore associated with a pixel including the corresponding virtual sub-pixel.