Method of producing an electronic device
A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.
1. A method of producing an electronic device, comprising the steps of:
operating a jetting device to deposit drops of an adhesive material in a first pattern on a surface of a first substrate;
vaporizing water in the adhesive and heating the first substrate to a temperature between 25° C. and 200° C.;
bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;
activating the adhesive material while the portion of the metal foil is in contact with the adhesive material; and
separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate.
2. The method of claim 1 , further including the step of applying a further adhesive material in a second pattern on top of the transferred metal foil, depositing a further metallic material on top of the second pattern, wherein the further metallic material is conductively coupled to a portion of the transferred metallic material.
3. The method of claim 2 , wherein the step of applying the further adhesive material includes the step of applying the further adhesive material such that no portion of the second pattern of the further adhesive material extends beyond the first pattern of adhesive material.
4. The method of claim 2 , further including the step of applying a non-conductive material between the further adhesive material and the transferred metal foil.
5. The method of claim 4 , wherein the non-conductive material has a thickness between 200 Angstroms and 10,000 Angstroms.
6. The method of claim 4 , further including the steps of forming a first via from a top surface of the further adhesive material to a top surface of the non-conductive material, and forming a second via from a top surface of the non-conductive material to a top surface of the transferred metal foil, wherein first via and the second via combine to couple the top surface of the further adhesive material with the top surface of the metal foil.
7. The method of claim 5 , wherein a diameter of the first via is substantially different that a diameter of the second via.
8. The method of claim 1 , wherein the first pattern of the adhesive material has a thickness between 200 and 10,000 Angstroms.
9. The method of claim 1 , wherein the step of activating the adhesive includes the step of applying pressure in a range between about 10 psi to about 25 psi.