Chip on carrier
View Patent ↗A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer.
1. A chip on a carrier, comprising:
a first substantially planar isolation layer with a first surface and a second surface opposite the first surface;
a first substantially planar conduction layer with a first surface and a second surface opposite the first surface, the first surface of the first conduction layer positioned adjacent to the second surface of the first isolation layer;
a second substantially planar isolation layer with a first surface and a second surface opposite the first surface, the first surface of the second isolation layer positioned adjacent to the second surface of the first conduction layer;
a second conduction layer etched on the second surface of the second isolation layer, the second conduction layer including:
an anode trace; and
a cathode trace;
an optical transmitter positioned on the cathode trace;
a heating resistor positioned on the second surface of the second isolation layer; and
one or more vias through the second isolation layer that electrically couple the anode trace with the first conduction layer.
2. The chip of claim 1 , wherein the first isolation layer includes a thickness between the first surface and the second surface of the first isolation layer of approximately 0.10-0.50 millimeters (mm).
3. The chip of claim 1 , wherein the second isolation layer includes a thickness between the first surface and the second surface of the second isolation layer of approximately 0.10-0.30 millimeters (mm).
4. The chip of claim 1 , wherein the first isolation layer includes a thickness between the first surface and the second surface of the first isolation layer of approximately 0.10-0.50 millimeters (mm) and the second isolation layer includes a thickness between the first surface and the second surface of the second isolation layer of approximately 0.10-0.30 mm.
5. The chip of claim 4 , wherein the first isolation layer includes a thickness of approximately 0.15-0.30 mm and the second isolation layer includes a thickness of approximately 0.10-0.20 mm.
6. The chip of claim 1 , wherein the one or more vias comprises four vias and wherein each via of the four vias includes a circular cross section of approximately 0.08 millimeters (mm)-0.12 mm in diameter.
7. The chip of claim 6 , wherein a center of a first via of the four vias is positioned approximately 0.085 mm-0.01 mm from a first side of the second conduction layer and approximately 0.2 mm-0.3 mm from a second side of the second conduction layer, the first side and the second side forming a right angle, a center of a second via of the four vias is positioned approximately 0.085 mm-0.01 mm from the first side and approximately 0.4 mm-0.54 mm from the second side, a center of a third via of the four vias is positioned approximately 0.6 mm-0.63 mm from the first side and approximately 0.4 mm-0.54 mm from the second side, and a center of a fourth via of the four vias is positioned approximately 0.6 mm-0.63 mm from the first side and approximately 0.2 mm-0.3 mm from the second side.
8. The chip of claim 1 , wherein the anode trace comprises a substantially U-shaped pattern along an outer perimeter of the second conduction layer and the cathode trace comprises a substantially O-shaped pattern inside the anode trace.
9. The chip of claim 8 , wherein the heating resistor is positioned inside the cathode trace.
10. A chip on a carrier, comprising: a first substantially planar isolation layer with a first surface and a second surface opposite the first surface; a first substantially planar conduction layer with a first surface and a second surface opposite the first surface, the first surface of the first conduction layer positioned adjacent to the second surface of the first isolation layer; a second substantially planar isolation layer with a first surface and a second surface opposite the first surface, the first surface of the second isolation layer positioned adjacent to the second surface of the first conduction layer; a second conduction layer etched on the second surface of the second isolation layer, the second conduction layer including: an anode trace; a cathode trace; and an optical transmitter positioned on the cathode trace; and one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer; wherein the anode trace comprises a substantially U-shaped pattern along an outer perimeter of the second conduction layer and the cathode trace comprises a substantially O-shaped pattern inside the anode trace.
11. The chip of claim 10 , wherein the first isolation layer includes a thickness between the first surface and the second surface of the first isolation layer of approximately 0.10-0.50 millimeters (mm).
12. The chip of claim 10 , wherein the second isolation layer includes a thickness between the first surface and the second surface of the second isolation layer of approximately 0.10-0.30 millimeters (mm).
13. The chip of claim 10 , wherein the first isolation layer includes a thickness between the first surface and the second surface of the first isolation layer of approximately 0.10-0.50 millimeters (mm) and the second isolation layer includes a thickness between the first surface and the second surface of the second isolation layer of approximately 0.10-0.30 mm.
14. The chip of claim 13 , wherein the first isolation layer includes a thickness of approximately 0.15-0.30 mm and the second isolation layer includes a thickness of approximately 0.10-0.20 mm.
15. The chip of claim 10 , wherein the one or more vias comprises four vias and wherein each via of the four vias includes a circular cross section of approximately 0.08 millimeters (mm)-0.12 mm in diameter.
16. The chip of claim 15 , wherein a center of a first via of the four vias is positioned approximately 0.085 mm-0.01 mm from a first side of the second conduction layer and approximately 0.2 mm-0.3 mm from a second side of the second conduction layer, the first side and the second side forming a right angle, a center of a second via of the four vias is positioned approximately 0.085 mm-0.01 mm from the first side and approximately 0.4 mm-0.54 mm from the second side, a center of a third via of the four vias is positioned approximately 0.6 mm-0.63 mm from the first side and approximately 0.4 mm-0.54 mm from the second side, and a center of a fourth via of the four vias is positioned approximately 0.6 mm-0.63 mm from the first side and approximately 0.2 mm-0.3 mm from the second side.
17. A method to manufacture a chip on a carrier, the chip on carrier comprising a first substantially planar isolation layer with a first surface and a second surface opposite the first surface, the method comprising: positioning a first surface of a first substantially planar conduction layer adjacent to the second surface of the first isolation layer; positioning a first surface of a second substantially planar isolation layer adjacent to a second surface of the first conduction layer, the second surface of the first conduction layer opposite the first surface of the first conduction layer; etching a second conduction layer on a second surface of the second isolation layer, the second surface of the second isolation layer opposite the first surface of the second isolation layer, etching a second conduction layer on a second surface of the second isolation layer, the second surface of the second isolation layer opposite the first surface of the second isolation layer, the second conduction layer including: an anode trace; a cathode trace; positioning an optical transmitter on the cathode trace; creating one or more vias through the second isolation layer to electrically couple the anode trace with the first conduction layer; and positioning a heating resistor on the second surface of the second isolation layer.