Using MEMS fabrication incorporating into LED device mounting and assembly
LED chip packaging assembly that facilitates an integrated method for mounting LED chips as a group to be pre-wired to be electrically connected to each other through a pattern of extendable metal wiring lines is provided. LED chips which are electrically connected to each other through extendable metal wiring lines, replace pick and place mounting and the wire bonding processes of the LED chips, respectively. Wafer level MEMS technology is utilized to form parallel wiring lines suspended and connected to various contact pads. Bonding wires connecting the LED chips are made into horizontally arranged extendable metal wiring lines which can be in a spring shape, and allowing for expanding and contracting of the distance between the connected LED chips. A tape is further provided to be bonded to the LED chips, and extended in size to enlarge distance between the LED chips to exceed the one or more prearranged distances.
1. An integrated fabrication method to form a light-emitting device assembly, comprising:
forming a LED chip having a pair of contact pads;
forming a seed layer having a first portion and a second portion, and the first portion is aligned with respect to the pair of contact pads of the LED chip;
forming a photoresist layer with a plurality of openings;
forming a plurality of extendable metal wiring lines and a plurality of contacting electrodes aligned with respect to the pair of contact pads of the LED chip by filling a metal material into the openings of the photoresist layer, and each of the extendable metal wiring lines being suspended and connected to a pair of adjacent contacting electrodes; and
removing the second portion of the seed layer.
2. The integrated fabrication method as claimed in claim 1 , wherein the extendable metal wiring lines are arranged to form a predefined pattern suspended above the plurality of LED chips.
3. The integrated fabrication method as claimed in claim 1 , further comprising: mounting the LED chip onto a final substrate after the step of removing the second portion of the seed layer.
4. The integrated fabrication method as claimed in claim 3 , wherein the final substrate is a glass substrate or a PCB board.
5. An integrated fabrication method to form a light-emitting device assembly, comprising:
forming a plurality of LED chips, each of the LED chips comprising a pair of contact pads;
forming a seed layer having a first portion and a second portion, and the first portion is aligned with respect to the pair of contact pads of each of the LED chips;
forming a photoresist layer with a plurality of openings;
forming a plurality of extendable metal wiring lines and a plurality of contacting electrodes aligned with respect to the pair of contact pads of each of the LED chips by filling a metal material into the openings of the photoresist layer, and each of the extendable metal wiring lines being suspended and connected to a pair of adjacent contacting electrodes;
forming a plurality of scribing lines at the sides adjacent to the LED chips; and
removing the second portion of the seed layer.
6. The integrated fabrication method as claimed in claim 5 , wherein the extendable metal wiring lines are arranged to form a predefined pattern suspended above the LED chips.
7. The integrated fabrication method as claimed in claim 5 , further comprising: mounting the LED chips onto a final substrate after the step of removing the second portion of the seed layer.
8. The integrated fabrication method as claimed in claim 7 , wherein the final substrate is a glass substrate or a PCB board.
9. The integrated fabrication method as claimed in claim 5 , wherein the scribing lines extend in a direction from the LED chips to the extendable metal wiring lines.
10. The integrated fabrication method as claimed in claim 5 , further comprising: forming a plating layer on the contacting electrodes after the step of forming the extendable metal wiring lines and the contacting electrodes.