Electronic device with relay mounted to substrate
View Patent ↗An electronic device includes a substrate having a top surface, a bottom surface and at least one opening therethrough. The substrate has circuitry. A relay is mounted to the substrate and is electrically connected to the circuitry. The relay has a switching device configured to activate the relay. The switching device has contacts electrically connected to the circuitry. The relay is mounted to the substrate in the opening such that at least a portion of the switching device is positioned above the top surface and at least a portion of the switching device is positioned below the top surface.
1. An electronic device comprising:
a substrate having a top surface, a bottom surface and at least one opening therethrough, the substrate having circuitry forming a power circuit; and
a relay mounted to the substrate and electrically connected to the circuitry, the relay having a switching device configured to activate the relay, the switching device having contacts forming a power control circuit through the switching device, the contacts extending between first ends and second ends, the first ends extending from sides of the switching device and the second ends being terminated to the substrate for direct electrical connection to the power circuit of the circuitry to electrically connect the power control circuit of the switching device to the power circuit of the substrate for control of the power circuit by the switching device, the relay being mounted to the substrate in the opening such that at least a portion of the switching device is positioned above the top surface and at least a portion of the switching device is positioned below the bottom surface, wherein a top of the switching device is positioned above the upper surface a first distance and a bottom of the switching device is positioned below the bottom surface a second distance, the first distance being approximately equal to the second distance.
2. The electronic device of claim 1 , wherein the switching device extends entirely through the substrate in the opening.
3. The electronic device of claim 1 , wherein at least a portion of the switching device is positioned above the bottom surface and at least a portion of the switching device is positioned below the bottom surface.
4. The electronic device of claim 1 , wherein the switching device is suspended in the opening by the contacts.
5. The electronic device of claim 1 , wherein the contacts are terminated to the circuitry at the top surface of the substrate.
6. The electronic device of claim 1 , wherein the contacts extend from the sides at an elevation above the top surface of the substrate.
7. The electronic device of claim 1 , wherein the sides face the opening.
8. The electronic device of claim 1 , wherein the contacts have mounting pads positioned above the bottom of the switching device of the relay and positioned below the top of the switching device of the relay.
9. The electronic device of claim 1 , wherein the opening is provided at an edge of the substrate, the edge defining a thickness profile of the substrate between the top surface and the bottom surface, the switching device being positioned within the thickness profile of the substrate.
10. The electronic device of claim 9 , wherein the switching device extends outward beyond the edge.
11. The electronic device of claim 1 , wherein the switching device includes a housing forming the top, the bottom and the sides, at least a portion of the housing is positioned above the top surface and at least a portion of the housing is positioned below the bottom surface.
12. The electronic device of claim 1 , wherein the switching device includes a solid state element.
13. The electronic device of claim 1 , wherein the switching device includes a solenoid.
14. An electronic device comprising:
a substrate having a top surface, a bottom surface and having a thickness profile defined between the top surface and the bottom surface of the substrate, the substrate having an opening therethrough, the substrate having circuitry forming a power circuit; and
a relay received in the opening and electrically connected to the power circuit of the circuitry to control the power circuit, the relay having a switching device configured to activate the relay, the switching device having contacts extending from the switching device electrically connected to the power circuit of the circuitry, the relay being mounted to the substrate in the opening such that the switching device is arranged within the thickness profile of the substrate substantially centered relative to the substrate, wherein a top of the switching device is positioned above the upper surface a first distance and a bottom of the switching device is positioned below the bottom surface a second distance, the first distance being approximately equal to the second distance.
15. The electronic device of claim 14 , wherein the relay is mounted to the substrate in the opening such that at least a portion of the switching device is positioned above the top surface and at least a portion of the switching device is positioned below the bottom surface.
16. The electronic device of claim 14 , wherein the switching device extends entirely through the substrate in the opening.
17. The electronic device of claim 14 , wherein the switching device is suspended in the opening by the contacts.
18. The electronic device of claim 14 , wherein the contacts are terminated to the circuitry at the top surface of the substrate.
19. The electronic device of claim 14 , wherein the contacts extend from the sides at an elevation above the top surface of the substrate.