Substrate for mounting light emitting diodes with testing capabilities

1. A method comprising:

picking up one or more light emitting diodes (LEDs) from a first substrate;

placing the one or more LEDs onto a second substrate with one or more cathode electrodes and one or more anode electrodes of the one or more LEDs connected to conductive components on the second substrate, wherein the second substrate is a final substrate configured to be connected to a display driver circuit for displaying images using the one or more LEDs;

applying a voltage difference between the one or more anode electrodes and the one or more cathode electrodes of the one or more LEDs placed on the second substrate via one or more transistors and one or more conductive traces in the second substrate; and

determining whether the one or more LEDs satisfies a threshold level of operability responsive to applying the voltage difference.

2. The method of claim 1 , wherein applying the voltage difference comprises:

applying a gate voltage to one or more first probe pads on the second substrate to turn on the one or more transistors;

applying a first voltage to the one or more anode electrodes of the one or more LEDs via one or more second probe pads on the second substrate and the one or more transistors; and

applying a second voltage to the one or more cathode electrodes of the one or more LEDs via one or more third probe pads on the second substrate, the second voltage lower than the first voltage.

3. The method of claim 2 , wherein the applied gate voltage is at least a threshold voltage of the one or more transistors.

4. The method of claim 2 , wherein the first substrate is a carrier substrate mounted with LEDs emitting light of a same color, and an output voltage from the display driver circuit is provided to a conductive trace on the second substrate providing the first voltage to the one or more anode electrodes of the one or more LEDs.

5. The method of claim 2 , further comprising detecting current leakage in the second substrate by:

applying the voltage difference to one set of probe pads among a plurality of sets of probe pads, and

detecting turning on of one or more LEDs that are designed to be isolated from the one set of the probe pads.

6. The method of claim 1 , wherein placing the one or more LEDs onto the second substrate comprises bonding the one or more anode electrodes of the one or more LEDs and the one or more cathode electrodes of the one or more LEDs to the conductive components on the second substrate by thermocompression bonding.

7. The method of claim 5 , further comprising discarding the second substrate responsive to detecting that the one or more LEDs is not turned on responsive to applying the voltage difference.

8. The method of claim 1 , wherein gate terminals of at least a subset of the one or more transistors are connected together, source terminals of the at least the subset of the one or more transistors are connected together, and drain terminals of the at least the subset of the one or more transistors are connected together.

9. The method of claim 1 further comprising:

responsive to determining that the one or more LEDs satisfies the threshold level of operability, picking up an additional LED from the first substrate; and

placing the additional LED onto the second substrate with a cathode electrode and an anode electrode of the additional LED connected to the conductive components on the second substrate.

10. A substrate for mounting a plurality of light emitting diodes (LEDs), comprising:

first conductive components configured to connect with cathode electrodes of the plurality of LEDs;

second conductive components configured to connect with anode electrodes of the plurality of LEDs; and

transistors on the substrate during a testing operation to determine connection of one or more of the plurality of LEDs, the transistors configured to apply a voltage difference between the cathode electrodes via the first conductive components and the anode electrodes via the second conductive components,

wherein the substrate is configured to be connected to a display driver circuit for displaying images using the plurality of LEDs.

11. The substrate of claim 10 , wherein the transistors are placed in an inactive state after the plurality of LEDs are connected to the display driver circuit.

12. The substrate of claim 10 , further comprising:

one or more first probe pads on the substrate configured to receive a gate voltage to turn on the transistors;

one or more second probe pads on the substrate configured to receive a first voltage to apply to the anode electrodes via the transistors; and

one or more third probe pads on the substrate configured to receive a second voltage to apply to the cathode electrodes, the second voltage lower than the first voltage.

13. The substrate of claim 12 , wherein the received gate voltage is at least a threshold voltage of the transistors.

14. The substrate of claim 12 , further comprising a conductive trace providing the first voltage from the one or more second probe pads to the one or more anode electrodes of at least one LED.

15. The substrate of claim 12 , wherein one of the first probe pads is coupled to gates of a first set of the transistors, another of the first probe pads is coupled to gates of a second set of transistors, one of the second probe pads is coupled to anode electrodes of the first set of transistors, and another of the second probe pads is coupled to cathode electrodes of the second set of transistor.

16. The substrate of claim 10 , wherein the substrate is discarded responsive to detecting that the at least one of the plurality of the LEDs is not turned on responsive to applying the voltage difference.

17. The substrate of claim 10 , wherein gate terminals of at least a subset of the transistors are connected together, source terminals of at least the subset of the transistors are connected together, and drain terminals of at least the subset of the transistors are connected together.

18. A non-transitory computer readable medium storing instructions that when executed by a processor of a display manufacturing system cause the processor to:

pick up one or more light emitting diodes (LEDs) from a first substrate;

place the one or more LEDs onto a second substrate with one or more cathode electrodes and one or more anode electrodes of the one or more LEDs connected to conductive components on the second substrate, wherein the second substrate is a final substrate configured to be connected to a display driver circuit for displaying images using the one or more LEDs;

apply a voltage difference between the one or more anode electrodes and the one or more cathode electrodes of the one or more LEDs placed on the second substrate via one or more transistors and one or more conductive traces in the second substrate; and

determine whether the one or more LEDs satisfies a threshold level of operability responsive to applying the voltage difference.

19. The computer readable medium of claim 18 , further storing instruction that cause the processor to:

apply a gate voltage to one or more first probe pads on the second substrate to turn on the one or more transistors;

apply a first voltage to the one or more anode electrodes of the one or more LEDs via one or more second probe pads on the second substrate and the one or more transistors; and

apply a second voltage to the one or more cathode electrodes of the one or more LEDs via one or more third probe pads on the second substrate, the second voltage lower than the first voltage.

20. The computer readable medium of claim 18 , further storing instructions that cause the processor to:

apply a gate voltage to a first subset of the one or more transistors via a first probe pad at a first time;

apply the gate voltage to a second subset of the one or more transistors via a second probe pad at a second time different from the first time;

detect turning on of the one or more transistors to determine current leakage in the second substrate.