IP Library Granted Patent US 10,613,598
Granted Patent B2
US 10,613,598 · App. 16/010,013 · Granted Apr 7, 2020

Externally mounted component cooling system

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Quick Facts
Patent No.
US 10,613,598
App. No.
16/010,013
Granted
Apr 7, 2020
Kind
B2
Abstract

An externally mounted component cooling system includes a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing. An air inlet is defined by the chassis and extends through the chassis from the outer surface to the chassis housing. At least one external component mounting feature is included on the outer surface of the chassis adjacent the air inlet. An external component is coupled to the at least one external component mounting feature. A forced convection device is located in the chassis housing and is configured to generate an airflow through chassis housing. The generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component.

Claims (50)

1. An externally mounted component cooling system, comprising:

a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing;

an air inlet defined by the chassis and extending through the chassis from the outer surface to the chassis housing;

at least one external component mounting feature included on the outer surface of the chassis adjacent the air inlet;

an external component that includes a heat producing device stacked upon a heat dissipation device, coupled to the at least one external component mounting feature; and

a forced convection device located in the chassis housing and configured to generate an airflow through chassis housing, wherein the generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component.

2. The system of claim 1 , further comprising:

an air outlet defined by the chassis and extending through the chassis from the outer surface to the chassis housing, wherein the forced convection device is configured to generate the airflow through chassis housing and out of the air outlet.

3. The system of claim 1 , further comprising:

at least one gasket member that is coupled to the external component and configured to direct air past the external component and through the air inlet.

4. The system of claim 1 , further comprising:

wherein the heat dissipation device is configured to directly engage the at least one external component mounting feature to couple the external component to the at least one external component mounting feature.

5. The system of claim 4 , further comprising:

a seal that is located between at least a portion of the heat dissipation device and the outer surface of the chassis.

6. The system of claim 1 , further comprising:

a cooling engine included in the chassis, wherein the cooling engine is configured to:

detect that the external component is coupled to the at least one external component mounting feature and, in response, modify the operation of the forced convection device.

7. An Information Handling System (IHS), comprising:

a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing;

an air inlet defined by the chassis and extending through the chassis from the outer surface to the chassis housing;

at least one external component mounting feature that is included on the outer surface of the chassis adjacent the air inlet, wherein the at least one external component mounting feature is configured to couple to an external component; and

a forced convection device that is located in the chassis housing and that is configured to generate an airflow through the chassis housing, wherein the generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component when the external component is coupled to the at least one external component mounting feature, the external component includes a heat producing device stacked upon a heat dissipation device.

8. The IHS of claim 7 , further comprising:

an air outlet defined by the chassis and extending through the chassis from the outer surface to the chassis housing, wherein the forced convection device is configured to generate the airflow through chassis housing and out of the air outlet.

9. The IHS of claim 7 , further comprising:

at least one gasket member that is coupled to the outer surface of the chassis, wherein the at least one gasket member is configured to direct air past the external component and through the air inlet when the external component is coupled to the at least one external component mounting feature.

10. The HIS of claim 7 , wherein the at least one external component mounting feature is configured to directly engage the heat dissipation device that is mounted to the heat producing device in order to couple the external component to the at least one external component mounting feature.

11. The IHS of claim 10 , further comprising:

a seal that is located on the outer surface of the chassis, wherein the seal is configured to be located between at least a portion of the heat dissipation device and the outer surface of the chassis when the heat dissipation device directly engages the at least one external component mounting feature.

12. The IHS of claim 7 , further comprising:

a processing system that is located in the chassis housing; and

a memory system that is located in the chassis housing, coupled to the processing system, and that includes instructions that, when executed by the processing system, cause the processing system to provide a cooling engine that is configured to:

detect that the external component is coupled to the at least one external component mounting feature and, in response, modify the operation of the forced convection device.

13. The IHS of claim 12 , wherein the detecting that the external component is coupled to the at least one external component mounting feature includes:

monitoring a plurality of cooling factors associated with the operation of the forced convection device;

comparing the plurality of cooling factors to at least one cooling profile; and

detecting that the external component is coupled to the at least one external component mounting feature based on the comparing of the plurality of cooling factors and the at least one cooling profile.

14. A method for cooling an external component, comprising: generating, by a forced convection device that is located in a chassis housing defined by a chassis that includes an outer surface opposite the chassis from the chassis housing, an airflow through the chassis housing; drawing, in response to the generation of the airflow, air past an external component that is coupled to at least one external component mounting feature included on the outer surface of the chassis, and through an air inlet that is defined by the chassis adjacent the at least one external component mounting feature and that extends through the chassis to the chassis housing; and cooling, via the air drawn past the external component and through the air inlet, the external component, wherein the external component includes a heat producing device stacked upon a heat dissipation device.

15. The method of claim 14 , wherein the airflow generated by the forced convection device is directed out of an air outlet that is defined by the chassis and that extends through the chassis from the outer surface to the chassis housing.

16. The method of claim 14 , further comprising:

directing, by at least one gasket member that engages the outer surface of the chassis, the air past the external component and through the air inlet.

17. The method of claim 14 , wherein the at least one external component mounting feature directly engages the heat dissipation device that is mounted to the heat dissipation device in order to couple the external component to the at least one external component mounting feature.

18. The method of claim 17 , further comprising:

providing a seal between the outer surface of the chassis and at least a portion of the heat dissipation device when the heat dissipation device directly engages the at least one external component mounting feature.

19. The method of claim 14 , further comprising:

detecting, by a cooling engine that is located in the chassis housing, that the external component is coupled to the at least one external component mounting feature and, in response, modifying the operation of the forced convection device.

20. The method of claim 19 , wherein the detecting that the external component is coupled to the at least one external component mounting feature includes:

monitoring a plurality of cooling factors associated with the operation of the forced convection device;

comparing the plurality of cooling factors to at least one cooling profile; and

detecting that the external component is coupled to the at least one external component mounting feature based on the comparing of the plurality of cooling factors and the at least one cooling profile.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (047648/0422) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060160/0862 →
RELEASE OF SECURITY INTEREST AT REEL 047648 FRAME 0346 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0510 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 047648/0346 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 12, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 047648/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2018
From: HELBERG, CHRISTOPHER MICHAEL; KEILERS, CYRIL ADAIR; HOSS, SHAWN PAUL
To: DELL PRODUCTS L.P.
Reel/Frame 046103/0264 →