IP Library Granted Patent US 11,006,882
Granted Patent B2
US 11,006,882 · App. 16/010,393 · Granted May 18, 2021

Medical sensor

Inventors: Scott Nelson (Georgetown, MA); Richard Kolenda (Groton, MA); Libing Zhang (Sharon, MA)
Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
A61B5/24A61B5/68335A61B2562/164A61B2562/166
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Quick Facts
Patent No.
US 11,006,882
App. No.
16/010,393
Granted
May 18, 2021
Kind
B2
Abstract

In an aspect, the present disclosure discloses a medical sensor to be connected to a monitoring device for vital sign monitoring. The medical sensor includes a flexible circuit layer having an electrode pattern, a foam layer laminated on the flexible circuit layer, a bonding layer sandwiched between the flexible circuit layer and the foam layer to bond the foam layer with the flexible circuit layer, and a gel sponge disposed on and electrically connected to the electrode pattern through the foam layer and the bonding layer. The area of the bonding layer is smaller than the area of the foam layer. A part of the foam layer adjacent the perimeter is not covered by the bonding layer, and not bonded to the flexible circuit layer by the bonding layer to provide the medical sensor enough conformability to a body.

Claims (13)

1. A medical sensor to be connected to a monitoring device for vital sign monitoring, comprising:

a flexible circuit layer comprising a substrate and an electrode pattern printed on one of opposite sides of the substrate;

a foam layer laminated on the flexible circuit layer, and defining an opening in alignment with the electrode pattern facing the foam layer;

a bonding layer sandwiched between the flexible circuit layer and the foam layer to bond the foam layer with the flexible circuit layer, the bonding layer defining an opening in alignment with the opening of the foam layer, wherein the area of the bonding layer is smaller than the area of the foam layer, a part of the foam layer adjacent a perimeter thereof is not covered by the bonding layer, and not bonded to the flexible circuit layer by the bonding layer;

a gel sponge disposed on the electrode pattern through the openings of the foam layer and the bonding layer to enable the gel sponge to electrically connect to the electrode pattern;

wherein the area of the foam layer is smaller than or equal to that of the flexible circuit layer, in a direction perpendicular to a stacking thereof, and the flexible circuit layer completely overlies the foam layer.

2. The medical sensor of claim 1 , wherein outer perimeter of the foam layer falls within outer perimeter of the substrate of the flexible circuit layer.

3. The medical sensor of claim 1 , wherein the thickness of the gel sponge is slightly larger than the total thickness of the foam layer and the bonding layer.

4. The medical sensor of claim 1 , further comprising a release liner adhered to a side of the foam layer opposite to the flexible circuit layer.

5. The medical sensor of claim 1 , further comprising a stiffener disposed on the side of the substrate of the flexible circuit layer opposite to the foam layer and in alignment with the electrode pattern, wherein the stiffener is hard enough to keep the shape of the electrode pattern.

6. The medical sensor of claim 5 , wherein the stiffener is substantially the same in size and shape as the electrode pattern.

7. The medical sensor of claim 1 , wherein the substrate includes a substantially circular body portion and a tab extending from a periphery of the body portion to facilitate a user to handle the medical sensor.

8. The medical sensor of claim 1 , wherein the flexible circuit layer further includes a plurality of conductive traces provided on the substrate, the substrate includes a substantially circular body portion and a tail portion extending from a periphery of the body portion, the electrode pattern is provided on the body portion, the plurality of conductive traces are provided on and extending along the tail portion, and the plurality of conductive traces is adapted to be electrically connected to the monitoring device.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2023
From: JOHNSON ELECTRIC INTERNATIONAL AG
To: JOHNSON MEDTECH LLC
Reel/Frame 063049/0661 →
MERGER AND CHANGE OF NAME Recorded Jan 8, 2019
From: JOHNSON ELECTRIC S.A.; JOHNSON ELECTRIC INTERNATIONAL AG
To: JOHNSON ELECTRIC INTERNATIONAL AG
Reel/Frame 047931/0603 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2018
From: NELSON, SCOTT; KOLENDA, RICHARD; ZHANG, LI BING
To: JOHNSON ELECTRIC S.A.
Reel/Frame 046667/0112 →