Nitride semiconductor epitaxial substrate and semiconductor device
View Patent ↗There is provided a nitride semiconductor epitaxial substrate, including: a substrate; a first nitride semiconductor layer formed on the substrate, as an electron transit layer in which two-dimensional electron gas exists; and a second nitride semiconductor layer formed on the first nitride semiconductor layer, as an electron supply layer, wherein the second nitride semiconductor layer includes a portion in which a hydrogen concentration is higher than that of the first nitride semiconductor layer and a difference of the hydrogen concentration from that of the first nitride semiconductor layer is 2×10 18 cm −3 or less.
1. A nitride semiconductor epitaxial substrate, comprising:
a substrate;
a first nitride semiconductor layer formed on the substrate, as an electron transit layer in which two-dimensional electron gas exists; and
a second nitride semiconductor layer formed on the first nitride semiconductor layer, as an electron supply layer,
wherein in the whole second nitride semiconductor layer, a hydrogen concentration is higher than a hydrogen concentration of the first nitride semiconductor layer and a difference of the hydrogen concentration of the second nitride semiconductor layer from the hydrogen concentration of the first nitride semiconductor layer is 2×10 18 cm −3 or less.
2. The nitride semiconductor epitaxial substrate according to claim 1 , wherein the second nitride semiconductor layer includes a portion in which the difference of the hydrogen concentration from the hydrogen concentration of the first nitride semiconductor layer is 8×10 17 cm −3 or less.
3. The nitride semiconductor epitaxial substrate according to claim 1 , wherein the second nitride semiconductor layer includes a portion in which the difference of the hydrogen concentration from the hydrogen concentration of the first nitride semiconductor layer is 3×10 17 cm −3 or more.
4. The nitride semiconductor epitaxial substrate according to claim 1 , wherein the second nitride semiconductor layer has an interface region which is a portion having a thickness of 0.5 nm to 2 nm from an interface with the first nitride semiconductor layer,
a hydrogen concentration in the interface region is 8×10 17 to 3×10 18 cm −3 .
5. The nitride semiconductor epitaxial substrate according to claim 4 , wherein the interface region is a portion whose thickness is at least 1 nm from the interface with the first nitride semiconductor layer, and a difference of the hydrogen concentration between the interface region and the first nitride semiconductor layer is 3×10 17 cm −3 or more.
6. A semiconductor device, comprising:
a nitride semiconductor epitaxial substrate according to claim 1 ; and
a source electrode, a drain electrode, and a gate electrode, which are formed on an upper side of the nitride semiconductor epitaxial substrate.