Optical fiber alignment device

1. A photonic integrated chip (PIC) assembly comprising:

a PIC, including:

a substrate;

an electronic or opto-electronic component mounted on the substrate;

an optical waveguide in an optical waveguide layer mounted on the substrate; and

first alignment features;

an optical fiber alignment device mounted on the PIC comprising:

a base;

a groove in said base for receiving a portion of an optical fiber, whereby a core of the optical fiber is aligned with a core of the optical waveguide of the PIC; and

second alignment features for abutting the first alignment features;

wherein one of the first or second alignment features comprise openings down to corresponding hard stops;

wherein the other of the first or second alignment features comprises pillars extending into the openings abutting the hard stops; and

wherein the first or second alignment features comprise an array of pillars on each side of the electronic or opto-electronic component.

2. The assembly according to claim 1 , wherein the first alignment features comprise openings in the PIC down to corresponding hard stops; and wherein the second alignment features comprise pillars extending from the optical fiber alignment device into the openings abutting the corresponding hard stop.

3. The assembly according to claim 2 , wherein each the hard stop comprises the optical waveguide layer.

4. The assembly according to claim 1 , wherein each opening is substantially wider than each corresponding pillar, enabling horizontal (X-Y) alignment.

5. The assembly according to claim 1 , further comprising:

first bonding pads mounted in recesses on the base; and

second bonding pads on the PIC for bonding with the first bonding pads via a bonding material disposed therebetween; and

whereby excess adhesive material is trapped in the recesses during and after assembly.

6. The assembly according to claim 1 , further comprising a trough extending from an outer free end of the groove for collecting excess material used to bond the optical fiber in the groove.

7. The assembly according to claim 1 , further comprising a cavity in the base for receiving the electronic or opto-electronic component extending from the PIC.

8. The assembly according to claim 7 , wherein the electronic or opto-electronic component comprises an array of lasers;

wherein the PIC includes a plurality of additional waveguides in the waveguide layer optically coupled to the array of lasers; and

wherein the optical fiber alignment device includes a plurality of additional grooves in the base for a plurality of additional optical fibers optically aligned with the plurality of additional waveguides.

9. The assembly according to claim 7 , further comprising a hermetically sealable material surrounding an opening to the cavity for hermetically sealing the electronic or opto-electronic component within the cavity.

10. The assembly according to claim 7 , further comprising a ground connection between the cavity in the base and the electronic or opto-electronic component extending from the PIC, for grounding the electronic or opto-electronic component to the fiber alignment device.

11. A method of aligning an optical fiber to an optical waveguide on a photonic optical chip (PIC) comprising:

providing an optical fiber alignment device for aligning the optical fiber with the optical waveguide on the photonic integrated circuit (PIC) comprising:

a base;

a groove in said base for receiving a portion of the optical fiber, whereby a core of the optical fiber is aligned with a core of the optical waveguide of the PIC;

first alignment features;

providing the PIC, comprising:

a substrate;

an electronic or opto-electronic component mounted on the substrate;

the optical waveguide in an optical waveguide layer mounted on the substrate;

second alignment features for abutting with the first alignment features;

wherein one of the first or second alignment features comprise openings down to corresponding hard stops;

wherein the other of the first or second alignment features comprises pillars extending into the openings abutting the hard stops;

wherein the first or second alignment features comprise an array of pillars on each side of the electronic or opto-electronic component;

mounting the optical fiber alignment device on the PIC with the first alignment features aligned with the corresponding second alignment features;

aligning the optical fiber with the optical waveguide; and

fixing the optical fiber alignment device to the PIC.

12. The method according to claim 11 , wherein each opening is substantially wider than each corresponding pillar, enabling horizontal (X-Y) alignment; and

further comprising aligning the fiber alignment device to the PIC in an X-Y plane.

13. The method according to claim 11 , wherein the first alignment features comprise openings in the PIC down to corresponding hard stops; and wherein the second alignment features comprise pillars extending from the optical fiber alignment device into the openings abutting the corresponding hard stops.

14. The method according to claim 13 , wherein providing the optical fiber alignment device includes etching a top surface of the optical fiber alignment device leaving the pillars.

15. The method according to claim 13 , wherein the hard stops comprise the optical waveguide layer; and

wherein providing the PIC includes etching the openings in the PIC down to the waveguide layer.

16. The method according to claim 11 , wherein the optical fiber alignment device further comprises first bonding pads mounted in recesses in the base; and

wherein the PIC further comprises second bonding pads for bonding with corresponding first bonding pads on the optical fiber alignment device via an adhesive material disposed therebetween; and

wherein the method further comprises activating the adhesive, whereby the adhesive flows and the first alignment features of the fiber alignment device move into contact with the hard stops of the PIC, whereby excess adhesive is trapped in the recesses during activation.