Semiconductor device and fabrication method thereof
A semiconductor device including a connection terminal that is electrically connected to a semiconductor chip, a bus bar with an opening through which the connection terminal passes, and a fusing portion including a jointing portion, which is provided over an upper surface of the bus bar from an upper part of the connection terminal that is positioned above the upper surface of the bus bar by making the connection terminal pass through the opening of the bus bar, is provided.
1. A semiconductor device comprising:
a connection terminal electrically connected to a semiconductor chip;
a bus bar with an opening through which the connection terminal passes; and
a fusing portion including a jointing portion which is provided over an upper surface of the bus bar from an upper part of the connection terminal that is positioned above the upper surface of the bus bar, as the connection terminal passes through the opening of the bus bar, wherein
the jointing portion is a part of the connection terminal that is welded to the bus bar, in a clearance between a side surface of the connection terminal and a side surface of an opening of the bus bar, and
the fusing portion has a non-jointing portion which is a part of the connection terminal that is not welded to the bus bar, and which is positioned opposite to the jointing portion in a direction orthogonal to a length direction of the connection terminal.
2. A semiconductor device comprising:
a connection terminal electrically connected to a semiconductor chip;
a bus bar with an opening through which the connection terminal passes; and
a fusing portion including a jointing portion which is provided over an upper surface of the bus bar from an upper part of the connection terminal that is positioned above the upper surface of the bus bar, as the connection terminal passes through the opening of the bus bar, wherein length from an upper end of the fusing portion to the upper surface of the bus bar is 0.1 mm or longer.
3. A semiconductor device comprising:
a connection terminal electrically connected to a semiconductor chip;
a bus bar with an opening through which the connection terminal passes; and
a fusing portion including a jointing portion which is provided over an upper surface of the bus bar from an upper part of the connection terminal that is positioned above the upper surface of the bus bar, as the connection terminal passes through the opening of the bus bar, wherein length from an upper end of the fusing portion to the upper surface of the bus bar is 0.9 mm or shorter.
4. The semiconductor device according to claim 1 , wherein if the connection terminal and the bus bar are seen from above:
an outline of the connection terminal is partially in a circular shape; and
a sectorial shaped central angle defined by a center and a radius of a circular shape of the connection terminal is between 86 degrees and 287 degrees inclusive, in a region where the fusing portion and the connection terminal overlap each other.
5. The semiconductor device according to claim 1 , wherein if the connection terminal and the bus bar are seen from above:
a ratio of a diameter of the connection terminal to a diameter of an opening of the bus bar is between 0.907 and 0.991 inclusive.
6. The semiconductor device according to claim 1 , wherein the connection terminal includes:
a first body part containing copper material;
a first plated layer which is provided on a surface of the first body part, and which contains nickel material; and
a second plated layer which is provided on a surface of the first plated layer, and which contains tin material.
7. The semiconductor device according to claim 1 , wherein the connection terminal includes a tapered part that is provided from an upper part of the connection terminal to a predetermined height position in a length direction of the connection terminal.
8. The semiconductor device according to claim 1 , wherein the bus bar has a tapered part in its opening, which reduces a diameter of the opening from a lower surface toward the upper surface, at an edge of the lower surface that is opposite to the upper surface.
9. The semiconductor device according to claim 1 , wherein if the bus bar is seen from above, the semiconductor device has the fusing portion on the bus bar, which is provided off-centered from a center of the connection terminal in a certain direction.
10. The semiconductor device according to claim 1 , wherein:
the bus bar includes a convex portion with a connection opening through which a fixing member to fix the bus bar and an external connection terminal passes; and
a top part of the convex portion is positioned above an upper end of the connection terminal.
11. The semiconductor device according to claim 2 , wherein the connection terminal includes:
a first body part containing copper material;
a first plated layer which is provided on a surface of the first body part, and which contains nickel material; and
a second plated layer which is provided on a surface of the first plated layer, and which contains tin material.
12. The semiconductor device according to claim 3 , wherein the connection terminal includes:
a first body part containing copper material;
a first plated layer which is provided on a surface of the first body part, and which contains nickel material; and
a second plated layer which is provided on a surface of the first plated layer, and which contains tin material.
13. The semiconductor device according to claim 2 , wherein the connection terminal includes a tapered part that is provided from an upper part of the connection terminal to a predetermined height position in a length direction of the connection terminal.
14. The semiconductor device according to claim 3 , wherein the connection terminal includes a tapered part that is provided from an upper part of the connection terminal to a predetermined height position in a length direction of the connection terminal.
15. The semiconductor device according to claim 2 , wherein the bus bar has a tapered part in its opening, which reduces a diameter of the opening from a lower surface toward the upper surface, at an edge of the lower surface that is opposite to the upper surface.
16. The semiconductor device according to claim 3 , wherein the bus bar has a tapered part in its opening, which reduces a diameter of the opening from a lower surface toward the upper surface, at an edge of the lower surface that is opposite to the upper surface.
17. The semiconductor device according to claim 2 , wherein if the bus bar is seen from above, the semiconductor device has the fusing portion on the bus bar, which is provided off-centered from a center of the connection terminal in a certain direction.
18. The semiconductor device according to claim 3 , wherein if the bus bar is seen from above, the semiconductor device has the fusing portion on the bus bar, which is provided off-centered from a center of the connection terminal in a certain direction.
19. The semiconductor device according to claim 2 , wherein:
the bus bar includes a convex portion with a connection opening through which a fixing member to fix the bus bar and an external connection terminal passes; and
a top part of the convex portion is positioned above an upper end of the connection terminal.
20. The semiconductor device according to claim 3 , wherein:
the bus bar includes a convex portion with a connection opening through which a fixing member to fix the bus bar and an external connection terminal passes; and
a top part of the convex portion is positioned above an upper end of the connection terminal.