HIGH TEMPERATURE HEAT PLATE PEDESTAL
An assembly, which in one form is a pedestal, includes an upper member, a lower member bonded to the upper member, and a thermal phase diffuser disposed between the upper member and the lower member within a hermetically sealed volume. The thermal phase diffuser diffuses heat by way of a phase change of a working fluid within the hermetically sealed volume. The assembly/pedestal is capable of operating at high temperatures, in excess of 1000° C., with a high degree of temperature uniformity, and in one form is an aluminum nitride (AlN) material.
1 . An assembly comprising:
an upper member;
a lower member; and
a thermal phase diffuser disposed between the upper member and the lower member within a hermetically sealed volume,
wherein the thermal phase diffuser diffuses heat by way of a phase change of a working fluid within the hermetically sealed volume.
2 . The assembly according to claim 1 , further comprising a filling material disposed within a gap between the thermal phase diffuser and the lower member.
3 . The assembly according to claim 2 , wherein the filling material includes a high temperature compressible material.
4 . The assembly according to claim 2 , wherein the filling material is selected from a group consisting of Grafoil, aluminum nitride (AlN) powder, ceramic paste, and flexible graphite/graphene.
5 . The assembly according to claim 1 , further comprising a bonding layer disposed between the upper member and the thermal phase diffuser.
6 . The assembly according to claim 5 , wherein the bonding layer includes a titanium-nickel braze alloy.
7 . The assembly according to claim 1 , wherein the upper member includes an upper wall and a peripheral wall extending downwardly from the upper wall, the thermal phase diffuser being surrounded by the peripheral wall of the upper member.
8 . The assembly according to claim 7 , wherein the lower member is bonded to the peripheral wall of the upper member.
9 . The assembly according to claim 1 , wherein the upper member and the lower member are made of different materials.
10 . The assembly according to claim 1 , wherein the thermal phase diffuser includes a tubular shell having a T-shape cross section.
11 . The assembly according to claim 1 , wherein the thermal phase diffuser further includes a wick structure, the wick structure defining a vapor guiding channel.
12 . The assembly according to claim 11 , wherein vapor of the working fluid flows in the vapor guiding channel and liquid of the working fluid flows along the wick structure and outside the vapor guiding channel.
13 . The assembly according to claim 12 , wherein the vapor of the working fluid flows in a direction perpendicular to the upper member.
14 . The assembly according to claim 1 , wherein the thermal phase diffuser includes a plate portion and a shaft portion extending from a lower surface of the plate portion and being perpendicular to the plate portion.
15 . The assembly according to claim 14 , further comprising a shaft member disposed under the lower member, the filling material also disposed between the shaft member and the shaft portion of the thermal phase diffuser.
16 . The assembly according to claim 1 , wherein the working fluid is selected from a group consisting of liquid helium, mercury, sodium, sulphur, halides, indium, Cesium, NaK, potassium, lithium, sliver, ammonia, alcohol, methanol, ethanol, acetone, methyl alcohol, water, Naphthalene, or other molten materials.
17 . The assembly according to claim 1 , further comprising a resistive heater surrounding a portion of the thermal phase diffuser.
18 . The assembly according to claim 1 , wherein the upper member is bonded to the lower member.
19 . The assembly according to claim 1 , wherein the upper member and the lower member are a single unitized part.
20 . An assembly comprising:
a ceramic substrate defining a hermetically sealed fluid channel containing a working fluid; and
a thermal phase diffuser disposed within the hermetically sealed fluid channel,
the working fluid flowing in the hermetically sealed fluid channel and including a plurality of discrete liquid slugs and vapor bubbles.
21 . The assembly according to claim 20 , wherein the ceramic substrate is Aluminum Nitride (AlN).