Light emitting device and manufacturing method of the light emitting device
A light-emitting device includes: a substrate; a unit light-emitting area disposed on the substrate; first and second electrodes disposed in the unit light-emitting area to be separated from each other; a plurality of rod-shaped LEDs disposed between the first and second electrodes; a reflective contact electrode disposed on opposite ends of the rod-shaped LEDs to electrically connect the rod-shaped LEDs to the first and second electrodes; and a light-transmitting structure disposed between the first and second electrodes and extending to cross the rod-shaped LEDs.
1. A light-emitting device, comprising:
a substrate;
a first electrode and a second electrode disposed on the substrate;
a rod-shaped LED connected between the first and second electrodes on the substrate, the rod-shaped LED having a first end and a second end opposite to the first end;
an insulating pattern disposed between the first and second electrodes on the substrate, the insulating pattern being in contact with the rod-shaped LED; and
a first contact electrode and a second contact electrode respectively disposed on the first and second electrodes, the first and second contact electrodes respectively being in contact with the first and second ends of the rod-shaped LED.
2. The light-emitting device of claim 1 , further comprising an insulating film covering at least a part of an outer circumferential surface of the rod-shaped LED.
3. The light-emitting device of claim 1 , wherein the rod-shaped LED comprises an electrode layer disposed at the second end.
4. The light-emitting device of claim 1 , wherein the rod-shaped LED comprises a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer and an electrode layer sequentially arranged in a direction parallel to the substrate.
5. The light-emitting device of claim 4 , wherein the first conductive semiconductor layer contacts the first contact electrode.
6. The light-emitting device of claim 4 , wherein the electrode layer contacts the second contact electrode.
7. The light-emitting device of claim 4 , wherein the insulating pattern comprises an inorganic material.
8. The light-emitting device of claim 4 , wherein the insulating pattern comprises an organic material.
9. The light-emitting device of claim 4 , wherein the insulating pattern fixes the rod-shaped LED at an aligned position of the rod-shaped LED.
10. The light-emitting device of claim 4 , wherein the insulating pattern is disposed on a same layer as at least a part of the first and second electrodes.
11. The light-emitting device of claim 1 , wherein a part of the insulating pattern is disposed between the substrate and the rod-shaped LED and another part of the insulating pattern is disposed on the rod-shaped LED.
12. The light-emitting device of claim 1 , wherein the first and second electrodes are disposed at a same height.
13. The light-emitting device of claim 1 , wherein the rod-shaped LED is disposed parallel to the substrate.
14. The light-emitting device of claim 1 , wherein the insulating pattern partially covers the rod-shaped LED.
15. The light-emitting device of claim 1 , wherein the insulating pattern protrudes above the rod-shaped LED.
16. The light-emitting device of claim 1 , wherein the insulating pattern comprises an inorganic material.
17. The light-emitting device of claim 1 , wherein the insulating pattern comprises an organic material.
18. The light-emitting device of claim 1 , wherein the insulating pattern fixes the rod-shaped LED at an aligned position of the rod-shaped LED.
19. The light-emitting device of claim 1 , wherein the insulating pattern is disposed on a same layer as at least a part of the first and second electrodes.
20. The light-emitting device of claim 1 , wherein the insulating pattern comprises at least one of a silicon oxide (SiO x ), a silicon nitride (SiN x ) and a silicone resin that comprises scatterers.