IMAGING MODULE
An imaging module allows heated internal gas to escape out of a camera/imaging module when heat is applied to the module during an adhesive curing manufacturing step without making manufacture more difficult due to molding issues. The imaging module includes a lens holder with top and bottom surfaces. The bottom surface defines an opening at a bottom of the lens holder. The opening extends through the inside and outside walls of the lens holder. The opening allows heated internal gas to escape out of a camera/imaging module.
1 . A camera module comprising:
a lens holder comprising a top surface and a bottom surface opposite to the top surface, the bottom surface positioned at a bottom of the lens holder;
wherein an opening is defined in the bottom surface, the opening extends through an inside wall and an outside wall of the lens holder, the opening allows heated internal gas to escape out of the camera module.
2 . The camera module of claim 1 , wherein the opening is rectangular.
3 . The camera module of claim 1 , further comprising a circuit board, wherein the bottom surface is fixed on the circuit board.
4 . The camera module of claim 3 , further comprising an adhesive layer, wherein the adhesive layer is formed between the circuit board and the outer wall of the lens holder, during curing of the adhesive, melted adhesive forms between the circuit board and the lens holder, and the adhesive, when hardened, seals the opening.
5 . The camera module of claim 4 , wherein the circuit board is a flexible circuit board, the camera module further comprises a reinforcing plate, the reinforcing plate is glued to the circuit board by adhesive, and is opposite to the lens holder, the adhesive layer is formed when the reinforcing plate is glued to the circuit board.
6 . The camera module of claim 1 , further comprising at least a lens holder, wherein at least one groove is defined in the top surface, the groove extends through the top surface and the bottom surface, the lens holder is received in the groove.
7 . The camera module of claim 6 , wherein the camera module is selected from one of a fixed-focus camera module, an auto-focus camera module, and a dual-lens camera module.
8 . The camera module of claim 7 , wherein when the camera module is a dual-lens camera module, the lens holder defines two grooves, each groove corresponds to one lens barrel and one image sensor, the two grooves are spaced from each other, and the opening is located at the bottom of the lens holder close to the circuit board, and is located between the two grooves.
9 . The camera module of claim 3 , further comprising an image sensor, wherein the image sensor is fixed on the circuit board, and the circuit board is received in the opening.
10 . The camera module of claim 1 , wherein the lens holder is rectangular and is integrally formed.
11 . A projection module comprising:
a lens holder comprising a top surface and a bottom surface opposite to the top surface, the bottom surface positioned at a bottom of the lens holder, wherein an opening is defined in the bottom surface, the opening extends through an inside wall and an outside wall of the lens holder, the opening allows heated internal gas to escape out of the camera module.
12 . The projection module of claim 11 , wherein the opening is rectangular.
13 . The projection module of claim 11 , further comprising a circuit board, wherein the bottom surface is fixed on the circuit board.
14 . The projection module of claim 13 , further comprising an adhesive layer, wherein the adhesive layer is formed between the circuit board and the outer wall of the lens holder, during curing of the adhesive, melted adhesive forms between the circuit board and the lens holder, and the adhesive, when hardened, seals the opening.
15 . The projection module of claim 14 , wherein the circuit board is a flexible circuit board, the projection module further comprises a reinforcing plate, the reinforcing plate is glued to the circuit board by adhesive, and is opposite to the lens holder, the adhesive layer is formed when the reinforcing plate is glued to the circuit board.
16 . The projection module of claim 11 , further comprising at least a lens holder, wherein at least one groove is defined in the top surface, the groove extends through the top surface and the bottom surface, the lens holder is received in the groove.
17 . The projection module of claim 13 , wherein the projection module comprises a ceramic substrate, a laser emitter, and an electronic component, the ceramic substrate is fixed on the circuit board, the laser emitter and the electronic component are fixed on the ceramic substrate.
18 . The projection module of claim 17 , wherein the lens holder is positioned on the circuit board and covers the ceramic substrate.
19 . The projection module of claim 11 , wherein the lens holder is rectangular and is integrally formed.