IP Library Granted Patent US 10,613,201
Granted Patent B2
US 10,613,201 · App. 16/019,144 · Granted Apr 7, 2020

Three-dimensional lidar sensor based on two-dimensional scanning of one-dimensional optical emitter and method of using same

Inventors: Angus Pacala (San Francisco, CA); Louay Eldada (Sunnyvale, CA)
Assignee: Quanergy Systems, Inc.
G01S7/4817G01S7/4813G01S7/4814G01S17/10G01S17/42G01S17/89
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Quick Facts
Patent No.
US 10,613,201
App. No.
16/019,144
Granted
Apr 7, 2020
Kind
B2
Abstract

An apparatus and method are used for three-dimensional sensing with a time-of-flight lidar sensor having a single emitter sensing in one dimension, at least one photodetector, and a mechanical means of scanning in two dimensions said emitter and at least one photodetector. The external case of the lidar is preferably static, and only internal components involve mechanical motion. In a preferred embodiment of said lidar when operated in the infrared, said external static case has a window that is visually opaque and essentially transparent to infrared radiation.

Claims (3)

1. A time-of-flight lidar apparatus comprising: a) an optical emitter sensing in one dimension, the optical emitter being a laser bar to form a radiation pattern whose envelope is elongated to provide one-dimensional sensing; b) at least one photodetector; c) a spinning turret rotating said emitter and at least one photodetector to provide two-dimensional scanning; and d) an external case that is static to encase the spinning turret, wherein the external static case has a window that is visually opaque and essentially transparent to infrared radiation emitted by the emitter on the spinning turret.

2. The apparatus of claim 1 wherein said at least one photodetector comprises one of a set of elements including but not limited to: a) single-photon avalanche diode arrays; b) avalanche photodiodes; c) positive-intrinsic-negative diodes.

3. The apparatus of claim 1 comprising a plurality of photodetectors in a form selected from a set comprising but not limited to: a) integrated multi-photodetector chip; b) co-packaged photodetector chips; c) photodetection multi-chip module.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 4, 2023
From: QUANERGY SYSTEMS INC.
To: ROLISI LLC
Reel/Frame 065128/0084 →
CHANGE OF NAME Recorded Oct 4, 2023
From: ROLISI, LLC
To: QUANERGY SOLUTIONS, INC.
Reel/Frame 065128/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2018
From: PACALA, ANGUS; ELDADA, LOUAY
To: QUANERGY SYSTEMS, INC.
Reel/Frame 046207/0590 →
Continuity (2)
Continuation 14517948 · Oct 20, 2014
Related Publication 20180306907A1 · Oct 25, 2018
Cited By (2)
US 12,399,278 US 12,399,279