Optical module including heat sink arranged in housing
An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.
1. An optical module, comprising:
a housing;
a heat sink arranged in the housing;
a laser emitter arranged on the heat sink;
a printed circuit board (PCB) partially arranged on the heat sink; and
an optical system arranged in the housing,
wherein
the optical module has an optical interface on one end and an electrical interface on the other end,
the optical system is arranged between the laser emitter and the optical interface,
the PCB is constructed as a rigid board,
the laser emitter is electrically connected to the PCB,
one end of the PCB is fixed on the heat sink and is electrically connected to the laser emitter via a gold wire, and the other end of the PCB is constructed as the electrical interface, and
the optical system transmits light emitted from the laser emitter to the optical interface.
2. The optical module according to claim 1 , wherein
the optical module further comprises an assembly tolerance absorbing assembly arranged at the optical interface,
the assembly tolerance absorbing assembly transmits light emitted from the laser emitter through the optical system to a center of the optical interface or to an external connector connected to the optical module, or the assembly tolerance absorbing assembly transmits light emitted from the laser emitter to the optical system.
3. The optical module according to claim 2 , wherein
the assembly tolerance absorbing assembly comprises an optical element,
the optical element is arranged between the optical system and the optical interface or between the optical system and the laser emitter, and
the optical element is used for realizing a connection of an optical path between the optical system and the optical interface or of an optical path between the optical system and the laser emitter.
4. The optical module according to claim 2 , wherein
the assembly tolerance absorbing assembly comprises an optical fiber that connects between the laser emitter and the optical system, and
the optical fiber transmits light emitted from the laser emitter to the optical system.
5. The optical module according to claim 4 , wherein
the heat sink comprises a first heat sink and a second heat sink,
the optical system is arranged on the first heat sink,
the laser emitter is packaged on the second heat sink, and
an optical fiber fixing element is arranged on each of the first heat sink and the second heat sink.
6. The optical module according to claim 2 , wherein
the assembly tolerance absorbing assembly comprises a connecting port and at least one optical fiber that optically connects the connecting port and the optical interface,
the connecting port is fixed on the heat sink and is located between the optical system and the optical interface, and
the optical fiber transmits light emitted from the optical system to the optical interface.
7. The optical module according to claim 2 , wherein
the assembly tolerance absorbing assembly comprises an adapter that is separately configured from the housing,
the adapter is mated to the optical interface, and
after the adapter and the housing are adjusted into position, they are fixed together by means of glue, screw tightening, or soldering.
8. The optical module according to claim 7 , wherein the optical system, optical interface, and circuit board are all fixed to the heat sink.
9. The optical module according to claim 7 , wherein
the adapter is connected to the housing along a direction parallel to a plugging direction of the optical interface, and
a gap for adjustment exists between the adapter and housing in all directions perpendicular to the plugging direction.
10. The optical module according to claim 1 , wherein
the optical module further comprises a driver that is used to drive the laser, and
the driver is packaged on the heat sink or the PCB.
11. The optical module according to claim 1 , wherein
the optical interface comprises a transmitting-end optical interface and a receiving-end optical interface,
light emitted from the laser is transmitted to the transmitting-end optical interface through the optical system, and
optical signals received by the receiving-end optical interface are transmitted to an optical receiving end through the optical system.
12. An optical module, comprising:
a housing;
a heat sink arranged in the housing;
a laser emitter arranged on the heat sink;
a printed circuit board (PCB) partially arranged on the heat sink; and
an optical system arranged in the housing,
wherein
the optical module has an optical interface on one end and an electrical interface on the other end,
the optical system is arranged between the laser emitter and the optical interface,
the PCB is constructed as a rigid board,
the laser emitter is electrically connected to the PCB,
one end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface,
the optical system transmits light emitted from the laser emitter to the optical interface, and
the optical system is at least partially arranged on the heat sink.