IP Library Granted Patent US 10,418,500
Granted Patent B2
US 10,418,500 · App. 16/025,131 · Granted Sep 17, 2019

Infrared detector, imaging device, and imaging system

Inventors: Ryo Suzuki (Fujisawa, JP); Junichi Kon (Isehara, JP); Hironori Nishino (Isehara, JP)
Assignee: FUJITSU LIMITED
H01L31/035236H01L27/14652H01L31/0304H01L31/03046H01L31/109
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Quick Facts
Patent No.
US 10,418,500
App. No.
16/025,131
Granted
Sep 17, 2019
Kind
B2
Abstract

An infrared detector includes a quantum dot structure, and an electrode that is coupled to the quantum dot structure, wherein the quantum dot structure is obtained by stacking a plurality of structures each including a quantum dot, a first barrier layer under the quantum dot and a second barrier layer over the quantum dot to cover the quantum dots, and an intermediate layer under the first barrier layer, and wherein the first barrier layer includes a first region and a second region having a lower Al concentration than that of the intermediate layer between the first region and the intermediate layer.

Claims (62)

1. An infrared detector comprising:

a quantum dot structure; and

an electrode that is coupled to the quantum dot structure,

wherein the quantum dot structure is obtained by stacking a plurality of structures each including

a quantum dot,

a first barrier layer under the quantum dot and a second barrier layer over the quantum dot to cover the quantum dots, and

an intermediate layer under the first barrier layer, and

wherein the first barrier layer includes a first region and a second region having a lower Al concentration than that of the intermediate layer between the first region and the intermediate layer.

2. The infrared detector according to claim 1 ,

wherein the first region has a larger energy gap than that of the intermediate layer, and the second region has a smaller energy gap than that of the intermediate layer.

3. The infrared detector according to claim 1 ,

wherein the second region has Al a Ga 1-a As (0≤a<1).

4. The infrared detector according to claim 1 ,

wherein the second region has In a Ga 1-a P (0≤a≤1).

5. The infrared detector according to claim 3 ,

wherein the intermediate layer has Al b Ga 1-b As (0<b≤1), and the first region has Al c Ga 1-c As (0<c≤1), where b<c.

6. The infrared detector according to claim 5 ,

wherein the second barrier layer has Al d Ga 1-d As (0<d≤1), where b<d.

7. The infrared detector according to claim 1 ,

wherein the second region has a mixed crystal of one kind or two or more kinds selected from the group consisting of GaAs, InAs, GaSb, InSb, GaP, and InP.

8. The infrared detector according to claim 1 ,

wherein the second barrier layer includes a third region and a fourth region having a lower Al concentration than that of the intermediate layer over an upper portion of the third region.

9. The infrared detector according to claim 1 ,

wherein the first region has a thickness of 2 nm or less.

10. An imaging device comprising:

a plurality of infrared detectors; and

a readout circuit that drives the infrared detectors,

wherein the infrared detector includes

a quantum dot structure, and

an electrode that is coupled to the quantum dot structure,

wherein the quantum dot structure is obtained by stacking a plurality of structures each including

a quantum dot,

a first barrier layer under the quantum dot and a second barrier layer over the quantum dot to cover the quantum dots, and

an intermediate layer under the first barrier layer, and

wherein the first barrier layer includes a first region and a second region having a lower Al concentration than that of the intermediate layer between the first region and the intermediate layer.

11. The imaging device according to claim 10 ,

wherein the second region has Al a Ga 1-a As (0≤a<1).

12. The imaging device according to claim 10 ,

wherein the second region has In a Ga 1-a P (0≤a≤1).

13. An imaging system comprising:

an infrared sensor assembly;

a controller that controls the infrared sensor unit; and

a display that displays a captured infrared image,

wherein the infrared sensor assembly includes

an infrared imaging device,

a cooler that cools the infrared imaging device, and

a lens for incident infrared rays to the infrared imaging device,

wherein the infrared imaging device includes

a plurality of infrared detectors, and

a readout that drives the infrared detectors,

wherein the infrared detector includes

a quantum dot structure, and

an electrode that is coupled to the quantum dot structure,

wherein the quantum dot structure is obtained by stacking a plurality of structures each including

a quantum dot,

a first barrier layer under the quantum dot and a second barrier layer over the quantum dot to cover the quantum dots, and

an intermediate layer under the first barrier layer, and

wherein the first barrier layer includes a first region and a second region having a lower Al concentration than that of the intermediate layer between the first region and the intermediate layer.

14. The imaging system according to claim 13 ,

wherein the second region has Al a Ga 1-a As (0≤a<1).

15. The imaging system according to claim 13 ,

wherein the second region has In a Ga 1-a P (0≤a≤1).

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2018
From: SUZUKI, RYO; KON, JUNICHI; NISHINO, HIRONORI
To: FUJITSU LIMITED
Reel/Frame 046465/0455 →
Priority Claims (1)
JP 2017-137313 · Jul 13, 2017 · national
Continuity (1)
Related Publication 20190019907A1 · Jan 17, 2019