IP Library Patent Application 16025915
Patent Application
App. No. 16/025,915

THREE-DIMENSIONAL PRINTING IN REAL TIME

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Quick Facts
Patent No.
US None
App. No.
16/025,915
Abstract

The present disclosure provides three-dimensional (3D) printing methods, apparatuses, systems, and non-transitory computer-readable medium. The disclosure delineates real time manipulation of three-dimensional printing to reduce deformation. The present disclosure further provides 3D object formed using the methods, apparatuses, and systems.

Claims (46)

1 . A system for forming at least one three-dimensional object, comprising:

an energy source configured to generate an energy beam that impinges on a target surface and transforms a pre-transformed material to a transformed material to form the at least one three-dimensional object;

a plurality of sensors configured to sense at least two signal types from the group consisting of (i) a temperature at the target surface, (ii) a power of the energy source, and (iii) a position of a footprint of the energy beam at the target surface; and

a controller operatively coupled to the plurality of sensors, which controller comprises an electronic circuitry chip configured to dynamically adjust formation of the at least one three-dimensional object in real time by considering the at least two signals sensed by the at least two signal types.

2 . The system of claim 1 , wherein the controller is operatively coupled to the energy source and is configured to adjusts the power and/or temperature of the energy source during formation of the at least one three-dimensional object.

3 . The system of claim 1 , wherein the system further comprise a scanner configured to translate the energy beam across the target surface, wherein the controller is operatively coupled to the scanner and adjusts the scanner to alter a position of the energy source during formation of the at least one three-dimensional object.

4 . The system of claim 1 , wherein the controller is operatively coupled to the energy source and is configured to direct the energy source to generate the energy beam to transform the pre-transformed material to form the at least one three-dimensional object.

5 . The system of claim 1 , wherein the plurality of sensors are further configured to sense a height of the target surface.

6 . The system of claim 5 , wherein the system further comprise a layer dispenser configured to dispense a layer of pre-transformed material to form a material bed, wherein the controller is operatively coupled to at least one component of the layer dispenser and is configured to adjusts the at least one component of the layer dispenser while considering the height of the target surface.

7 . The system of claim 6 , wherein the plurality of sensors sense the height of the target surface in real time, and wherein the controller controls the at least one component of the layer dispenser in real time during formation of the at least one three-dimensional object.

8 . The system of claim 1 , wherein real time is during formation of a layer that is formed as part of the three-dimensional object.

9 . The system of claim 1 , wherein the at least one three-dimensional object is a plurality of three-dimensional objects that is formed in a material bed.

10 . The system of claim 1 , wherein the controller comprises a feedback or feed-forward control.

11 . The system of claim 1 , wherein the electronic circuitry chip comprises an integrated circuit chip.

12 . The system of claim 1 , wherein the electronic circuitry chip comprise at least one portion that is programmable.

13 . The system of claim 1 , wherein the electronic circuitry chip comprises a plurality of cores.

14 . The system of claim 1 , wherein the electronic circuitry chip has a memory clock speed, and wherein the at least two signals are processed by the controller according to the memory clock speed.

15 . The system of claim 1 , wherein the electronic circuitry chip comprises a graphical processing unit (GPU), system-on-chip (SOC), application specific integrated circuit (ASIC), application specific instruction-set processor (ASIPs), programmable logic device (PLD), or field programmable gate array (FPGA).

16 . The system of claim 1 , wherein the controller is configured to direct the energy source to generate the energy beam to transform the pre-transformed material to form the at least one three-dimensional object in a manner such that, upon formation, the at least one three-dimensional object deviates from at least one requested three-dimensional object at a fundamental length scale (FLS) of the at least one three-dimensional object by at most 50+FLS/2500 micrometers.

17 . A system for forming at least one three-dimensional object, comprising:

an energy source configured to generate an energy beam that impinges on a target surface and transforms a pre-transformed material to a transformed material by temperature elevation to form the at least one three-dimensional object;

a scanner configured to direct the energy beam across the target surface; and

a controller operatively coupled to the energy beam and the scanner, which controller comprises an electronic circuitry chip configured to dynamically adjust at least two of (i) the temperature at the target surface, (ii) a power of the energy source, and (iii) a position of a footprint of the energy beam at the target surface in real time during formation of the at least one three-dimensional object.

18 . The system of claim 17 , wherein the system further comprise a layer dispenser configured to dispense a layer of pre-transformed material to form a material bed, wherein the controller is operatively coupled to at least one component of the layer dispenser and is configured to adjusts the at least one component of the layer dispenser while considering a height of the target surface.

19 . The system of claim 17 , wherein real time is during formation of a layer that is formed as part of the three-dimensional object.

20 . The system of claim 17 , wherein the at least one three-dimensional object is a plurality of three-dimensional objects that is formed in a material bed.

21 . The system of claim 17 , wherein the controller comprises a feedback or feed-forward control.

22 . The system of claim 17 , wherein the electronic circuitry chip comprises an integrated circuit chip.

23 . The system of claim 17 , wherein the electronic circuitry chip comprise at least one portion that is programmable.

24 . The system of claim 17 , wherein the electronic circuitry chip comprises a plurality of cores.

25 . The system of claim 17 , wherein the electronic circuitry chip has a memory clock speed, and wherein the at least two signals are processed by the controller according to the memory clock speed.

26 . The system of claim 17 , wherein the electronic circuitry chip comprises a graphical processing unit (GPU), system-on-chip (SOC), application specific integrated circuit (ASIC), application specific instruction-set processor (ASIPs), programmable logic device (PLD), or field programmable gate array (FPGA).

27 . The system of claim 17 , wherein the controller is configured to direct the energy source to generate the energy beam to transform the pre-transformed material to form the at least one three-dimensional object in a manner such that, upon formation, the at least one three-dimensional object deviates from at least one requested three-dimensional object at a fundamental length scale (FLS) of the at least one three-dimensional object by at most 50+FLS/2500 micrometers.

28 . A method for forming at least one three-dimensional object, comprising:

(a) irradiating an energy beam at a target surface to transform a pre-transformed material to a transforming material to form at least a portion of the at least one three-dimensional object; and

(b) using a controller comprising an electronic circuitry chip to dynamically control formation of the at least one three-dimensional object in real time by considering in the electronic circuitry chip at least two of (i) a temperature at the target surface, (ii) a power of an energy source that generates the energy beam, and (iii) a position of a footprint of the energy beam at the target surface, wherein real time is during formation of the at least one three-dimensional object.

29 . The method of claim 28 , wherein real time is during formation of a layer as part of the three-dimensional object.

30 . The method of claim 28 , further comprising using a controller to adjust at least one component of a layer dispenser while considering a height of the target surface.

31 . The method of claim 28 , wherein the at least one three-dimensional object is a plurality of three-dimensional objects that is formed in a material bed.

32 . The method of claim 28 , wherein the control comprises a feedback or a feed-forward control scheme.

33 . The method of claim 28 , wherein the electronic circuitry chip comprises an integrated circuit chip.

34 . The method of claim 28 , wherein the electronic circuitry chip comprise at least one portion that is programmable.

35 . The method of claim 28 , wherein the electronic circuitry chip comprises a plurality of cores.

36 . The method of claim 28 , wherein the electronic circuitry chip has a memory clock speed, and wherein the at least two signals are processed by the controller according to the memory clock speed.

37 . The method of claim 28 , wherein the electronic circuitry chip comprises a graphical processing unit (GPU), system-on-chip (SOC), application specific integrated circuit (ASIC), application specific instruction-set processor (ASIPs), programmable logic device (PLD), or field programmable gate array (FPGA).

38 . The method of claim 28 , further comprising using controller to direct the formation of the at least one three-dimensional object in a manner such that, upon formation, the at least one three-dimensional object deviates from at least one requested three-dimensional object at a fundamental length scale (FLS) of the at least one three-dimensional object by at most 50+FLS/2500 micrometers.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Sep 8, 2023
From: SILICON VALLEY BANK, A DIVISION OF FIRST- CITIZENS BANK & TRUST COMPANY (SUCCESSOR BY PURCHASE TO THE FEDERAL DEPOSIT INSURANCE CORPORATION AS RECEIVER FOR SILICON VALLEY BRIDGE BANK, N.A. (AS SUCCESSOR TO SILICON VALLEY BANK))
To: VELO3D, INC.
Reel/Frame 064845/0523 →
RELEASE OF SECURITY INTEREST Recorded Sep 8, 2023
From: SILICON VALLEY BANK, A DIVISION OF FIRST- CITIZENS BANK & TRUST COMPANY (SUCCESSOR BY PURCHASE TO THE FEDERAL DEPOSIT INSURANCE CORPORATION AS RECEIVER FOR SILICON VALLEY BRIDGE BANK, N.A. (AS SUCCESSOR TO SILICON VALLEY BANK))
To: VELO3D, INC.
Reel/Frame 064845/0840 →
SECURITY INTEREST Recorded May 17, 2021
From: VELO3D, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AND COLLATERAL AGENT
Reel/Frame 056259/0328 →
SECURITY INTEREST Recorded May 17, 2021
From: VELO3D, INC.
To: SILICON VALLEY BANK, AS ADMINISTRATIVE AND COLLATERAL AGENT
Reel/Frame 056259/0341 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2019
From: BULLER, BENYAMIN; LAPPAS, TASSO; MENDELSBERG, RUEBEN; KOREPANOV, SERGEY
To: VELO3D, INC.
Reel/Frame 048157/0913 →